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Wear-resisting epoxy resin composite material for chip bonding agent and manufacture method thereof

A technology of epoxy resin and composite materials, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of mass transfer and heat transfer, heat softening, poor insulation, etc., and achieve single performance and dispersion The effect of low and small molecular weight

Inactive Publication Date: 2015-01-28
HEFEI DINGYA FURNITURE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, epoxy resin is used as the matrix of composite materials, showing many problems, such as low hardness, poor insulation, softening by heat, easy delamination, difficult mass and heat transfer, and strong odor. It is necessary to improve the preparation process of epoxy resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The wear-resistant epoxy resin composite material for chip adhesive is characterized in that it is made of the following raw materials in parts by weight: epoxy resin 62, tourmaline powder 1, soda ash 4, antimony trioxide 3 -5, castor oil 5, ethylene bisstearamide 3.2, ethylene glycol monobutyl ether 7, menthol 6, polyvinylpyrrolidone 0.4, glyceryl tristearate 3.8, glycidyl methacrylate 10, Ethanolamine 3.6, hydrogenated rosin ester 5.3, trimellitic anhydride 8, additive 4.

[0014] The auxiliary agent is made of the following raw materials in parts by weight: imidazoline 0.6, 2-mercaptobenzothiazole 1.2, benzoic acid 5, ethylene glycol butyl ether 15, linseed oil 6, calcium stearate 1.2, sodium octaborate 0.7 , locust bean gum 2, dioctyl sebacate 8, nano-titanium dioxide 1, coconut oil fatty acid diethanolamide 4, the preparation method is: grind nano-titanium dioxide, imidazoline, linseed oil, sodium octaborate for 10-20 minutes with ultrasonic Disperse in ethylene g...

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PUM

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Abstract

The invention discloses wear-resisting epoxy resin composite material for chip bonding agent. The material is characterized by being prepared through the following raw materials in parts by weight: 55 to 63 parts of epoxy resin, 1 to 3 parts of tourmaline powder, 2 to 4 parts of sodium carbonate, 3 to 5 parts of antimonous oxide, 5 to 8 parts of castor seed oil, 2.1 to 3.2 parts of ethylene bis stearamide, 7 to 9 parts of ethylene glycol monobutyl ether, 6 to 8 parts of menthol, 0.4 to 0.7 parts of polyvinylpyrrolidone, 3.4 to 5.2 parts of glyceryl tristearate, 7 to 10 parts of glycidyl methacrylate, 2.1 to 3.6 parts of ethanol amine, 3.1 to 5.3 parts of hydrogenated wood rosin glycerol ester, 8 to 10 parts of trimellitic anhydride, and 3 to 6 parts of assistant. The material is simple in preparation technology, convenient to operate, effectively solves the problem that the traditional epoxy resin is single in performance, and has the advantages of low dispersity, small molecular weight, good ultraviolet resistance and yellowing resistance, wear resistance, uneasiness in deformation, and the like.

Description

technical field [0001] The invention relates to the field of polymer composite materials, in particular to a wear-resistant epoxy resin composite material used for chip adhesives and a manufacturing method thereof. Background technique [0002] Epoxy resins generally refer to organic compounds containing two or more active epoxy groups in the molecule, which can cross-link with various types of curing agents to form insoluble and infusible three-dimensional network structures. polymers. With excellent electrical insulation, mechanical, bonding, chemical corrosion resistance and good physical and chemical properties, it is widely used as laminates, adhesives, coatings, etc., and is more and more popular in the fields of ships, automobiles, aerospace, etc. Pay attention to. [0003] At present, epoxy resin is used as the matrix of composite materials, showing many problems, such as low hardness, poor insulation, softening by heat, easy delamination, difficult mass and heat t...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
Inventor 何宗发
Owner HEFEI DINGYA FURNITURE