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Strong-thixotropy low dielectric epoxy resin composite material and manufacturing method thereof

An epoxy resin and composite material technology, applied in the field of polymer composite materials, can solve the problems of difficult mass transfer and heat transfer, poor insulation, softening by heat, etc., and achieve the effects of single performance, good thixotropy, and low electricity saving coefficient.

Inactive Publication Date: 2015-01-14
HEFEI DINGYA FURNITURE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, epoxy resin is used as the matrix of composite materials, showing many problems, such as low hardness, poor insulation, softening by heat, easy delamination, difficult mass and heat transfer, and strong odor. It is necessary to improve the preparation process of epoxy resin

Method used

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Embodiment Construction

[0013] The low-dielectric epoxy resin composite material with strong thixotropy is characterized in that it is made of the following raw materials in parts by weight: E-51 type epoxy resin 53, sericite powder 1, polyamide wax 8, Sodium silicate 0.6, benzyl glycidyl ether 23, acetic acid 9, 2,2'-diaminoethylene glycol diphenyl ether 10, tert-butyl hydroperoxide 3, 2,2-dibromo-3-azopropane Amide 2, dodecyl alcohol ester 9, trimellitic anhydride 7, additive 6.

[0014] The auxiliary agent is made of the following raw materials in parts by weight: imidazoline 0.6, 2-mercaptobenzothiazole 1.2, benzoic acid 5, ethylene glycol butyl ether 15, linseed oil 6, calcium stearate 1.2, sodium octaborate 0.7 , locust bean gum 2, dioctyl sebacate 8, nano-titanium dioxide 1, coconut oil fatty acid diethanolamide 4, the preparation method is: grind nano-titanium dioxide, imidazoline, linseed oil, sodium octaborate for 10-20 minutes with ultrasonic Disperse in ethylene glycol butyl ether, then ...

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Abstract

The invention discloses a strong-thixotropy low dielectric epoxy resin composite material, which is characterized by being prepared from the following raw materials in parts by weight: 50-56 parts of an E-51 epoxy resin, 1-3 parts of sericite powder, 4-8 parts of polyamide wax, 0.6-0.9 part of sodium silicate, 20-24 parts of benzyl glycidyl ether, 9-12 parts of an acetic acid, 10-13 parts of 2-[2-(2-aminophenoxy)ethoxy]phenylamine, 3-5 parts of tert-butyl hydroperoxide, 1-2 parts of 2-dibromo-3-nitrilopropionamide, 7-9 parts of 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate, 6-9 parts of trimellitic anhydride, and 3-6 parts of an additive. A preparation process of the composite material disclosed by the invention is simple and easy to operate, and a problem that existing traditional epoxy resins are simple in performance is effectively solved; the epoxy resin disclosed by the invention has the advantages of good thixotropy, strong shock resistance, corrosion resistance, aging resistance, low power saving coefficient and the like; and prepregs prepared by using the epoxy resin are non-caked, and prepared copper-clad plates have relatively low dielectric coefficients and dielectric loss, so that the distortion rate in the process of signal transmission can be reduced.

Description

technical field [0001] The invention relates to the field of polymer composite materials, in particular to a low-dielectric epoxy resin composite material with strong thixotropy and a manufacturing method thereof. Background technique [0002] Epoxy resins generally refer to organic compounds containing two or more active epoxy groups in the molecule, which can cross-link with various types of curing agents to form insoluble and infusible three-dimensional network structures. polymers. With excellent electrical insulation, mechanical, bonding, chemical corrosion resistance and good physical and chemical properties, it is widely used as laminates, adhesives, coatings, etc., and is more and more popular in the fields of ships, automobiles, aerospace, etc. Pay attention to. [0003] At present, epoxy resin is used as the matrix of composite materials, showing many problems, such as low hardness, poor insulation, softening by heat, easy delamination, difficult mass and heat tr...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L77/00C08K13/06C08K9/04C08K3/22C08K3/38C08K3/34C08K5/1515C08K5/09C08K5/17C08K5/14C08K5/1539
Inventor 何宗发
Owner HEFEI DINGYA FURNITURE
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