Surface processing method of circuit board

A surface treatment and circuit board technology, which is applied in the secondary treatment of printed circuits, the improvement of the metal adhesion of insulating substrates, printed circuits, etc., can solve the problems of easy damage, falling off, and small bonding force of the bonding force

Inactive Publication Date: 2015-01-28
深圳华祥荣正电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding force between the copper foil and the resist in these two methods belongs to the secondary valence force, and the bonding force is very small; and the resist in the second method has a high content of tackifie

Method used

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  • Surface processing method of circuit board
  • Surface processing method of circuit board
  • Surface processing method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] The surface treatment steps of the circuit board of the present embodiment are as follows:

[0067] (1) Use a nylon needle brush to polish the circuit board to clean and roughen the surface of the circuit board.

[0068] (2) At room temperature, use an acidic solution to horizontally spray the circuit board, wherein the acidic solution is: 20 grams per liter of sodium persulfate, 40 grams per liter of sulfuric acid, 15 grams per liter of copper ions and water; then at room temperature, Rinse the circuit board with tap water horizontally to remove the acidic solution adhering to the circuit board; then at 45°C, use an alkaline solution to horizontally spray the circuit board to remove grease, fingerprints and organic matter on the copper foil, among which alkaline The solution is: sodium hydroxide 10 g / L, sodium phosphate 60 g / L, potassium carbonate 40 g / L and water; finally, use tap water to horizontally spray the circuit board to remove the alkaline solution adhering t...

Embodiment 2

[0076] The surface treatment steps of the circuit board of the present embodiment are as follows:

[0077] (1) Use a nylon needle brush to polish the circuit board to clean and roughen the surface of the circuit board.

[0078] (2) At room temperature, use an acidic solution to horizontally spray the circuit board, wherein the acidic solution is: 20 grams per liter of sodium persulfate, 40 grams per liter of sulfuric acid, 0.1 gram per liter of copper ion and water; then at room temperature, Rinse the circuit board with tap water horizontally to remove the acidic solution adhering to the circuit board; then at 55°C, use an alkaline solution to horizontally spray the circuit board to remove grease, fingerprints and organic matter on the copper foil, among which alkaline The solution is: 20 g / L sodium hydroxide, 40 g / L sodium phosphate, 60 g / L potassium carbonate and water; finally, use tap water to horizontally spray the circuit board to remove the alkaline solution adhering to...

Embodiment 3

[0086] The surface treatment steps of the circuit board of the present embodiment are as follows:

[0087] (1) Use a nylon needle brush to polish the circuit board to clean and roughen the surface of the circuit board.

[0088] (2) At room temperature, use an acidic solution to horizontally spray the circuit board, wherein the acidic solution is: 30 grams per liter of sodium persulfate, 25 grams per liter of sulfuric acid, 8 grams per liter of copper ion and water; then at room temperature, Rinse the circuit board with tap water horizontally to remove the acidic solution adhering to the circuit board; then at 50°C, use an alkaline solution to horizontally spray the circuit board to remove grease, fingerprints and organic matter on the copper foil, among which alkaline The solution is: sodium hydroxide 15 g / L, sodium phosphate 50 g / L, potassium carbonate 50 g / L and water; finally, use tap water to horizontally spray the circuit board to remove the alkaline solution adhering to ...

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PUM

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Abstract

The invention discloses a surface processing method of a circuit board. The method comprises the following steps: arranging the circuit board in a browning liquid so as to enable an organic copper conversion film to be formed on the surface of the copper foil of the circuit board; printing a resistive agent on the copper foil of the circuit board, then under an exposure condition, performing ultraviolet ray irradiation, and then baking the circuit board for 40 to 45 minutes at a temperature of 70 DEG C to 80 DEG C; and then forming a line pattern on the circuit board, and next, baking the circuit board at a temperature of 145 DEG C to 155 DEG C for solidification, wherein the resistive agent is epoxy resin printing ink. The surface processing method of the circuit board can effectively solve the problems of foaming and falling of the resistive agent on the circuit board.

Description

technical field [0001] The invention belongs to the field of circuit board manufacture, and in particular relates to a surface treatment method of a circuit board. Background technique [0002] The current circuit boards are prone to resist foaming and oil loss during the electroless tin plating process and subsequent mounting process. In order to solve the above problems, it is necessary to enhance the bonding force between the copper foil and the resist. There are two traditional ways to enhance the bonding force between copper foil and resist, one is to increase the surface roughness of copper foil, thereby increasing the contact area to improve the mechanical connection force between copper foil and resist; One method is to add a tackifier to the resist, so as to increase the hydrogen bond effect between the resist and the copper foil to increase the bonding force between the two. However, the bonding force between the copper foil and the resist in these two methods bel...

Claims

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Application Information

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IPC IPC(8): H05K3/38C23C22/02
CPCH05K3/385C23C22/02
Inventor 姚国庆
Owner 深圳华祥荣正电子有限公司
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