Method for preparing electronic conductive micro-sphere for producing anisotropic conductive film by simply absorbing metal palladium ions

A technology of anisotropic conductive film and metal palladium, which is applied in the field of preparing conductive microspheres, can solve the problems of inappropriateness and aging resistance, and achieve the effects of simplified adsorption, smooth surface gold layer, and simple preparation method

Active Publication Date: 2015-02-11
SHENZHEN FISHER NEW MATERIALS CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the above-mentioned patents use uncrosslinked polymer microspheres,

Method used

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  • Method for preparing electronic conductive micro-sphere for producing anisotropic conductive film by simply absorbing metal palladium ions
  • Method for preparing electronic conductive micro-sphere for producing anisotropic conductive film by simply absorbing metal palladium ions
  • Method for preparing electronic conductive micro-sphere for producing anisotropic conductive film by simply absorbing metal palladium ions

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preparation example Construction

[0042] The invention proposes a method for preparing conductive microspheres, and the conductive microspheres are the conductive microspheres used in the production of anisotropic conductive films.

[0043] The preparation method of the conductive microspheres comprises the steps of:

[0044] Step 1: Add the monomer, dispersant, initiator and solvent into the reaction vessel and mix evenly, under the protection of inert gas, polymerize at a constant temperature of 50-80°C for 2-24h, centrifuge, wash with water, and dry to obtain polymer bulbs, bulbs The particle size is 400nm - 8μm;

[0045] Step 2: disperse the bulbs obtained in step 1 into an aqueous solution containing a surfactant and a dispersant, and stir evenly with ultrasonic waves to prepare a bulb dispersion;

[0046] Step 3: Dissolving the initiator in the oily liquid of cross-linking agent, active monomer and chain transfer agent mixed in mass proportion, adding a certain mass proportion of surfactant, dispersant ...

preparation Embodiment 2

[0074] Take 0.2 g of the polymer seed balls in Preparation Example 1 and disperse them in 100 g of water, add 1 g of SDS and 3 g of PVP, ultrasonically homogenize them, add them into a three-necked flask and stir evenly to obtain a seed ball dispersion.

[0075] Dissolve 3g of AIBN in 30g of TMPTMA, 15g of AAEM, and 5g of mercaptoethanol, then add 120g of water, 6g of ethanol, and 2.0g of SDS, and stir ultrasonically for 30 minutes to obtain an emulsion.

[0076] The emulsion was added to the bulb dispersion for swelling for 24 hours to obtain a swelling solution.

[0077] The swelling solution was placed in a 90°C water bath for constant temperature polymerization for 5 hours, then washed by centrifugation, and dried in vacuum. White monodisperse cross-linked polymer microspheres with a size of about 9.3 μm were obtained.

[0078] Take 1 g of the white monodisperse crosslinked polymer microspheres obtained above and disperse them in 10 mL of a solution with a mass concentrat...

preparation Embodiment 3

[0083] Take 0.2 g of the polymer seed balls in Preparation Example 1 and disperse them in 300 g of water, add 3 g of SDS and 9 g of PVP, ultrasonically homogenize them, add them into a three-necked flask and stir evenly, to obtain a seed ball dispersion.

[0084] Dissolve 3g of AIBN in 30g of EGDMA, 10g of AAEM, 5g of ST, and 5g of mercaptoethanol, then add 600g of water, 20g of ethanol, and 4.5g of SDS, and stir ultrasonically for 30 minutes to obtain an emulsion.

[0085] Add the emulsion into the bulb dispersion and stir evenly for 24 hours to obtain a swelling solution.

[0086] The swelling solution was placed in a 90°C water bath for constant temperature polymerization for 5 hours, then washed by centrifugation, and dried in vacuum. White monodisperse cross-linked polymer microspheres with a size of about 8.3 μm were obtained.

[0087] Take 1 g of the above-mentioned white monodisperse cross-linked polymer microspheres and disperse them in 10 mL of a solution with a mas...

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Abstract

The invention discloses a method for preparing electronic conductive micro-spheres for producing an anisotropic conductive film by simply absorbing metal palladium ions. The method comprises the following steps of step I, preparing polymer seed balls; step II, preparing seed ball dispersion liquid; step III, preparing emulsion; step IV, adding the emulsion into the seed ball dispersion liquid for swelling to obtain a swelling solution; step V, performing polymerization, centrifuging, cleaning and vacuum drying on the swelling solution, water and surfactant to obtain monodisperse cross-linked polymer micro-spheres; step VI, dispersing the cross-linked polymer micro-spheres in strong oxidizing acid containing palladium chloride, wherein the concentration of the strong oxidizing acid is 0.1-3g/L; performing ultrasonic mixing, centrifuging and washing until the PH value is neutral, and adding a reducing agent for reducing to obtain polymer micro-spheres with high-catalytic-activity palladium; step VII, adding the polymer micro-spheres into electroless plating solution for plating. Compared with the traditional adsorption method for colloid palladium, the method disclosed by the invention has the advantages of fewer steps, high adsorption capacity, good effect and uneasiness for analyzing; the intrusion of tin ions is reduced, and the risk that activating and sensitizing liquid is easy to deteriorate is eliminated.

Description

technical field [0001] The present invention relates to the field of anisotropic conductive film (ACF for short), in particular to a method for preparing conductive microspheres (nickel-plated microspheres, palladium-plated microspheres, silver-plated microspheres, gold-plated microspheres and alloy microspheres) more easily. method. Background technique [0002] The rapid development of the information and communication industry has driven the refinement and integration of electronic circuits. More and more integrated circuits need to be assembled with circuit boards. Traditional tin-lead soldering can no longer meet the requirements. The anisotropic conductive film simplifies the process, improves the reliability, and greatly promotes the development of electronic equipment in the direction of light, thin and small. Anisotropic conductive film (ACF for short) is mainly used for the connection of electronic calculators, liquid crystals, plasmas, display panels of various s...

Claims

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Application Information

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IPC IPC(8): H01B13/00C23C18/28C23C18/42C23C18/32C08F265/04C08F257/02
Inventor 孔翔雨杨常武赵昌后檀林清龚火烘刘呈贵
Owner SHENZHEN FISHER NEW MATERIALS CO LTD
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