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Metal electrode patch production method

A metal electrode and patch technology, applied in the electrical field, can solve the problems of film solution damage, complex process, low yield, etc., and achieve the effect of reducing bonding force, high conductivity and small thickness

Active Publication Date: 2015-02-18
RES INST OF XIAN JIAOTONG UNIV & SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is not only dangerous but also polluted by solvents such as acids and alkalis, the process is complicated, the yield is low, and the film solution is damaged.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1 and comparative example 1 refer to attached Figure 1~4 , in combination with the content of the invention, the embodiments of the present invention will be described in detail.

[0036] Example 1

[0037] Step 1 selects a polysilicon wafer as a supporting substrate. Such as figure 1 As shown, a polysilicon wafer 1 for solar cells is used, and a layer of silicon nitride film is grown on it by PECVD after polishing with a mixture of hydrofluoric acid and nitric acid. The thickness of the silicon nitride film is 100 nm, and then The surface of the silicon nitride film is made hydrophilic by irradiating the surface with ozone for 10 minutes with ultraviolet light.

[0038] Step 2 Printing of electrodes: Use screen printing technology to print silver paste 3 on the surface of the substrate silicon nitride film 2 after the above treatment according to the required electrode pattern, and multiple electrode patterns can be printed at one time; the printing thic...

Embodiment 2

[0049] Embodiment 2 refers to the appended Figure 1~4 , in combination with the content of the invention, the embodiments of the present invention will be described in detail.

[0050] Step 1 Preparation of ceramic support substrate: as figure 1 As shown, a silicon dioxide ceramic substrate 1 is used, the surface is polished into a mirror surface, and a layer of silicon nitride film is grown on it by PECVD method. Here, the thickness of the silicon nitride film is 100nm, and then the surface is treated with ultraviolet light for 10 minutes by irradiating ozone. Make the surface of the silicon nitride film hydrophilic.

[0051] Step 2 Printing of electrodes: Use screen printing technology to print silver paste 3 on the surface of the substrate silicon nitride film 2 after the above treatment according to the required electrode pattern, and multiple coils can be printed at one time; the printing thickness of silver paste is about 35 Micron, the silver content in the silver pa...

Embodiment 3

[0057] A method for preparing a metal electrode patch with high conductivity, comprising the following steps:

[0058] Using high-temperature-resistant nitride silicon nitride ceramics, the surface of silicon nitride ceramics is firstly polished to Ra<0.01, and then the surface of ozone is treated with hydrophilicity, and the silver paste is printed on the surface treated or coated according to the required electrode pattern. On the support substrate, the support substrate printed with the electrode paste is dried at 150°C-220°C, cooled to room temperature, and then sintered at 1200°C at a high temperature; after cooling, the sintered metal electrode is separated from the Glue it off the support substrate, and then paste it on the protective film to form an electrode patch.

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Abstract

The invention provides a high-conductivity metal electrode patch production method. The method includes: selecting a support substrate with at least the surface layer being nitride, and subjecting the support substrate to polishing treatment or surface hydrophilia treatment. The substrate comprises a silicon wafer or refractory ceramics; the silicon wafer comprises a monocrystalline silicon wafer or polycrystalline silicon wafer, and the refractory ceramics comprise oxide-free nitrogen ceramics and oxide ceramics. The suitable materials are selected, a method combining surface coating and surface treatment is utilized, binding force between the electrode and the substrate is lowered greatly, the electrode can be stripped directly with adhesive tape, the stripped surface is quite smooth, and no metal residual is left on the substrate. No organic solution process is related, electrode patches with shapes unlimited can be formed, and the shortcomings of complex procedures and low electric conductivity due to the fact that the electrode is produced on a device directly are overcome.

Description

technical field [0001] The invention relates to the field of electrical technology, in particular to a method for preparing a patch electrode. Background technique [0002] The electrode patch is a metal electrode film that can be pasted freely. With the development of the integration of electronic devices, high-conductivity film electrodes with various shapes and easy assembly by pasting can be applied to many electronic devices: such as coil electrodes in various electronic probes and receivers, and the bottom surface of LED chip assembly Electrodes, etc., can be directly pasted on the substrate with an adhesive film, or can be pasted on the substrate through a conductive film or an insulating film. [0003] In general, thin film electrodes can be prepared by printing or vacuum sputtering or evaporation. The conductive film prepared in vacuum has a uniform thickness and can be very thin, so it saves materials and has high conductivity. However, this method involves vacu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/36
CPCH01L33/005H01L33/36H01L33/48H01L2933/0016
Inventor 张宏徐晓宙徐晓斌王勇王恒海
Owner RES INST OF XIAN JIAOTONG UNIV & SUZHOU
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