Flux composition, liquid flux, resin flux cored solder, and solder paste
A technology of flux and composition, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of insufficient oxide film removal, weak activation ability of flux, poor welding performance, etc., to improve welding performance. properties, corrosion inhibition, and reaction inhibition effects
Inactive Publication Date: 2015-02-18
SENJU METAL IND CO LTD
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[0046] The fluxes of Examples and Comparative Examples were prepared according to the compositions shown in the following tables, and solderability, corrosion, and wettability were examined. In Examples and Comparative Examples, liquid flux obtained by dissolving a flux composition with a solvent was used. In addition, the combination rate of each example is the mass % in a flux composition. First, evaluation methods and conditions for each test will be described.
[0047] (1) Inspection of weldability
[0048] (a) Evaluation method
[0049] Place a solder ring on an aluminum plate, apply flux, heat and dissolve the solder, and check wettability.
[0050] (b) Evaluation conditions
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Provided is a flux composition which is capable of removing an oxide film that is formed on the surface of aluminum, and which does not require cleaning of the flux residue. This flux composition contains, as a base material, 65-94% by mass of a resin that is insoluble in water, while containing at least 3-22% by mass of an amine and 1-30% by mass of an amine fluoride salt that serves as a fluorine-based activator and is produced by a reaction between an amine and an acid. It is preferable that the amine contains at least one substance that is selected from among pyridine derivatives, imidazole derivatives, guanidine derivatives, ethyl amines and picoperine. It is also preferable to contain, as the amine fluoride salt, at least one substance that is selected from among amine-boron trifluoride complexes and salts that are formed from any amine compound selected from among pyridine derivatives, imidazole derivatives, guanidine derivatives, ethyl amines and picoperine and any acid selected from among hydrofluoric acid, hydrofluoboric acid and hexafluorosilicic acid.
Description
technical field [0001] The present invention relates to a flux composition for removing metal oxides present on the surface of solder and a metal to be welded, and more particularly to a flux composition capable of removing an oxide film of aluminum as a metal to be welded, using a solvent to Liquid flux obtained by dissolving the flux composition, rosin-core soft solder obtained by enclosing the flux containing the flux composition in solder, and thixotropic agent, solvent, and solder added to the flux composition Powdered solder paste. Background technique [0002] In general, fluxes used in soldering have the effect of removing metal oxides present on the metal surfaces of solder and soldering objects at the temperature at which solder melts to allow metal elements to move at the boundary between the two. [0003] In recent years, instead of wiring made of copper (Cu), wiring made of aluminum (Al) or an aluminum alloy has been proposed. Aluminum welding is known to be d...
Claims
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IPC IPC(8): B23K35/363
CPCB23K35/025B23K35/362B23K35/3605B23K35/3613H05K3/3489H05K3/3463C22C13/00
Inventor 萩原崇史山崎裕之
Owner SENJU METAL IND CO LTD
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