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Preparation method of copper-plated graphene reinforced metal-based composite

A technology of copper-plated graphene and composite materials, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problem of no interface structure design, improve interface wettability, and simplify pretreatment process , low cost effect

Inactive Publication Date: 2015-03-25
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that neither the powder metallurgy method nor the plasma sintering method involved in the above patents has designed the interface structure

Method used

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  • Preparation method of copper-plated graphene reinforced metal-based composite
  • Preparation method of copper-plated graphene reinforced metal-based composite
  • Preparation method of copper-plated graphene reinforced metal-based composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The preparation method of copper-coated graphene reinforced metal matrix composite comprises the following steps:

[0045] (1) Chemically copper-plating the surface of graphene oxide powder to obtain copper-coated graphene powder;

[0046] Graphene oxide powder is prepared by the Hummer method and has a multi-layer hexagonal close-packed graphite structure.

[0047] (2) Mixing copper-coated graphene powder and metal powder by ball milling to obtain copper-coated graphene / metal mixed powder;

[0048]The mass percentage composition of copper-coated graphene powder in the copper-coated graphene / metal mixed powder is 0.1wt%; Ball milling parameter: vacuumize before ball milling, argon or nitrogen protection, ball material ratio 3:1, rotating speed 350r / min, Ball milling time 30min.

[0049] The metal powder is aluminum powder with a particle size of 2 μm.

[0050] (3) Using the powder metallurgy warm-pressing process, the copper-coated graphene / metal mixed powder is warm...

Embodiment 2

[0061] The preparation method of copper-coated graphene reinforced metal matrix composite comprises the following steps:

[0062] (1) Chemically copper-plating the surface of graphene oxide powder to obtain copper-coated graphene powder;

[0063] Graphene oxide powder is prepared by the Hummer method and has a single-layer hexagonal close-packed graphite structure.

[0064] (2) Mixing copper-coated graphene powder and metal powder by ball milling to obtain copper-coated graphene / metal mixed powder;

[0065] The mass percent composition of copper-coated graphene powder in the copper-coated graphene / metal mixed powder is 1wt%; Ball milling parameter: vacuumize before ball milling, argon or nitrogen protection, ball material ratio 3:1, rotating speed 300r / min, ball milling The time is 50 minutes.

[0066] The metal powder is titanium powder with a particle size of 15 μm.

[0067] (3) Using the powder metallurgy warm-pressing process, the copper-coated graphene / metal mixed powd...

Embodiment 3

[0078] The preparation method of copper-coated graphene reinforced metal matrix composite comprises the following steps:

[0079] (1) Chemically copper-plating the surface of graphene oxide powder to obtain copper-coated graphene powder;

[0080] Graphene oxide powder is prepared by the Hummer method and has a multi-layer hexagonal close-packed graphite structure.

[0081] (2) Mixing copper-coated graphene powder and metal powder by ball milling to obtain copper-coated graphene / metal mixed powder;

[0082] The mass percent of copper-coated graphene powder in the copper-coated graphene / metal mixed powder is 10wt%; Ball milling parameters: vacuumize before ball milling, argon or nitrogen protection, ball-material ratio 3:1, rotating speed 250r / min, ball milling The time is 60 minutes.

[0083] The metal powder is copper powder with a particle size of 40 μm.

[0084] (3) Using the powder metallurgy warm-pressing process, the copper-coated graphene / metal mixed powder is warm-pr...

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Abstract

The invention discloses a preparation method of a copper-plated graphene reinforced metal-based composite. The preparation method comprises the following steps: firstly, chemically plating the surfaces of oxidized graphene powder with copper to obtain copper-plated graphene powder; ball-grinding and mixing the copper-plated graphene powder and metal powder to obtain copper-plated graphene / metal mixed powder; and performing warm-pressing forming to the copper-plated graphene / metal mixed powder by adopting powder metallurgy warm-pressing technology, sintering, and performing composite processing and forming by adopting extrusion, forging, rolling and other technologies. The copper-plated graphene powder is adopted as a reinforcing body, the preparation method is simple, the cost is low, the designability is strong, and the copper-plated graphene reinforced metal-based composite which is good in interface binding, high in compactness and good in mechanical performance and thermophysical performance can be obtained.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing copper-coated graphene-reinforced metal matrix composite materials. Background technique [0002] Graphene has a two-dimensional hexagonal lattice structure in which carbon atoms are closely arranged in a single layer of atoms, and is the basic unit of graphite materials. Since its discovery by Geim et al. in 2004, graphene has become a research hotspot in the fields of materials science and physics. The special structure of graphene determines its excellent thermal physical properties, electrical properties and mechanical properties, among which the thermal conductivity is 5000W / (m·℃), and the electrical conductivity is 10 6 S / m, ultimate strength 130GPa, tensile modulus 1.01TPa, surface density 0.77mg / m 2 . In addition, compared with the one-dimensional carbon nanotubes, the graphene on the two-dimensional surface is easier to disperse unif...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C1/10C23C18/40
Inventor 冷金凤
Owner UNIV OF JINAN
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