Carbon glue thick-film resistor sizing
A thick film resistor and paste technology, applied in the field of electronics, can solve the problems of difficult TCR and STOL balance, large resistance value variation, etc., to achieve the effects of low manufacturing cost, improved stability and good performance
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Embodiment 1
[0014] The formula of a kind of carbon glue thick-film resistance slurry of the present embodiment is by mass parts: flame-retardant and temperature-resistant high molecular polymer containing boron element 1; Nano-carbon series conductive filler 0.5; Conductive phase graphite powder 10; Metal alloy powder conductive filler 3; tributyl citrate 0.5; nitrocellulose 0.5; o-methyl novolac epoxy resin 30; silver palladium alloy powder 5; coupling agent 4; novolac resin 20; Glyceryl ether 10; glass-ceramic powder 5.
[0015] The resistance prepared by this embodiment has been tested and analyzed, and it shows that the resistance performance is good.
[0016]
Embodiment 2
[0018] The formula of a kind of carbon glue thick-film resistor slurry of the present embodiment is by mass parts: the flame-retardant and temperature-resistant high molecular polymer containing boron element 5; Nano-carbon series conductive filler 2; Conductive phase graphite powder 15; Metal alloy powder conductive filler 5; tributyl citrate 1; nitrocellulose 1; o-methyl novolac epoxy resin 35; silver palladium alloy powder 10; coupling agent 6; novolak resin 30; ethylene glycol dishrink Glyceryl ether 15; glass-ceramic powder 10.
[0019] The resistance prepared by this embodiment has been tested and analyzed, and it shows that the resistance performance is good.
[0020]
Embodiment 3
[0022] The formula of a kind of carbon glue thick-film resistance slurry of the present embodiment is by mass parts: flame-retardant and temperature-resistant high molecular polymer 3 containing boron element; Nano-carbon series conductive filler 1.5; Conductive phase graphite powder 12; Metal alloy powder conductive filler 4; tributyl citrate 0.6; nitrocellulose 0.6; o-methyl novolak epoxy resin 32; silver palladium alloy powder 5-10; coupling agent 5; novolak resin 25; ethylene glycol diglycidyl ether 13; glass-ceramic powder 7.
[0023] The resistance prepared by this embodiment has been tested and analyzed, and it shows that the resistance performance is good.
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