Carbon glue thick-film resistor sizing

A thick film resistor and paste technology, applied in the field of electronics, can solve the problems of difficult TCR and STOL balance, large resistance value variation, etc., to achieve the effects of low manufacturing cost, improved stability and good performance

Inactive Publication Date: 2015-03-25
CHANGSHU LIANMAO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As one of the issues in the lead-free resistance paste, especially for high-resistance resistance paste, for example, there is a balance between temperature characteristics and withstand voltage characteristics. For example, adding it to the existing lead-based resistance paste The metal oxide used in the material is used to adjust the TCR. When the lead-free component is used as it is, since the resistance value changes due to voltage application compared with the lead-based component, it is difficult to achieve both TCR and STOL.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The formula of a kind of carbon glue thick-film resistance slurry of the present embodiment is by mass parts: flame-retardant and temperature-resistant high molecular polymer containing boron element 1; Nano-carbon series conductive filler 0.5; Conductive phase graphite powder 10; Metal alloy powder conductive filler 3; tributyl citrate 0.5; nitrocellulose 0.5; o-methyl novolac epoxy resin 30; silver palladium alloy powder 5; coupling agent 4; novolac resin 20; Glyceryl ether 10; glass-ceramic powder 5.

[0015] The resistance prepared by this embodiment has been tested and analyzed, and it shows that the resistance performance is good.

[0016]

Embodiment 2

[0018] The formula of a kind of carbon glue thick-film resistor slurry of the present embodiment is by mass parts: the flame-retardant and temperature-resistant high molecular polymer containing boron element 5; Nano-carbon series conductive filler 2; Conductive phase graphite powder 15; Metal alloy powder conductive filler 5; tributyl citrate 1; nitrocellulose 1; o-methyl novolac epoxy resin 35; silver palladium alloy powder 10; coupling agent 6; novolak resin 30; ethylene glycol dishrink Glyceryl ether 15; glass-ceramic powder 10.

[0019] The resistance prepared by this embodiment has been tested and analyzed, and it shows that the resistance performance is good.

[0020]

Embodiment 3

[0022] The formula of a kind of carbon glue thick-film resistance slurry of the present embodiment is by mass parts: flame-retardant and temperature-resistant high molecular polymer 3 containing boron element; Nano-carbon series conductive filler 1.5; Conductive phase graphite powder 12; Metal alloy powder conductive filler 4; tributyl citrate 0.6; nitrocellulose 0.6; o-methyl novolak epoxy resin 32; silver palladium alloy powder 5-10; coupling agent 5; novolak resin 25; ethylene glycol diglycidyl ether 13; glass-ceramic powder 7.

[0023] The resistance prepared by this embodiment has been tested and analyzed, and it shows that the resistance performance is good.

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PUM

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Abstract

The embodiment of the invention discloses carbon glue thick-film resistor sizing. The carbon glue thick-film resistor sizing comprises, by mass, 3 parts of anti-flaming temperature-resistance high-molecular polymer including boron, 1.5 parts of nanometer carbon system electric conduction packing, 12 parts of electric conduction phase graphite powder, 4 parts of ultra-fine base metal ally powder electric conduction packing, 0.6 part of tributyl citrate, 0.6 part of cellulose nitrate, 32 parts of o-methyl novolac epoxy resin, 5-10 parts of silver and palladium alloy powder, 5 parts of coupling agent, 25 parts of linear phenolic resin, 13 parts of ethylene glycol diglycidyl ether and 7 parts of microcrystal glass powder. Through tests and analyses, it is shown that a resistor prepared through the carbon glue thick-film resistor sizing is good in performance.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a carbon glue thick film resistance paste. Background technique [0002] Resistors are a commonly used electrical component with a wide range of applications, such as integrated circuits and chips. However, with the rapid development of integrated circuits and chips, current resistors have many shortcomings and cannot meet the needs of integration. Resistors Slurry has become a direction to solve this problem. [0003] As the main components of the resistance paste, it is usually composed of glass composition, conductive material, and organic vehicle. The purpose of including the glass composition is to adjust the resistance value and increase the adhesiveness of the paste. After printing the resistor paste on the substrate, it is sintered to form a thick film resistor with a thickness of about 5-20um, and in this resistor paste, ruthenium oxide and lead ruthenium oxide are usually us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/24H01C7/00
Inventor 吴国民
Owner CHANGSHU LIANMAO ELECTRONICS TECH
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