Low-dielectric epoxy resin composite material filled with meso-porous silicon and a preparation method thereof

Abstract

The invention discloses a low-dielectric epoxy resin composite material filled with meso-porous silicon and a preparation method thereof. The composite material comprises 100 parts of epoxy resin, 1-20 parts of meso-porous silicon, 60-90 parts of curing agent and 0.1-1 part of accelerant. According to the low-dielectric epoxy resin composite material filled with meso-porous silicon, a fluorine-containing polymer is introduced by synthesizing meso-porous silicon and performing graft modification on the same, so the hydrophilicity of the composite material is reduced, the interface compatibility is improved, the dielectric constant of the composite material is significantly reduced, and the thermal stability and the mechanical property are improved. Therefore, the composite material can be widely applied to the field of electronic packaging. In addition, the preparation method of the invention is relatively simple, and easy to implement and has good development and application prospects.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a low dielectric constant epoxy resin composite material and a preparation method thereof. Background technique [0002] With the development of electronics and microelectronics industry, the functions of microelectronic components are continuously enhanced, but the volume is shrinking. In order to speed up signal transmission, reduce signal interference and inductive coupling, low dielectric constant materials must be used. [0003] Epoxy resin has the advantages of excellent bonding performance, mechanical performance, electrical insulation performance, chemical stability and low shrinkage rate, low cost, etc. It is used in adhesives, electronic instruments, machinery, aviation, electronic and electrical insulation materials, coatings and advanced Composite materials and other fields have been widely used. In the field of electrical and electronic insulation, it can be used f...

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Problems solved by technology

[0004] At present, there are several ways to reduce the dielectric constant of epoxy resin. One is to synthesize epoxy resin with special structure, mainly by introducing F element into epoxy resin, because C-F has smaller dipole and lower bond than C-H bond. Polarizability, and the CF3 group has a large free volume, but this method generally has a complex synthesis process, high cost, and limited industrial application; the second is to reduce the epoxy resin by blending with other resins. Dielectric constant, such as blending with cyanate resin] and polyphenylene ether, because the dielectric constant of the polymer itself blended with epoxy is low, and the dielectric loss factor is small; the third is to design a special structure The curing agent is cured with epoxy to reduce the dielectric constant of the cured product; the fourth is to reduce the dielectric constant of epoxy by compounding with inorganic materials, such as montmorillonite, cage silsesquioxane, and hollow glass microspheres Wait

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