A Method for Reducing Refractive Index of Ceramic Oxide Optical Thin Film
A technology of ceramic oxide and optical thin film, applied in optics, optical components, sputtering coating, etc., to achieve the effect of ensuring lateral uniformity, feasible operation, and reducing refractive index
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Embodiment 1
[0042] Preparation of HfO by Ion Beam Sputtering 2 Film Refractive Index Modification:
[0043] 1) Si substrate with ultra-smooth surface, surface roughness ~0.3nm, size Φ40×0.30mm, HfO prepared by ion beam sputtering deposition method 2 film;
[0044] 2) Ion beam sputtering deposition of HfO 2 The thin film adopts high-purity metal Hf target material, the purity is ≥99.95%, and the vacuum degree of the back is better than 1.0×10 -3 P, the ion beam voltage is 1250V, the ion beam current is 600mA, the oxygen flow rate is 25sccm, and the deposition time is 1h;
[0045] 3) Prepared HfO 2 The film is placed in a quartz petri dish, and processed in an Ar atmosphere of a hot isostatic pressing device, with a pressure of 50Mpa, a temperature of 300°C, and a processing time of 16 hours;
[0046] 4) Use an ellipsometer to measure the reflection ellipsometric parameters Ψ(λ) and Δ(λ) of the silica film, set the measurement wavelength range to 300nm-800nm, the measurement step size ...
Embodiment 2
[0049] Preparation of Ta by Ion Beam Sputtering 2 o 5 Film Refractive Index Modification:
[0050] 1) Si substrate with ultra-smooth surface, surface roughness ~0.3nm, size Φ40×0.30mm, prepared by ion beam sputtering deposition method 2 o 5 film;
[0051] 2) Ion beam sputtering deposition of Ta 2 o 5 The film adopts high-purity metal Ta target material, the purity is ≥99.95%, and the vacuum degree of the back is better than 1.0×10 -3 P, the ion beam voltage is 1250V, the ion beam current is 600mA, the oxygen flow rate is 25sccm, and the deposition time is 1h;
[0052] 3) Prepared Ta 2 o 5 The film is placed in a quartz petri dish, and processed in an Ar atmosphere of a hot isostatic pressing device, with a pressure of 50Mpa, a temperature of 300°C, and a processing time of 16 hours;
[0053] 4) Use an ellipsometer to measure the reflection ellipsometric parameters Ψ(λ) and Δ(λ) of the silica film, set the measurement wavelength range to 300nm-800nm, the measurement step...
Embodiment 3
[0056] Preparation of SiO by Ion Beam Sputtering 2 Film Refractive Index Modification:
[0057] 1) Si substrate with ultra-smooth surface, surface roughness ~0.3nm, size Φ40×0.30mm, SiO2 thin film prepared by ion beam sputtering deposition method;
[0058] 2) SiO deposited by ion beam sputtering 2 The film adopts high-purity ultraviolet fused silica target material, the purity is ≥99.995%, and the vacuum degree of the back and the bottom is better than 1.0×10 -3 P, the ion beam voltage is 1250V, the ion beam current is 600mA, the oxygen flow rate is 25sccm, and the deposition time is 1h;
[0059] 3) Prepared SiO 2 The film is placed in a quartz petri dish, and processed in an Ar atmosphere of a hot isostatic pressing device, with a pressure of 50Mpa, a temperature of 300°C, and a processing time of 16 hours;
[0060] 4) Use an ellipsometer to measure the reflection ellipsometric parameters Ψ(λ) and Δ(λ) of the silica film, set the measurement wavelength range to 400nm-800n...
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