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Photosensitive resin manufacture method and color filter

A technology of photosensitive resin and manufacturing method, which is applied in the photoengraving process of pattern surface, photosensitive materials and instruments used in opto-mechanical equipment, etc. Good developability, excellent thermal decomposition resistance and thermal yellowing resistance

Active Publication Date: 2015-04-15
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as a binder for color filters, thermal decomposition resistance and / or thermal yellowing resistance cannot be satisfied.

Method used

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  • Photosensitive resin manufacture method and color filter
  • Photosensitive resin manufacture method and color filter
  • Photosensitive resin manufacture method and color filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0041] The method for producing a photosensitive resin (A-1) according to Embodiment 1 of the present invention is characterized in that a carboxyl group-containing copolymer and an epoxy group-containing ethylenically unsaturated compound are formed in three groups represented by the following formula (1). The reaction is performed at a temperature of 100° C. to 150° C. in the presence of a valent organophosphorus compound catalyst and a polymerization inhibitor in an atmosphere having an oxygen concentration of 2 v % to 10 v %.

[0042] [chemical formula 3]

[0043]

[0044] (where, R 1 ~R 15 Each independently represents a hydrogen atom, an alkyl group with 1 to 3 carbon atoms, an alkoxy group with 1 to 3 carbon atoms, an alkoxyalkyl group with 2 to 3 carbon atoms, or an alkyl group with 2 to 3 carbon atoms. 3 alkenyl; R 1 ~R 5 At least one of, R 6 ~R 10 at least one of the R 11 ~R 15 At least one of them is an alkyl group with 1 to 3 carbon atoms, an alkoxy group ...

Embodiment approach 2

[0091]The method for producing a photosensitive resin (A-2) according to Embodiment 2 of the present invention is characterized in that an epoxy group-containing copolymer and a carboxyl group-containing ethylenically unsaturated compound are formed in three groups represented by the following formula (1). In the presence of a valent organophosphorus compound catalyst and a polymerization inhibitor, the reaction is performed at a temperature of 100°C to 150°C in an atmosphere having an oxygen concentration of 2v% to 10v%.

[0092] [chemical formula 4]

[0093]

[0094] (where, R 1 ~R 15 Each independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, an alkoxyalkyl group having 2 to 3 carbon atoms, or an alkene having 2 to 3 carbon atoms Base; R 1 ~R 5 At least one of, R 6 ~R 10 at least one of the R 11 ~R 15 At least one of them is an alkyl group having 1 to 3 carbon atoms, an alkoxy group having ...

Embodiment 1

[0119] 569.9 g of propylene glycol monomethyl ether acetate was put into the flask equipped with the stirring device, the dropping funnel, the condenser, the thermometer, and the gas introduction tube, and it heated up to 120 degreeC, stirring with nitrogen substitution. Next, 63.5 g of peroxide was added to a monomer mixture consisting of 519.5 g (3.66 mol) of glycidyl methacrylate, 230 g (1.05 mol) of tricyclodecanyl methacrylate, and 54.4 g (0.52 mol) of styrene. - tert-butyl 2-ethylhexanoate (polymerization initiator, manufactured by NOF Corporation, PERBUTYL (registered trademark) O), and the obtained mixture was dropped into the above-mentioned flask from the dropping funnel over 2 hours. After completion|finish of dripping, it stirred further at 120 degreeC for 2 hours, and copolymerization reaction was performed, and the epoxy group containing copolymer solution was produced|generated. Add 252 g of acrylic acid, 3.2 g (0.3 parts by mass) of butyl hydroxytoluene as a po...

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Abstract

The invention provides a method for forming a photosensitive resin which is high in sensitivity and / or developing performance, wherein the photosensitive resin can form a solidified paint film which is high in heatproof decomposability and heatproof yellowing resistance. The photosensitive resin manufacture method is characterized in that under the condition that a specific tervalence organic phosphorus compound such as a Tris(o-methylphenyl)phosphine, a Tris(m-methylphenyl)phosphine, a Tris(p-methylphenyl)phosphine, a Tris(p-methoxyphenyl)phosphine, a Tris(2,6-dimethoxyphenyl) phosphine, a styryl-diphenylphosphine and the like exists, a carboxyl-containing copolymer and an epoxy-group-containing ethylene unsaturated compound are enabled to react with each other at temperature of 100 DEG C and 150 DEG C in an atmosphere which is 2v% to 10v% in oxygen concentration.

Description

technical field [0001] This invention relates to the manufacturing method of a photosensitive resin, and the color filter using the photosensitive resin obtained by this manufacturing method. Background technique [0002] In recent years, from the viewpoint of resource saving and / or energy saving, photosensitive materials that can be cured by active energy rays such as ultraviolet rays and / or electron beams have been widely used in the fields of various coating processes, printing, paints, adhesives, etc. resin composition. In addition, in the field of electronic materials such as printed circuit boards, the photosensitive resin composition curable by active energy rays can also be used for solder resists, resists for color filters, and the like. [0003] In general, a color filter consists of a transparent substrate such as a glass substrate, red (R), green (G) and blue (B) pixels formed on the transparent substrate, a black matrix formed at The protective film formed on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G02B5/20
CPCC08F2/48G03F7/027G03F7/038Y10S430/1055
Inventor 柳正义川口恭章木下健宏荻原和重
Owner 株式会社力森诺科
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