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Preparation method of optical fiber core layer

A manufacturing method and fiber core technology, which can be used in cladding fibers, manufacturing tools, optical waveguides and light guides, etc., can solve problems such as device failure, and achieve the effect of improving performance

Active Publication Date: 2015-05-13
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem solved by the present invention is to provide a method for manufacturing the core layer of an optical fiber, which utilizes a physical vapor deposition method to deposit a germanium layer, defines the required pattern through photolithography and etching processes, and then oxidizes it in an oxygen atmosphere. Core layer manufacturing method, thereby solving the problem of device failure caused by the doping of germanium in the optical fiber core layer

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  • Preparation method of optical fiber core layer
  • Preparation method of optical fiber core layer
  • Preparation method of optical fiber core layer

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Embodiment Construction

[0021] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0022] Such as Figure 1-Figure 6 Shown, the manufacture method of a kind of optical fiber core layer of the present invention comprises the following steps:

[0023] 1. If figure 1 As shown, a first layer of oxide film 102 is deposited on a silicon substrate 101, the first layer of oxide film 102 can be made of silicon dioxide, the thickness of the first layer of oxide film 102 is 5-20 microns, and the first layer of oxide film is deposited The method of 102 includes but not limited to chemical vapor deposition, spin coating and furnace tube oxidation; impurities can be doped in the first layer of oxide film 102 to reduce its refractive index, and the doping elements can be boron, phosphorus, carbon , fluorine and other elements, or a mixture of these elements, the doping amount is 0 to 10% by mole;

[0024] 2. If figure 2 As shown, a ge...

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Abstract

The invention discloses a preparation method of an optical fiber core layer. The preparation method comprises following steps: step 1, a first oxidation film is deposited onto a silicon substrate; step 2, a germanium membrane layer is deposited onto the first oxidation film via physical vaporous deposition; step 3, certain patterns of the germanium membrane layer are formed via photoetching and etching; step 4, the germanium membrane layer is subjected to germanium oxidation at high temperature in the presence of oxygen so as to obtain germanium dioxide; step 5, a second oxidation film is deposited onto a silicon slice; and step 6, the surface of the second oxidation film is subjected to planarization via chemical mechanical polishing. The preparation method is capable of avoiding device failure caused by germanium doping of the optical fiber core layer.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing process, in particular to a method for manufacturing an optical fiber core layer. Background technique [0002] Optical fiber is a network transmission medium that propagates signals in the form of light pulses and is mainly made of glass or plexiglass. Optical fiber is mainly composed of three parts: core layer (Core), cladding layer (Cladding) and coating layer (coating). The core and cladding layers are based on silica, while the coating layer is based on acrylic resin. In order to reduce the loss of light transmission in the optical fiber, the refractive index of the core layer is greater than that of the cladding layer to ensure that the light is fully emitted on the interface. The difference in refractive index is mainly achieved by doping impurities in silicon dioxide: doping germanium in the core layer to increase its refractive index; and doping fluorine in the claddin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B37/018G02B6/02
Inventor 成鑫华
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP