High-temperature-resistant and aging-resistant substrate and production method thereof

An aging-resistant and high-temperature-resistant technology, applied in chemical instruments and methods, adhesive types, non-polymer adhesive additives, etc., can solve problems such as unsatisfactory use environment, mechanical strength and electrical strength attenuation, and achieve excellent Pyrolysis resistance, reduced fluidity, and improved product quality

Inactive Publication Date: 2015-05-13
广东全宝科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The metal-based copper-clad laminates made of common resins on the market will experience serious attenuation in mechanical strength and electrical strength after long-term aging under harsh service conditions such as high temperature (210°C), which cannot meet the increasingly harsh service environment.

Method used

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  • High-temperature-resistant and aging-resistant substrate and production method thereof
  • High-temperature-resistant and aging-resistant substrate and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1. Take an appropriate amount of acetone solvent (based on the ability to fully dissolve the curing agent and accelerator) to fully stir and dissolve 3 parts of diaminodiphenylmethane and 1 part of 2-methylimidazole;

[0037] 2. Mix 5g of o-cresol novolac epoxy resin (epoxy equivalent of 200), 15g of phenoxy resin (number average molecular weight of 10000), 25g of bisphenol A epoxy resin (epoxy equivalent of 430), nitrile rubber ( Mooney viscosity is 30) 5g, aluminum oxide 50g is sequentially added to the solution obtained in step 1, stirred for 10 hours, fully mixed evenly, and a halogen-free high thermal conductivity resin composition with a solid content of 80% is formed;

[0038] 3. Coat the above composition on the rough surface of the copper foil with a coating machine, and bake it in an air flotation oven at 160°C for 3 minutes to obtain a resin-coated copper foil RCC coated with a semi-cured resin layer;

[0039] 4. The metal plate and RCC are combined and then ...

Embodiment 2

[0041] 1. Take an appropriate amount (based on the standard of fully dissolving the curing agent and accelerator) of MEK and cyclohexanone solvent to fully stir and dissolve 5 parts of diaminodiphenyl sulfone and 2 parts of N-methylimidazole;

[0042] 2. Add 1g of o-methyl novolak epoxy, 10g of phenoxy resin, 20g of bisphenol A epoxy resin, 1g of nitrile rubber, and 30g of filler into the solution obtained in step 1 in sequence, and stir for more than 10 hours to fully mix and evenly , forming a halogen-free high thermal conductivity resin composition with a solid content of 80%;

[0043] 3. Coat the above composition on the matte surface of the copper foil by a coating machine, and bake it in an air flotation oven at 100-160°C for 3-5 minutes to obtain a resin coating coating with a semi-cured resin layer. Copper foil RCC;

[0044] 4. The metal plate and RCC are combined and laminated at the set pressing cycle, and the metal-based copper-clad laminate is obtained after the p...

Embodiment 3

[0046] 1. Take an appropriate amount (based on the standard of fully dissolving the curing agent and accelerator) of acetone solvent to fully stir and dissolve 10 parts of diaminodiphenylmethane and 2 parts of N-methylimidazole;

[0047] 2. Add 10g of o-cresol novolac epoxy resin, 20g of phenoxy resin, 30g of bisphenol A epoxy resin, 10g of nitrile rubber, and 70g of filler into the solution obtained in step 1 in sequence, stir for 10 hours, and mix well to form A halogen-free high thermal conductivity resin composition with a solid content of 80%;

[0048] 3. Coat the above composition on the matte surface of the copper foil by a coating machine, and bake it in an air flotation oven at 100-160°C for 3-5 minutes to obtain a resin coating coating with a semi-cured resin layer. Copper foil RCC;

[0049] 4. The metal plate and RCC are combined and then laminated in the set pressing cycle, and the metal-based copper-clad laminate is obtained after the plate is disassembled.

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Abstract

The invention provides a high-temperature-resistant and aging-resistant substrate. The substrate comprises an insulation layer which comprises substances in parts by weight as follows: 1-10 parts of o-cresol formaldehyde epoxy resin, 10-20 parts of phenoxy resin, 20-30 parts of bisphenol A type epoxy resin, 1-10 parts of nitrile butadiene rubber and 30-70 parts of filler. The substrate selects the resin adopting special structures, has excellent high-temperature decomposition resistance, can still keep good mechanical strength and electric strength after treated at the temperature of 210 DEG C for 1000 h and can be adapted to complex using environments such as high-temperature environments and the like.

Description

technical field [0001] The invention relates to a substrate, in particular to a high-temperature-resistant and aging-resistant substrate and a manufacturing method thereof. Background technique [0002] The metal-based copper-clad laminates made of ordinary resins on the market suffer from serious attenuation in mechanical strength and electrical strength after long-term aging under harsh service conditions such as high temperature (210°C), which cannot meet the increasingly harsh service environment. Contents of the invention [0003] In order to solve the above technical problems, the present invention uses high heat-resistant resin and special curing agent to redesign and develop the insulating layer, and adds heat-resistant o-cresol novolac epoxy resin and ultra-high molecular weight type low-fluidity type to the insulating layer formula. The phenoxy resin makes the produced substrates aging for more than 1000 hours under high temperature (210°C) conditions, and can s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/00C08L71/12C08L9/02C08K3/00C08K3/22C08K3/38C08K3/28C08K3/34C08G59/56C09J163/02C09J163/00C09J171/12C09J109/02C09J11/04B32B15/092B32B15/20B32B37/10B32B37/12
Inventor 罗君林晨
Owner 广东全宝科技股份有限公司
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