19 results about "CRESOL/FORMALDEHYDE" patented technology

The application discloses a kind of composite ultra-thin bonding sheet for high-frequency copper-clad plate multilayer pressing and a preparation method thereof, and specifically belongs to the field of copper-clad plate bonding sheet manufacturing.The composite ultra-thin bonding sheet is obtained by impregnating the reinforcing substrate in a composite resin adhesive and then drying.The composite resin adhesive comprises a composite resin composition and a solvent.The composite resin composition comprises a composite bisphenol A type epoxy resin, an o-cresol formaldehyde epoxy resin, a brominated epoxy resin, poly(4-vinyl butyl benzoate), a heat-resistant filler, a curing agent, and a curing accelerator.The copper-clad plate prepared using the composite ultra-thin adhesive provided by the application has excellent high-temperature resistance and tracking resistance, as well as good flame retardance, low dielectric constant, and peel strength, with excellent overall performance.

The application provides a high epoxy value p-cresol formaldehyde epoxy resin and a preparation method thereof, and relates to the technical field of polymer material synthesis. The preparation method realizes precise control of a chemical reaction path through a synergistic process of "segmented temperature control polycondensation-gradient base epoxidation-compound phase transfer catalysis-in-situ water removal", which directionally inhibits main side reactions such as epoxy ring opening and phenolic hydroxyl etherification, significantly improves the ring closure efficiency, and finally obtains the p-cresol formaldehyde epoxy resin with the following performances: an epoxy value of 0.50-0.54 eq / 100g (more than 10% higher than that of a traditional process), a hydrolytic chlorine content of less than 0.03%, and a hydrolyzable chlorine content of less than 0.01%, reaching the electronic grade standard. Through the technical scheme, the industry pain points of many side reactions, low epoxy value, high hydrolytic chlorine content, poor product flame retardancy and large raw material consumption of the existing process are effectively solved.

The present application relates to the technical field of epoxy encapsulation material, and particularly relates to a low-stress and low-hygroscopicity epoxy resin composition and application thereof. The low-stress and low-hygroscopicity epoxy resin composition is prepared from the following components: epoxy resin, phenolic resin, inorganic filler, colorant, release agent, curing accelerator, ion capture agent and coupling agent; the epoxy resin is composed of o-cresol formaldehyde type epoxy resin and branched diphenyl sulfide epoxy resin, wherein the branched diphenyl sulfide epoxy resin is obtained by crosslinking 4,4'-dihydroxydiphenyl sulfide, inositol and epichlorohydrin; by adding the branched diphenyl sulfide epoxy resin in the epoxy resin composition, the mechanical properties and water absorption of the epoxy resin composition are significantly improved, thereby improving the stability and reliability of the product, and the epoxy resin composition can be used for packaging of small and thin integrated circuits.

The invention relates to high-performance modified o-cresol formaldehyde resin as well as a preparation method and application thereof. The preparation method adopts a step-by-step polymerization and molecular design strategy, takes organic acid as a catalyst, performs controllable polycondensation by adding formaldehyde in batches and introducing a molecular weight regulator (such as phenol and p-tert-butylphenol), and finally stabilizes the tail end of a molecular chain by adopting an end capping technology. The method successfully synthesizes the modified o-cresol formaldehyde resin with high ortho-position structure content and narrow molecular weight distribution (the molecular weight distribution index PDI is less than or equal to 2.0). When epoxidation is carried out by using the epoxy resin as an intermediate, the reaction efficiency is high, side reactions are few, and the obtained epoxy resin shows the excellent characteristics of high epoxy value and low hydrolyzed chlorine. The finally cured product shows higher glass transition temperature, lower water absorption, improved toughness and excellent dielectric properties, and comprehensively meets the harsh requirements of high-end electronic packaging materials, copper-clad plates and high-performance composite materials on heat resistance, reliability and electrical insulation.

The invention discloses a high-temperature-resistant insulating material for a new energy battery and a preparation method of the high-temperature-resistant insulating material, and relates to the technical field of high polymer materials. The method comprises the following steps: firstly, carrying out phosphorus modification on o-cresol formaldehyde epoxy resin and DOPO, then reacting with KH-560 to prepare an active compatibilizer, and powdering; then carrying out surface passivation, silicon dioxide coating, calcination and titanate coupling treatment on aluminum nitride to obtain an AlN-coated SiO2 composite filler; then carrying out surface modification on the filler through aminated hyperbranched polysiloxane and nano boron nitride to construct an interface buffer layer; finally, polyetherimide, an active compatibilizer, the modified filler and an antioxidant are blended, extruded and subjected to heat treatment. According to the method, through multi-scale synergistic modification, the high-temperature stability and long-term heat-resistant cycle performance of the material are remarkably improved, and the method is suitable for the field of new energy battery insulation.

The invention relates to a halogen-free epoxy resin composition, a low-temperature hot-pressing adhesive film as well as a preparation method and application of the halogen-free epoxy resin composition. The halogen-free epoxy resin composition comprises the following components in parts by weight: 10-25 parts of halogen-free bisphenol A epoxy resin; 10 to 25 parts of halogen-free polyurethane modified epoxy resin; 5-15 parts of halogen-free naphthalene type epoxy resin; 5-15 parts of halogen-free organic silicon modified epoxy resin; 5-15 parts of halogen-free phosphorus-containing epoxy resin; 15 to 40 parts of a toughening agent; 15 to 30 parts of a halogen-free flame retardant; 1-10 parts of a curing agent; 0.01 to 1 part of a curing accelerator; a proper amount of organic solvent; wherein the curing agent is at least one of a linear phenolic resin curing agent, a linear bisphenol A type phenolic curing agent, a linear o-cresol formaldehyde resin curing agent, 4, 4 '-diamino diphenylmethane, m-phenylenediamine and m-xylylenediamine. The composition can activate the reaction at 80-120 DEG C, reduces the reaction temperature, meets the requirements of low-temperature operation conditions, has good bonding, insulating and other properties, passes a 300 DEG C / 30s high-temperature impact test, and has very high reliability.

The invention discloses an epoxy resin composition for an LNG (Liquefied Natural Gas) storage tank supporting seat and a preparation method thereof, and the epoxy resin composition is prepared from the following raw materials in parts by weight: 40 parts of bisphenol A epoxy resin, 4-15 parts of tetraglycidyl diaminodiphenyl methane, 7-22 parts of o-cresol formaldehyde epoxy resin, 4-10 parts of a latent curing agent, 0.2-1 part of an accelerant, 1.5-5 parts of hollow light filler, 0.15-0.5 part of a coupling agent and 0.5-5 parts of a toughening agent. And 1.5 to 3 parts of a surfactant. The epoxy resin composition disclosed by the invention has relatively high compression strength, bending strength and impact strength and relatively low heat conductivity coefficient at room temperature and minus 163 DEG C, can resist the ultimate temperature of 300 DEG C or above within 10 minutes, and is an excellent polymer composite material for manufacturing the LNG storage tank supporting seat.

The present application relates to the technical fields of semiconductor packaging injection molding, in particular to a low-temperature fast-curing epoxy resin composition for injection molding and a preparation method thereof, which comprises at least o-cresol formaldehyde epoxy resin, dicyclopentadiene phenol epoxy resin, phenol-aralkyl curing agent, imidazole curing agent, coupling agent, release agent, colorant and silicon dioxide. By optimizing the compound selection of epoxy resin and curing agent, the provided epoxy resin composition has lower packaging injection molding temperature and shorter packaging injection molding time by using o-cresol formaldehyde epoxy resin, dicyclopentadiene phenol epoxy resin, phenol-aralkyl curing agent and imidazole curing agent through low-temperature mixing process, effectively meeting the new demands of the semiconductor packaging industry.

The present invention relates to the technical field of injection molding in semiconductor packaging, in particular to an epoxy resin composition capable of low-temperature rapid curing and injection molding, and a preparation method therefor. Said epoxy resin composition at least comprises an o-cresol formaldehyde epoxy resin, a dicyclopentadiene phenolic epoxy resin, a phenol-aralkyl curing agent, an imidazole curing agent, a coupling agent, a release agent, a coloring agent and silicon dioxide. By means of optimization of the selection in compounding epoxy resins and curing agents, the combined use of the o-cresol formaldehyde epoxy resin and dicyclopentadiene phenolic epoxy resin as well as the phenol-aralkyl curing agent and the imidazole curing agent, and a low-temperature mixing process enable the provided epoxy resin composition to have a low packaging injection molding temperature and short packaging injection molding time, thereby effectively satisfying new demands in the semiconductor packaging industry.

The invention belongs to the technical field of electronic materials, and particularly relates to black insulation resistance ink and a preparation method thereof.The black insulation resistance ink comprises bisphenol A epoxy resin, phenoxy resin, o-cresol formaldehyde epoxy resin, a benzoxazine curing agent, a compound solvent, a latent curing agent, black pigment, functional filler, auxiliaries and a conductive inhibitor, the black insulation resistance ink meets 350-mesh screen printing, and adopts a gradient heating curing process. According to the invention, a synergistic curing mechanism of benzoxazine, o-cresol formaldehyde epoxy resin (OCFEN) and latent imidazole is combined, low-temperature pre-curing and high-temperature compact crosslinking are realized through a gradient heating process, and process adaptability and material performance are considered at the same time.

The application discloses a high-temperature-resistant insulating material for new energy batteries and a preparation method thereof, and relates to the technical field of high polymer materials.The method comprises the following steps: first, modifying o-cresol formaldehyde epoxy resin with DOPO, and then reacting the modified o-cresol formaldehyde epoxy resin with KH-560 to obtain an active compatibilizer and powderize the active compatibilizer; then, performing surface passivation, silica coating, calcination and titanate coupling treatment on aluminum nitride to obtain an AlN@SiO2 composite filler; then, performing surface modification on the filler by using an aminated hyperbranched polysiloxane and nano boron nitride to construct an interface buffer layer; finally, blending, extruding and heat-treating polyetherimide, the active compatibilizer, the modified filler and an antioxidant. The method is suitable for the insulating field of new energy batteries, and the high-temperature stability and long-term heat cycle performance of the material are significantly improved through multi-scale synergistic modification.

The invention relates to a preparation method of a high-performance epoxy resin-based wave-transparent composite material, and belongs to the technical field of polymer resin-based composite materials. The method comprises the following steps: adding one or more of bisphenol A type epoxy resin, o-cresol formaldehyde type epoxy resin, bisphenol A type novolac epoxy resin, dicyclopentadiene phenol epoxy resin, polyfunctional epoxy resin and benzoxazine resin into a reactor, adding a solvent, dissolving at 50-60 DEG C for 0.5-1 hour, sequentially adding a flexibilizer, a curing agent and an accelerant after the dissolution is finished, and uniformly mixing to obtain a mixture; performing post-treatment to obtain an epoxy resin solution; the preparation method comprises the following steps: manually brushing an epoxy resin solution on quartz fiber cloth by using a solution method, carrying out B-stage treatment, blanking prepreg, cutting, laminating, sealing, and curing in an autoclave to prepare the high-performance epoxy resin-based wave-transparent composite material.

The invention provides a preparation method of photosensitive resin, the photosensitive resin prepared by the preparation method and application, and relates to the technical field of photosensitive slurry. The preparation method of the photosensitive resin comprises the following steps: carrying out polymerization reaction on o-cresol formaldehyde epoxy resin and unsaturated binary acid in an organic solvent in the presence of a polymerization inhibitor and a catalyst to obtain an intermediate P; in the presence of a polymerization inhibitor and a catalyst, carrying out a grafting reaction on the intermediate P and 3-glycidyl ether oxypropyl triethoxy silane in an organic solvent to obtain an intermediate P-O; and in the presence of a polymerization inhibitor and a catalyst, reacting the intermediate P-O with an anhydride compound in an organic solvent to obtain the photosensitive resin P-O-S. The photosensitive resin provided by the invention has good chemical bonding strength and film-forming property on a substrate, has excellent wetting dispersion stability on an inorganic phase, and has good development resolution and development morphology; and the method has a good application prospect in photosensitive slurry.

The invention relates to the technical field of epoxy resin compositions, in particular to an epoxy resin composition suitable for rectifier bridge packaging and a preparation method of the epoxy resin composition. The adhesive comprises the following components in percentage by weight: 10-20% of epoxy resin, 5-10% of a curing agent, 0.05-0.8% of a release agent, 0.05-0.8% of a coupling agent, 0.05-0.8% of a coloring agent, 0.05-0.8% of a catalyst and the balance of silicon dioxide, the epoxy resin comprises o-cresol formaldehyde type epoxy resin and dicyclopentadiene type epoxy resin; in the preparation process of the epoxy resin composition, the epoxy resin and the release agent are mixed for ball milling pretreatment, so that the continuous molding property can be improved; a low-temperature mixing technology (the mixing temperature is 80-100 DEG C) is adopted, so that acetone insoluble substances in the resin composition are effectively reduced.

The present application relates to a kind of high hardness, the polyester resin for powder coating with excellent adhesion, which uses the raw material polymerization obtained including o-cresol formaldehyde epoxy resin by-product, xylene, isobutyric anhydride, adipic acid, terephthalic acid, tetraethylene glycol, phenyl succinic anhydride.In the preparation of polyester resin, the functionality is higher, and has the structure of o-cresol formaldehyde epoxy resin, as 70 / 30 polyester resin product for indoor powder coating is used, the final coating not only has high hardness, but also has excellent adhesion, other conventional performance such as coating appearance, impact resistance, gloss, etc. can also meet the requirements, at the same time, the high value-added comprehensive utilization of o-cresol formaldehyde epoxy resin by-product is realized, and has excellent economic and environmental value.

The invention discloses high-strength high-temperature-resistant precoated sand and a production process, and relates to the technical field of precoated sand, the high-strength high-temperature-resistant precoated sand comprises the following raw materials by weight: 100-110 parts of crude sand, 7-9 parts of o-cresol formaldehyde epoxy resin, 3-5 parts of modified SBS, 1.5-2.5 parts of a functional curing agent, 4-5 parts of a lubricant, and 1-3 parts of a silane coupling agent. The compatibility of the modified SBS and the o-cresol formaldehyde epoxy resin is enhanced, and in the process of improving the toughness of the o-cresol formaldehyde resin, the tensile strength, heat resistance and the like are improved. The temperature of the used functional curing agent for curing the o-cresol formaldehyde epoxy resin is low, the manufacturing cost of the precoated sand is reduced, and after the o-cresol formaldehyde epoxy resin is cured, the prepared precoated sand is endowed with high weather resistance.

The invention discloses a PCB (printed circuit board) based on solder resist ink and a preparation process thereof, relates to the technical field of printed circuit boards, and provides the preparation process of the PCB, the PCB is coated with the solder resist ink, so that the PCB has good dielectric property, the water resistance can be improved, and the service life of the PCB is prolonged. And safe operation of the circuit board is protected permanently. According to the invention, methacrylate double bonds are introduced into the light-cured o-cresol formaldehyde epoxy resin, so that rapid curing of UV is realized. The urushiol modified epoxy resin is added, and a benzene ring side chain of urushiol is copolymerized with the epoxy resin to form a rigid framework, so that the heat resistance and water resistance of the ink are improved.

This invention relates to the field of epoxy molding compound technology, specifically to a high-reliability epoxy resin composition and its application. The composition comprises a blended epoxy resin, a phenolic resin, a high-content filler, and various functional additives. The blended epoxy resin utilizes the synergistic effect of o-cresol formaldehyde epoxy resin and organosilicon epoxy resin to construct a three-dimensional network structure. The organosilicon epoxy resin is prepared by a catalytic reaction of allyl glycidyl ether, D4H cyclotetrasiloxane, and a specific molecular weight single-terminated vinyl silicone oil. Through molecular structure design and filler interface control, while maintaining a high filler content, the material's coefficient of thermal expansion is precisely matched to that of aluminum wire bonding, solving the thermal mismatch problem in the encapsulation of high-expansion-coefficient matrix materials. This makes it particularly suitable for aluminum wire bonding encapsulation of power devices.

The application provides a preparation method of a photosensitive resin, the photosensitive resin prepared therefrom and application, and relates to the technical field of photosensitive paste. The preparation method of the photosensitive resin comprises the following steps: in the presence of a polymerization inhibitor and a catalyst, carrying out a polymerization reaction on o-cresol formaldehyde epoxy resin and an unsaturated dibasic acid in an organic solvent to obtain an intermediate P; in the presence of a polymerization inhibitor and a catalyst, carrying out a grafting reaction on the intermediate P and 3-glycidyl ether oxypropyl triethoxysilane in an organic solvent to obtain an intermediate P-O; in the presence of a polymerization inhibitor and a catalyst, carrying out a reaction on the intermediate P-O and an acid anhydride compound in an organic solvent to obtain the photosensitive resin P-O-S. The photosensitive resin has good chemical bonding strength and film-forming property on a substrate, has excellent wetting and dispersion stability to an inorganic phase, has good developing resolution and developing appearance, and has good application prospect in the photosensitive paste.