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57 results about "CRESOL/FORMALDEHYDE" patented technology

Preparation method for high softening point o-cresol formaldehyde epoxy resin

The present invention provides a preparation method for a high softening point o-cresol formaldehyde epoxy resin. The preparation method comprises the following steps: adopting o-cresol and paraformaldehyde as raw materials, carrying out a reaction for 3-5 hours under a catalysis effect of a catalyst, and carrying out a post-treatment to obtain a high softening point o-cresol formaldehyde resin; mixing the synthesized linear high softening point o-cresol formaldehyde resin and epichlorohydrin according to a mass ratio of 1:3-1:10; adding an auxiliary agent; carrying out an etherification reaction at a temperature of 30-100 DEG C; adding an alkali to catalyze a ring closing reaction under a vacuum degree of 0.01-0.1 MPa; recovering the epichlorohydrin; and carrying out a refinement reaction and a post-treatment. The o-cresol formaldehyde epoxy resin prepared by adopting the preparation method of the present invention has the following characteristics that: high softening point of 80-95 DEG C can be achieved; epoxy equivalent is low; hydrolyzable chlorine content is low; and a high yield can be achieved. In addition, the o-cresol formaldehyde epoxy resin of the present invention is a special function type epoxy resin focused for green electronics encapsulation, IC packaging and circuit board (green oil), wherein the o-cresol formaldehyde epoxy resin has characteristics of high heat resistance, low moisture absorption, and low thermal expansion coefficient.
Owner:CHINA PETROCHEMICAL CORP

Novel heat-resistant corrosion-resistant coating as well as preparation and application method thereof

The invention provides a novel heat-resistant corrosion-resistant coating as well as a preparation and application method of the novel heat-resistant corrosion-resistant coating, wherein the novel heat-resistant corrosion-resistant coating comprises ethyl silicate, methyl triethoxysilane, triethylamine, ethyl alcohol, hydrochloric acid, o-cresol formaldehyde epoxy resin, dimethylbenzene, diatomite, silica, zinc oxide, zoelite powder, mica, a butyl cellosolve solvent and butyl alcohol. The novel heat-resistant corrosion-resistant coating is reasonable in components, the stability, the corrosion resistance and the heat resistance of a product are good, and the stability is high. The preparation method of the novel heat-resistant corrosion-resistant coating is simple and feasible in process, high in production efficiency and low in application cost, the operation is easy and simple to implement, the quality of a produced product is stable, and the popularization and application values are relatively high.
Owner:SUZHOU TIANJIANHENG ELECTRONICS INFORMATION TECH CO LTD

Light efficient heat protection and insulation integrated thermal protection material and preparation method thereof

The invention discloses a lightweight high-efficiency thermal protection material integrating heat prevention and heat insulation and a preparation method. The thermal protection material is preparedby dipping a heat insulation matrix with organic aerogel, and the heat insulation matrix is a high-temperature-resistant fiber heat insulation tile. The high-temperature-resistant fiber heat insulation tile is made of quartz fiber, mullite, alumina fiber or a combination of the quartz fiber, the mullite and the alumina fiber. The organic aerogel comprises resorcinol and formaldehyde, melamine andformaldehyde, phenolic resin and formaldehyde or mixed cresol and formaldehyde. By adding the organic aerogel into the thermal insulation matrix, the mechanical strength of the thermal insulation material is improved at normal temperature, it is guaranteed that material failure caused by brittle fracture of the material in the machining and transporting processes is avoided; the thermal insulationperformance of the material is improved in the low-temperature application environment, and heat is brought away through ablation volatilization in the high-temperature stage; therefore, normal workof the thermal protection material in a service environment is ensured.
Owner:SHANDONG RES & DESIGN ACADEMY OF IND CERAMICS

Insulating material for cable insulating layer and underwater composite cable

The invention discloses an insulating material for a cable insulating layer and an underwater composite cable, and mainly relates to the technical field of cables. The insulating material comprises an outer sheath, an armor layer, a waterproof layer and a flame-retardant layer, wherein the flame-retardant layer is internally provided with conductors and coated optical fibers which are distributed alternatively; loose tubes are arranged outside the coated optical fibers; the loose tubes are internally provided with frames; a shielding layer, an insulating layer, an insulating shielding layer, a taped covering and an inner sheath are arranged on the conductor; the insulating layer is made of an insulating material with following raw materials: a PVC (Polyvinyl Chloride) resin, white carbon black, a diphenyl ether resin, an MBS (Methyl Methacrylate) resin, a cresol-formaldehyde resin, a linseed alkyd resin, ethylene-propylene-diene-terpolymer rubber, fatty alcohol-polyoxyethylene ether, calcium stearate, calcined clay and the like. The insulating material has the beneficial effects that protection of the underwater composite cable is remarkably improved, the properties of the insulating material and the insulating layer are optimized and improved, and construction and use requirements of the underwater composite cable are met.
Owner:STATE GRID SHANDONG ELECTRIC POWER CO PINGYUAN POWER SUPPLY CO +1

High-temperature-resistant epoxy adhesive tape and preparation method thereof

The invention discloses a high-temperature-resistant epoxy adhesive tape and a preparation method thereof. The high-temperature-resistant epoxy adhesive tape comprises a release film and a high-temperature-resistant epoxy adhesive film, wherein the release film and the high-temperature-resistant epoxy adhesive film are laminated. The preparation method comprises the steps of S1, dissolving o-cresol formaldehyde epoxy resin in ethyl acetate, adding carboxyl acrylic resin, high-functional epoxy resin, bisphenol A epoxy resin, a silane coupling agent, a curing agent and filler, and uniformly mixing to obtain a mixed glue solution; and S2, filtering the mixed glue solution, coating one side of a release film with the mixed glue solution, drying to form a high-temperature-resistant epoxy glue film, coating the other side of the high-temperature-resistant epoxy glue film with the release film, and cutting to obtain the high-temperature-resistant epoxy adhesive tape. The prepared high-temperature-resistant epoxy adhesive tape solves the problems that a traditional acrylic acid adhesive tape is complex in production process, large in peculiar smell and insufficient in temperature resistance. The problems that a traditional two-component temperature-resistant adhesive for bonding structural parts is inconvenient to use and prone to glue overflowing are solved, and the adhesive tape has high temperature resistance and still keeps good mechanical strength under a high-temperature condition.
Owner:世晨材料技术(上海)有限公司

Graphene RFID electronic tag suitable for gravure printing method preparation

The invention relates to the technical field of RFID electronic tags, and particularly provides a graphene RFID electronic tag suitable for gravure printing method preparation. The graphene RFID electronic tag comprises a base material and graphene conductive paste printed on the base material by adopting the gravure printing method. The graphene conductive paste comprises the following components in parts by weight: 5-10 parts of graphene, 1-3 parts of a surfactant, 5-10 parts of a dispersant, and 15-25 parts of cured resin. The cured resin is prepared from o-cresol formaldehyde epoxy resin, polyurethane, methyl tetrahydrophthalic anhydride, trimethylolpropane and toluene-2,4-diisocyanate in the mass ratio of (70-90):(10-30):(18-23):(1.8-5.5):(0.5-1.6). The surfactant is prepared from sodium dodecyl benzene sulfonate and sodium alcohol ether sulphate according to the mass ratio of (0.5-0.8):(1.2-1.5). The graphene slurry provided by the invention is dispersed in the cured resin in the presence of the specific surfactant, and is supplemented with the specific dispersant and the auxiliary agent to prepare the printing slurry, and the printing slurry is used for resisting static electricity when an RFID electronic tag is prepared by an intaglio printing technology.
Owner:SHANDONG HUAGUAN SMART CARD

Metal corrosion-resistant coating material for electrical equipment maintenance and preparation method of metal corrosion-resistant coating material

The invention discloses a metal corrosion-resistant coating material for electrical equipment maintenance and a preparation method of the metal corrosion-resistant coating material, belongs to the technical field of electrical equipment maintenance, and provides a metal corrosion-resistant coating material for electrical equipment maintenance and a preparation method of the metal corrosion-resistant coating material. According to the invention, the coating material comprises an epoxy resin, o-cresol formaldehyde epoxy resin, nano-zinc oxide, cerium oxide, castor oil polyoxyethylene ether, quartz powder, organic silicon, zinc stearate, ethylene glycol butyl ether, an auxiliary agent and other components, can achieve excellent rust resistance, wear resistance, corrosion resistance and crack resistance, and is uniform and compact in film layer and good in surface smoothness; after the surface of a shell of power equipment is coated with the coating material, the shell can be effectively prevented from rust, and the maintenance frequency of the electrical equipment is reduced; and modified smectite is added, and in the preparation process of the modified smectite, fluotitanic acid can change the structure and the pore channel of the smectite so as to increase the phosphorus powder adsorption amount of the smectite, that the metal stabilizing performance of the modified smectite is substantially improved, and the corrosion resistance and the crack resistance of the metal corrosion-resistant coating material are further improved.
Owner:GUIYANG BUREAU OF CHINA SOUTHERN POWER GRID CO LTD EHV TRANSMISSION CO

Halogen-containing high-Tg high-speed copper-clad plate for communication server and preparation method thereof

The invention discloses a halogen-containing high-Tg high-speed copper-clad plate for a communication server and a preparation method of the halogen-containing high-Tg high-speed copper-clad plate, and belongs to the technical field of 5G copper-clad plates and production processes thereof. The copper-clad plate comprises a bottom copper foil layer, a top copper foil layer and an insulating medium layer which is positioned between the bottom copper foil layer and the top copper foil layer and is formed by laminating 1-8 prepregs, and each prepreg is obtained by soaking glass fiber cloth in a resin glue solution and then drying, wherein the resin glue solution comprises styrene-maleic anhydride copolymer resin, tetrabromobisphenol A, cyanate ester, modified epoxy resin and silicon dioxide filler, and the modified epoxy resin is formed by mixing brominated epoxy resin, cresol formaldehyde epoxy resin, linear novolac epoxy resin and bisphenol A epoxy resin according to a specific proportion. The prepared copper-clad plate has the characteristics of high glass transition temperature, high heat resistance, low thermal expansion coefficient, low dielectric constant, low dielectric loss, good dimensional stability and the like.
Owner:江苏联鑫电子工业有限公司

Application of adsorption process in synthesis of o-cresol formaldehyde epoxy resin

ActiveCN111040129AReduce chromaGuaranteed low chlorine contentDistillationOrganosolv
The invention discloses application of an adsorption process in o-cresol formaldehyde epoxy resin synthesis. The process comprises the following steps: 1, dissolving o-cresol formaldehyde resin in anorganic solvent, adding epoxy chloropropane and a reducing agent, and carrying out heating to perform a reductive decolorization reaction; 2, adding a phase transfer agent and a cocatalyst into the reaction system having undergone the reductive decolorization reaction, and carrying out reduced-pressure reflux for an etherification reaction to obtain an etherification reaction product; 3, adding abase catalyst into the etherification reaction product for a ring-closure reaction; and 4, filtering the reaction system having undergone the ring-closure reaction to obtain a feed liquid, subjectingthe feed liquid to adsorption with an adsorbent, carrying out washing with water, and carrying out reduced-pressure distillation to obtain the o-cresol formaldehyde epoxy resin. According to the method, the adsorbent is used for adsorbing the reaction system feed liquid after the ring-closure reaction, so the content of impurities in the liquid after adsorption is reduced, subsequent washing efficiency is improved, washing time is shortened, the phenomenon of emulsification is reduced, the chromaticity of the o-cresol formaldehyde epoxy resin is reduced, and the low chlorine content of the o-cresol formaldehyde epoxy resin is ensured.
Owner:XIAN ORIGIN CHEM TECH

Liquid development white photoimageable ink and preparation method thereof

The invention discloses liquid development white photoimageable ink and a preparation method thereof. The liquid development white photoimageable ink comprises, by weight, 30-45 parts of multi-elementanhydride modified linear phenolic epoxy acrylate, 10-20 parts of acrylic acid active monomer, 5-10 parts of photoinitiator, 3-8 parts of titanium dioxide, 2-5 parts of barium sulfate, 2-6 parts of fluorine-containing surfactant, 1-3 parts of defoaming agent, 1-3 parts of water reducing agent and 1-3 parts of leveling agent. The liquid development white photoimageable ink and the preparation method thereof have the advantages that multi-element phthalic anhydride is used to modify o-cresol formaldehyde epoxy acrylate to obtain the multi-element anhydride modified linear phenolic epoxy acrylate, the multi-element anhydride modified linear phenolic epoxy acrylate is small in thermal expansion coefficient, stable in dimension, high in softening temperature and capable of guaranteeing the cold dryness of a substratum before exposure, and accordingly the precision of circuit board printing is increased.
Owner:江苏海田电子材料有限公司

Liquid development photoimageable ink and preparation method thereof

The invention discloses liquid development photoimageable ink and a preparation method thereof. The liquid development photoimageable ink comprises, by weight, 25-35 parts of multi-element anhydride modified linear phenolic epoxy acrylate, 10-15 parts of alkali-developable photosensitive resin, 10-20 parts of acrylic acid active monomer, 5-10 parts of photoinitiator, 5-15 parts of silicon dioxide,2-6 parts of fluorine-containing surfactant, 1-3 parts of defoaming agent, 1-3 parts of water reducing agent and 1-3 parts of leveling agent. The liquid development photoimageable ink and the preparation method thereof have the advantages that multi-element phthalic anhydride is used to modify o-cresol formaldehyde epoxy acrylate to obtain the multi-element anhydride modified linear phenolic epoxy acrylate, the multi-element anhydride modified linear phenolic epoxy acrylate combines with the alkali-developable photosensitive resin and the acrylic acid active monomer to prepare the liquid development photoimageable ink through the mutual coordination and promotion of the molecular structures of the three, the prepared liquid development photoimageable ink is short in curing time, good in compatibility, high in printing precision and applicable to flexible circuit board printing, and the problem that a cured film is high in brittleness is improved evidently.
Owner:江苏海田电子材料有限公司
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