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High-temperature-resistant epoxy adhesive tape and preparation method thereof

An epoxy tape, high temperature resistant technology, applied in epoxy resin glue, novolac epoxy resin adhesive, adhesive and other directions, can solve the problems of complex production process, insufficient strength, and failure to reach heat resistance temperature, etc. To achieve the effect of increasing polar groups, improving strength and improving water resistance

Pending Publication Date: 2022-01-21
世晨材料技术(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are many varieties of high-temperature-resistant adhesives or tapes on the market, but the production process of most products is relatively complicated. On the other hand, the required heat-resistant temperature cannot be reached after curing, or the strength at high temperatures is not enough.

Method used

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  • High-temperature-resistant epoxy adhesive tape and preparation method thereof
  • High-temperature-resistant epoxy adhesive tape and preparation method thereof
  • High-temperature-resistant epoxy adhesive tape and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Take Example 1 as an example:

[0033] S1: Dissolve o-cresol novolac epoxy resin (CNE202) in ethyl acetate, add carboxylated acrylic resin, mix well, add high-functional epoxy resin, bisphenol A epoxy resin and γ-(2,3- Glycidoxy)propyltrimethoxysilane (KH-560), mix well, finally add dicyandiamide (DDA) and 4,4,-diphenylsulfonediamine (DDS), mix well, add filler, Mix evenly, that is the mixed glue;

[0034] S2: After filtering the mixed glue, apply the mixed glue on the side of the release film within 5 minutes at 110°C, and dry it to form a high-temperature resistant epoxy film on the side of the release film. The thickness of the adhesive film is 20 μm, and the other side of the high-temperature-resistant epoxy adhesive film is covered with a release film, and cut to obtain the high-temperature-resistant epoxy adhesive tape.

Embodiment 1- Embodiment 8

[0035] Embodiment 1-Example 8: According to the replacement of conditions such as compounds and content in Example 1, see Table 1 for specific content data.

[0036] Table 1 Example 1-Example 8 High temperature resistant epoxy tape

[0037]

[0038]

Embodiment 9

[0039] Embodiment 9: comprise the following steps:

[0040] S1: Nitrogen gas was introduced, and under vacuum conditions, 1 part of polytetrahydrofuran, 1 part of ω-bishydroxyl-terminated polydimethylsiloxane, 1 part of polytetrahydrofuran, 1 part of dibutyltin dilaurate, 1 part of dehydrated Mix one part of N,N-dimethylformamide and 20 parts of ethylene glycol evenly, add 10 parts of 4-4'-diphenylmethane diisocyanate, react at 70-80°C for 2 hours, then add 10 parts of 4-4 '-diphenylmethane diisocyanate for chain extension reaction, add 20 parts of methanol, react for 2h, which is modified polyurethane;

[0041] S2: After ultrasonically reacting 5 parts of carboxylated carbon nanotubes with 10 parts of dimethylformamide for 1 h, add 0.1 parts of γ-aminopropyltriethoxysilane and 3 parts of N-N'dicyclohexylcarbodiimide Mix evenly, pass in nitrogen, heat up to 40°C, react for 3 hours, wash with water, filter and dry, mix with 5 parts of ethanol and 5 parts of water, after ultras...

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Abstract

The invention discloses a high-temperature-resistant epoxy adhesive tape and a preparation method thereof. The high-temperature-resistant epoxy adhesive tape comprises a release film and a high-temperature-resistant epoxy adhesive film, wherein the release film and the high-temperature-resistant epoxy adhesive film are laminated. The preparation method comprises the steps of S1, dissolving o-cresol formaldehyde epoxy resin in ethyl acetate, adding carboxyl acrylic resin, high-functional epoxy resin, bisphenol A epoxy resin, a silane coupling agent, a curing agent and filler, and uniformly mixing to obtain a mixed glue solution; and S2, filtering the mixed glue solution, coating one side of a release film with the mixed glue solution, drying to form a high-temperature-resistant epoxy glue film, coating the other side of the high-temperature-resistant epoxy glue film with the release film, and cutting to obtain the high-temperature-resistant epoxy adhesive tape. The prepared high-temperature-resistant epoxy adhesive tape solves the problems that a traditional acrylic acid adhesive tape is complex in production process, large in peculiar smell and insufficient in temperature resistance. The problems that a traditional two-component temperature-resistant adhesive for bonding structural parts is inconvenient to use and prone to glue overflowing are solved, and the adhesive tape has high temperature resistance and still keeps good mechanical strength under a high-temperature condition.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a high-temperature-resistant epoxy adhesive tape and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of all walks of life, the adhesive industry has also ushered in vigorous development opportunities, especially the epoxy adhesive known as "universal adhesive" because of its characteristics of no volatile emissions during curing and low shrinkage. As well as the advantages of stable chemical properties and excellent electrical insulation, they have been extensively studied and thus obtained unprecedented development and application in synthetic adhesives. Epoxy adhesives can not only be made into various epoxy resin coatings and inks, which are used for protection in various aspects such as ships, automobile chassis, steel structures, pipeline containers, building floors, etc.; they can also be made into various adhesives....

Claims

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Application Information

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IPC IPC(8): C09J7/40C09J7/30C09J7/10C09J163/04C09J163/02C09J163/00C09J11/08C09J11/04
CPCC09J7/40C09J7/30C09J7/10C09J163/04C09J11/08C09J11/04C08L2201/08C08K2003/2227C08K2201/011C08L63/00C08L75/04C08K9/04C08K9/06C08K3/22C08K7/10C08K7/26C08K3/36C08K3/041
Inventor 顾正青罗涛周奎任计建荣
Owner 世晨材料技术(上海)有限公司
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