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Preparation method of high-thermal-conductivity epoxy molding compound

An epoxy molding compound, high thermal conductivity technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor thermal shock resistance, low thermal conductivity, etc., achieve good application prospects and reduce costs.

Inactive Publication Date: 2017-01-04
袁春华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention: In view of the low thermal conductivity of the current traditional molding compound, which leads to its poor thermal shock resistance, the present invention activates the serpentine by calcination, removes impurities by acid leaching, and then mixes it with methanol, After mixing dicyclopentadiene, etc., put it in a reaction kettle for laser irradiation to react, modify its surface, increase high heat, and finally mix it with o-cresol novolac epoxy resin, carbon black, triethylenetetramine, etc. by ball milling, High thermal conductivity epoxy molding compound can be obtained by extruding and granulating. The present invention uses serpentine as raw material and makes it into filler by modifying it, so as to make up for the low thermal conductivity of traditional molding compound, which leads to its resistance to high temperature under high temperature conditions. The defect of poor thermal shock performance has a wide range of production prospects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0016] First, take serpentine and put it into a pulverizer to crush it, pass through a 50-mesh sieve, put the sieved particles into a calciner, use nitrogen protection, set the temperature at 900°C, keep it for calcination for 1 hour, and cool it to room temperature with the furnace. The mass fraction is 29% hydrochloric acid solution according to the solid-to-liquid ratio of 1:3, stirring and mixing at 180r / min for 30min, then filtering, washing the filter residue with distilled water to neutrality, and then putting it into an air dryer to air dry; the above air-dried filter residue Put it into a mill for grinding, pass through a 200-mesh sieve, and collect the sieved particles. In parts by weight, get 40 parts of sieved particles, 24 parts of methanol, 13 parts of dicyclopentadiene, 8 parts of 1.2mol / L Ammonia water, 3 parts of dodecyl mercaptan and 1 part of benzoin ethyl ether were put into a glass reactor, and the air in the reactor was completely replaced with a mixed gas...

example 2

[0019] First, take serpentine and put it into a pulverizer for crushing, pass through a 50-mesh sieve, put the sieved particles into a calciner, use nitrogen protection, set the temperature at 950°C, keep it for calcination for 1.5h, and cool it to room temperature with the furnace. The calcined product and the hydrochloric acid solution with a mass fraction of 29% were mixed according to the solid-to-liquid ratio of 1:3 at 180r / min for 35 minutes, then filtered, and the filter residue was washed with distilled water until it was neutral, and then put into an air dryer to air dry; the above air-dried The filter residue is put into a mill for grinding, passed through a 200-mesh sieve, and the sieved particles are collected. In parts by weight, 43 parts of sieved particles, 25 parts of methanol, 15 parts of dicyclopentadiene, 10 parts of 1.2mol / L ammonia water, 5 parts of dodecyl mercaptan and 1.5 parts of benzoin ethyl ether were put into a glass reactor, and the air in the rea...

example 3

[0022] First, take serpentine and put it into a pulverizer for crushing, pass through a 50-mesh sieve, put the sieved particles into a calcination furnace, use nitrogen protection, set the temperature at 1000°C, keep the temperature for calcination for 2 hours, cool to room temperature with the furnace, and calcine The mass fraction is 29% hydrochloric acid solution according to the solid-to-liquid ratio of 1:3, stirred and mixed at 180r / min for 40min, then filtered, the filter residue is washed with distilled water to neutrality, and then put into an air dryer to air dry; the above air-dried filter residue Put it into a mill for grinding, pass through a 200-mesh sieve, and collect the sieved particles. In parts by weight, get 45 parts of sieved particles, 26 parts of methanol, 16 parts of dicyclopentadiene, 12 parts of 1.2mol / L Ammonia water, 6 parts of dodecyl mercaptan and 2 parts of benzoin ethyl ether were put into a glass reactor, and the air in the reactor was completely...

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Abstract

The invention discloses a preparation method of a high-thermal-conductivity epoxy molding compound, and belongs to the technical field of microelectronic packaging. Serpentine is subjected to activation and acid leaching through calcination to be subjected to impurity removal, the serpentine is mixed with methyl alcohol, dicyclopentadiene and the like, then, the mixture is placed into a reaction kettle to be subjected to laser irradiation for a reaction, the surface of the mixture is modified, the high thermal conductivity is improved, finally, the mixture is subjected to ball milling mixing with o-cresol formaldehyde epoxy resin, carbon black, triethylene tetramine and the like, and extrusion granulation is performed to obtain the high-thermal-conductivity epoxy molding compound. The serpentine is adopted as the raw material, the serpentine is modified to form a filler, and therefore the defect that due to the fact that the heat conductivity of a traditional molding compound is not high, the thermal shock resistance under the high-temperature condition is not good is overcome; the preparation method has wide production prospects.

Description

technical field [0001] The invention discloses a preparation method of a high thermal conductivity epoxy molding compound, which belongs to the technical field of microelectronic packaging. Background technique [0002] Epoxy resin is a high molecular polymer containing two or more epoxy groups in the molecule. The relative molecular weight of epoxy resin is generally not high, about 300-8000. It is solid or liquid at room temperature. The skeleton is mostly a linear thermoplastic structure composed of alicyclic, aliphatic and aromatic segments, and the epoxy group in its molecular chain has high reactivity, which can be ring-opened and combined with the curing agent under the action of light and heat. The reaction forms a cross-linked three-dimensional network structure. [0003] Epoxy molding compound is made by mixing epoxy resin as matrix resin, adding curing agent, inorganic filler, curing accelerator, flame retardant, colorant, coupling agent and other components. Am...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08K13/06C08K9/04C08K9/00C08K3/34C08K3/04C09K5/14
CPCC08K13/06C08K3/04C08K3/34C08K9/00C08K9/04C08K2201/003C09K5/14
Inventor 袁春华宋奇陆娜
Owner 袁春华
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