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Glue solution for halogen-free medium-Tg medium-loss copper-clad plate as well as preparation method and application of the glue solution

A technology of copper clad laminate and glue, which is applied in the field of halogen-free medium Tg medium loss copper clad laminate glue and its preparation, can solve the problems of low heat resistance, high cost, high brittleness, etc., achieve excellent flame retardancy, meet High transmission, low shrinkage effect

Inactive Publication Date: 2020-12-08
林州致远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the initial development of halogen-free copper clad laminates, they have been facing defects such as high brittleness, high water absorption, low heat resistance, and high cost.

Method used

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  • Glue solution for halogen-free medium-Tg medium-loss copper-clad plate as well as preparation method and application of the glue solution
  • Glue solution for halogen-free medium-Tg medium-loss copper-clad plate as well as preparation method and application of the glue solution
  • Glue solution for halogen-free medium-Tg medium-loss copper-clad plate as well as preparation method and application of the glue solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. Preparation of glue

[0032] The glue solution of the present embodiment is made up of the component of following parts by weight:

[0033]

[0034] The preparation steps of glue solution are as follows:

[0035] After cleaning the glue mixing tank with acetone, put in the above solvent 1, solvent 2 and interface binder according to the weight part, after adding the curing agent, stir at 1500r / min for 2 hours to completely dissolve the curing agent, and then add the remaining components in sequence , Stir at a speed of 1000r / min for 3h, then stir at a speed of 500r / min for 2h, after the gelation time of the glue is tested, the glue is prepared.

[0036] 2. Preparation of prepreg

[0037] The glue solution prepared above was made into a prepreg in a conventional manner; wherein, the controlled glue content was 42%, the fluidity was 38%, the gelation time was 150s, and the volatile matter was <0.5%.

[0038] 3. Preparation of Halogen-free Medium Tg Medium Loss Co...

Embodiment 2

[0048] 1. Preparation of glue

[0049] The glue solution of the present embodiment is made up of the component of following parts by weight:

[0050]

[0051]

[0052] The preparation steps of glue solution are as follows:

[0053] After cleaning the glue mixing tank with acetone, put in the above solvent 1, solvent 2 and interface binder according to the weight part, after adding the curing agent, stir at 1500r / min for 2 hours to completely dissolve the curing agent, and then add the remaining components in sequence First, stir at a speed of 1200r / min for 2h, then stir at a speed of 600r / min for 1h, and after the gelation time of the glue is tested, the glue is prepared.

[0054] 2. Preparation of prepreg

[0055] The glue solution prepared above is made into a prepreg in a conventional manner; wherein, the glue content is controlled to be 40%, the fluidity is 40%, the gelation time is 120s, and the volatile matter is <0.5%.

[0056] 3. Preparation of Halogen-free Medi...

Embodiment 3

[0060] 1. Preparation of glue

[0061] The glue solution of the present embodiment is made up of the component of following parts by weight:

[0062]

[0063]

[0064] The preparation steps of glue solution are as follows:

[0065] After cleaning the glue mixing tank with acetone, put in the above solvent 1, solvent 2 and interface binder according to the weight part, after adding the curing agent, stir at 1500r / min for 2 hours to completely dissolve the curing agent, and then add the remaining components in sequence , Stir at a speed of 800r / min for 4 hours, and then stir for 3 hours at a speed of 400r / min. After the gelation time of the glue is tested, the glue is prepared.

[0066] 2. Preparation of prepreg

[0067] The glue solution prepared above was made into a prepreg in a conventional manner; wherein, the glue content was controlled to be 50%, the fluidity was 30%, the gelation time was 180s, and the volatile matter was <0.5%.

[0068] 3. Preparation of Haloge...

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Abstract

The invention provides a glue solution for halogen-free medium-Tg medium-loss copper-clad plate as well as preparation method and application of the glue solution. The glue solution is prepared from the following components in parts by weight: 25-35 parts of biphenyl epoxy resin, 15-25 parts of isocyanate epoxy resin, 10-30 parts of o-cresol formaldehyde epoxy resin, 10-20 parts of phenolic resin,1-5 parts of phosphorus-containing phenolic resin, 5-15 parts of benzoxazine resin, 0.2-0.5 part of curing accelerator, 50-70 parts of inorganic filler, 0.1-0.3 part of an interface bonding agent, and 120-150 parts of a solvent. A halogen-free medium-Tg medium-loss copper-clad plate prepared from the glue solution has the advantages of favorable flame retardancy, favorable heat resistance, low water absorptivity and excellent dielectric properties.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a halogen-free glue for medium-Tg medium-loss copper-clad laminates and a preparation method and application thereof. Background technique [0002] Since February 2003, the European Electrical and Electronic Equipment Waste Act and the Electrical and Electronic Equipment Restricted Use of Hazardous Substances Regulations have stipulated that halogen-containing resistors such as polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) headed by polybrominated diphenyl ethers Restrictions on fuels have promoted the development of halogen-free copper clad laminates. In January 2008, Intel Corporation proposed to hold a symposium on the theme of "promoting halogen-free electronic products", promising to realize halogen-free products of Intel Corporation within a few years, which once again promoted the development of halogen-free copper clad laminates....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08L61/06C08L61/34C08K3/36C08K3/34C08K5/54C08J5/24B32B15/20B32B15/092B32B15/098B32B15/08B32B27/38B32B27/42B32B27/28B32B27/26B32B27/20B32B27/24B32B27/18B32B27/06B32B33/00
CPCC08L63/00C08J5/24B32B15/20B32B15/092B32B15/098B32B15/08B32B27/38B32B27/42B32B27/28B32B27/26B32B27/20B32B27/24B32B27/18B32B33/00C08L2205/035C08L2205/025C08L2205/02C08L2203/20C08L2201/02C08L2201/22C08L2201/08B32B2307/3065B32B2307/206B32B2307/306B32B2307/714
Inventor 李广元李永平钟英雄谢长乐
Owner 林州致远电子科技有限公司
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