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Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product

A technology of photosensitive solder resist ink and alkali development, applied in ink, optical mechanical equipment, applications, etc., can solve the problems of being unable to adapt to FPC applications, not having too many requirements for flexibility, and poor folding resistance, so as to achieve good adhesion to substrates , good flexibility, short dry time

Inactive Publication Date: 2015-06-17
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional solder resist inks are developed for rigid PCBs, and they pay more attention to the adhesion, hardness, and chemical resistance of the cured film, but do not have too many requirements for its flexibility, so the coating film generally has a higher hardness after curing. And the folding resistance is poor, and it cannot adapt to the application of FPC dynamic flexibility

Method used

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  • Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product
  • Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product
  • Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0052] The formula is as follows:

[0053] Component A:

[0054]

[0055] Component B:

[0056]

[0057] The preparation steps are as follows:

[0058] According to the above formula, add the various materials in component A into the batching container, stir and mix well, then send it to the three-roller mill for dispersion and grinding for two to three times until the fineness is ≤10μm to obtain the component A of the solder resist ink ; The same method to obtain the B component of the solder resist ink. Store airtight at low temperature. Before use, mix the two components A and B in a ratio of 1:1 before use.

[0059] The film forming method is as follows:

[0060] Screen print the above ink on the FPC, pre-bake it at 85°C for 25min, then expose it to light for 60s with UV (wavelength λ=365nm, irradiation distance 20cm) for curing, develop it with 2% sodium carbonate aqueous solution, and then heat it at 140°C After curing for 30 minutes, a dense and smooth ink f...

example 2

[0070] The formula is as follows:

[0071] Component A:

[0072]

[0073] Component B:

[0074]

[0075] The preparation and film-forming methods are the same as in Example 1, and the test results are shown in Table 1.

example 3

[0077] The formula is as follows:

[0078] Component A:

[0079]

[0080]

[0081] Component B:

[0082]

[0083] The preparation and film-forming methods are the same as in Example 1, and the test results are shown in Table 1 below.

[0084] Table 1 Example 1-Example 3 test results

[0085]

[0086] It can be seen from Table 1 that the solder resist inks obtained in the above three examples all have good process performance: the surface dry time is short (not more than 25min at 85°C), and the development is clear and fast (not more than 2min in 2% Na2CO3 aqueous solution) , thereby greatly improving production efficiency; the cured coating film has the advantages of high hardness (pencil hardness ≥ 4H), good adhesion to the substrate (adhesion level), good chemical resistance and bending resistance, etc., and can meet the requirements of micro Performance requirements of solder resist ink for circuit FPC.

[0087] In addition, reduce the amount of the alkali-s...

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PUM

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Abstract

The invention discloses an alkaline-developable photosensitive solder resist ink for FPC. The alkaline-developable photosensitive solder resist ink comprises alkali-soluble photosensitive resin, active diluent, pigment, epoxy resin, photoinitiator, flexibilizer and filler. The invention further discloses a preparation method for the alkaline-developable photosensitive solder resist ink used for FPC, application of the alkaline-developable photosensitive solder resist ink used for FPC and FPC products using the alkaline-developable photosensitive solder resist ink used for FPC. With the solder resist ink, a cured coating has high hardness, good adhesion on a substrate, good chemical resistance and good flexural endurance.

Description

technical field [0001] The invention relates to the field of manufacturing flexible printed circuit boards (FPC), in particular to an alkali-developed photosensitive solder resist ink for FPC, a preparation method, an application and a product. Background technique [0002] The cover layer is an insulating protective layer covering the surface of the flexible printed circuit board (FPC). Its function is to prevent the FPC from being corroded by dust, moisture, and chemicals and to reduce the stress during the bending process. In particular, it has high toughness during a long bending period, so that FPC can exert its important advantages. The cover layer usually chooses the same adhesive as the base material as the cover layer, such as PET and PI film. This type of material has good physical balance properties and high reliability, especially for dynamic flexible applications that require high bendability. However, its processing technology is relatively complicated, and i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/107G03F7/027H05K3/28H05K1/02
CPCC09D11/101C09D11/107G03F7/027H05K1/02H05K3/28
Inventor 张双庆刘萍
Owner GUANGDONG DANBOND TECH
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