Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An ultra-steep average subthreshold swing tunneling field effect transistor and its preparation method

A tunneling field effect and transistor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of high subthreshold slope of devices and unfavorable application of TFET devices, etc., and achieve large-band tunneling current increase amount, steep average subthreshold slope, and simple preparation process

Active Publication Date: 2018-08-28
PEKING UNIV
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, unlike traditional MOSFETs, the subthreshold slope in the subthreshold region of the TFET transfer curve changes and gradually increases with the increase of the gate voltage, which leads to a TFET transfer characteristic lower than 60mV / dec The corresponding range of subthreshold slope is small, and the average subthreshold slope of the device is relatively high, which is not conducive to the application of TFET devices in the field of ultra-low power consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An ultra-steep average subthreshold swing tunneling field effect transistor and its preparation method
  • An ultra-steep average subthreshold swing tunneling field effect transistor and its preparation method
  • An ultra-steep average subthreshold swing tunneling field effect transistor and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The implementation method of the ultra-steep average sub-threshold swing tunneling field-effect transistor with multi-layer source structure of the present invention will be further described through specific embodiments below in conjunction with the accompanying drawings.

[0040] The specific implementation steps are as figure 2 - As shown in Figure 7: (This example takes N-type devices as an example, and P-type devices can be deduced by analogy)

[0041] 1. The substrate doping concentration is lightly doped (about 1E13cm -3 -1E15cm -3 ), a layer of silicon dioxide is initially thermally oxidized on the Si substrate 1 with a crystal orientation of , with a thickness of about 10 nm, and a layer of silicon nitride (Si 3 N 4 ), with a thickness of about 100nm, and then use shallow trench isolation technology to deposit isolation materials to fill deep holes to make active area STI isolation 2, and then perform CMP, such as figure 2 shown.

[0042] 2. Float away t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a super-steep mean sub-threshold swinging tunnelling field effect transistor and a preparation method thereof, and belongs to the field of a field effect transistor logic device in CMOS (complementary metal oxide semiconductor) super-large-scale integration (ULSI). A tunneling source zone of the tunnelling field effect transistor is a multi-layered structure, and different layers are semiconductors with continuously changed energy gaps, and the energy gaps are gradually increased along the direction perpendicular to the appliance surface, wherein the energy gap at the lowermost layer is the minimum, the energy gap at the uppermost layer is the maximum, and every energy gap in the middle is continuously changed. The super-steep mean sub-threshold swinging tunnelling field effect transistor can effectively inhibit the sub-threshold slope degradation phenomenon in the appliance transfer characteristics while obviously reduces the mean sub-threshold gradient of the tunnelling field effect transistor, and keep the steep and straight minimum sub-threshold gradient.

Description

technical field [0001] The invention belongs to the field of CMOS ultra-large scale integrated circuit (ULSI) field-effect transistor logic devices, and in particular relates to a multi-layer source structure ultra-steep average sub-threshold swing tunneling field-effect transistor and a preparation method thereof. Background technique [0002] Since the birth of integrated circuits, microelectronics integration technology has been developing continuously in accordance with "Moore's Law", and the size of semiconductor devices has been continuously reduced. As semiconductor devices enter the deep submicron range, traditional MOSFET devices are limited by the conduction mechanism of self-diffusion drift, and the subthreshold slope is limited by the thermoelectric potential kT / q, which cannot be reduced synchronously with the reduction of device size. As a result, the reduction of leakage current of MOSFET devices cannot meet the requirements of device size reduction, the energ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/739H01L29/08H01L21/331
CPCH01L29/0847H01L29/66477H01L29/78
Inventor 黄如吴春蕾黄芊芊王佳鑫王阳元
Owner PEKING UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products