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Aluminium-scandium rotating target material and preparation method thereof

A technology of rotating target and aluminum scandium, which is applied in metal material coating technology, ion implantation plating, pressure inorganic powder plating, etc., can solve the problems of reducing film quality, increasing target cost, and target arcing, etc., to achieve Simple process, convenient operation, high density effect

Active Publication Date: 2015-07-29
亚芯半导体材料(江苏)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, vacuum melting and vacuum hot pressing sintering methods are mainly used to prepare small-sized alloy rotating targets. Large-sized targets are spliced ​​and bound by small-sized targets. The price of indium solder is expensive, resulting in an increase in the cost of the target.
In addition, there are gaps in splicing and binding targets, which can easily lead to arcing of the target during the sputtering process and reduce the quality of the film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This embodiment is a method for preparing an aluminum-scandium rotating target, comprising the following steps:

[0030] (1) Powder preparation: After mechanically mixing aluminum powder and scandium powder, sintering in vacuum at 400°C for 8 hours, putting them into a planetary ball mill and grinding for 6 hours, the speed of the ball mill is 800r / min, and sieving to obtain 150-800 mesh powder.

[0031] (2) Substrate pretreatment: Mechanical grinding to remove the oxide layer on the surface of the stainless steel substrate, ultrasonic cleaning for 40 minutes, and finally sandblasting the substrate tube. The sandblasting treatment uses brown corundum with a particle size of 18 mesh.

[0032] (3) Spraying primer layer: Spray a nickel-aluminum alloy primer layer with a thickness of 0.2 mm on the pretreated substrate tube by using an arc spraying process. Spraying parameters are: voltage 29V, current 150A, wire feeding speed 11mv, compressed air pressure 0.5Mpa.

[0033] ...

Embodiment 2

[0036] This embodiment is a method for preparing an aluminum-scandium rotating target, comprising the following steps:

[0037] (1) Powder preparation: After mechanically mixing aluminum powder and scandium powder, sintering in vacuum at 450°C for 6 hours, putting them into a planetary ball mill for grinding for 7 hours at a speed of 800r / min, and sieving to obtain 150-800 mesh powder.

[0038] (2) Substrate pretreatment: Mechanical grinding to remove the oxide layer on the surface of the stainless steel substrate, ultrasonic cleaning for 40 minutes, and finally sandblasting the substrate tube. The sandblasting treatment uses brown corundum with a particle size of 18 mesh.

[0039] (3) Spraying primer layer: A nickel-aluminum alloy primer layer with a thickness of 0.15 mm was prepared on the pretreated substrate tube by using an arc spraying process. Spraying parameters are: voltage 30V, current 190A, wire feeding speed 15mv, compressed air pressure 0.6Mpa.

[0040] (4) Contr...

Embodiment 3

[0043] This embodiment is a method for preparing an aluminum scandium target, comprising the following steps:

[0044] (1) Powder preparation: After mechanically mixing aluminum powder and scandium powder, vacuum sinter at 300°C for 5 hours, put them into a planetary ball mill for 5 hours, and the ball mill rotates at 700r / min, and sieve to obtain 150-800 mesh powder.

[0045] (2) Substrate pretreatment: Mechanical grinding to remove the oxide layer on the surface of the stainless steel substrate, ultrasonic cleaning for 30 minutes, and finally sandblasting the substrate tube. The sandblasting treatment uses brown corundum with a particle size of 18 mesh.

[0046] (3) Spraying primer layer: A nickel-aluminum alloy primer layer with a thickness of 0.25 mm was prepared on the pretreated substrate tube by using an arc spraying process. Spraying parameters are: voltage 25V, current 210A, wire feeding speed 12mv, compressed air pressure 0.4Mpa.

[0047] (4) Controllable atmosphere c...

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Abstract

The invention discloses an aluminium-scandium rotating target material and a preparation method thereof. The preparation method comprises the following steps: performing sintering, ball milling and screening to prepare aluminium-scandium powder, pretreating a stainless-steel base body pipe, spraying an alloy base coat by using an electric arc spraying method, and spraying aluminium-scandium powder on a stainless-steel base body containing the alloy base coat by using a controlled atmosphere cold spraying method, so as to prepare the rotating target material. The process parameters are that when a vacuum unit is used to vacuumize a spraying cavity, and circulating protecting gas, namely, argon gas, is fed, the operating temperature at the spray nozzle inlet is 300-700 DEG C, and the pressure at the spray nozzle inlet is 2-5 Mpa, the working gas is argon gas, the pressure of argon gas is 2.5-4.5 Mpa, the temperature of argon gas is 400-900 DEG C, the gas flow is 20-50 m<3> / h, the spraying distance is 40-60 mm, the powder feeding gas flow is 200-400 l / h, and the powder feeding amount is 30-60 g / min. The prepared aluminium-scandium rotating target material is compact in texture, high in purity and uniform in component, the diameter and the length of the target material are not limited, the length can reach 4,000 mm, the thickness is 3-15 mm, the relative density of the target materials is larger than or equal to 97%, the purity is larger than or equal to 99.99%, and the oxygen content is less than or equal to 200 ppm.

Description

technical field [0001] The invention relates to a target and target preparation technology, in particular to an aluminum-scandium rotating target and a method for preparing the aluminum-scandium rotating target by cold spraying with a controlled atmosphere. Background technique [0002] Rotating targets are widely used in the fields of flat-panel display and large-scale integrated circuits, which require the rotating targets to have the advantages of high purity, high density, and large-scale integration. [0003] At present, vacuum melting and vacuum hot pressing sintering methods are mainly used to prepare small-sized alloy rotating targets. Large-sized targets are spliced ​​and bound by small-sized targets. Indium solder is expensive, resulting in increased target costs. In addition, there are gaps in splicing and binding targets, which can easily lead to arcing of the target during sputtering and reduce the quality of the film. [0004] In order to meet higher coating r...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C24/04C22C21/00
Inventor 徐从康
Owner 亚芯半导体材料(江苏)有限公司