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Self-repairing sensing chip and preparation method thereof

A sensor chip and self-repairing technology, applied in the field of sensors, can solve the problems of difficult design and manufacturing methods, and no method for systematically preparing self-repairing sensors, and achieve good scalability, low cost, and mature technology

Inactive Publication Date: 2015-08-12
RENMIN UNIVERSITY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because they have different self-healing properties from traditional electronic components, they are called next-generation electronic components. As self-healing electronic components with important application value, their design and manufacturing methods have always been a difficult point. A facile and systematic method for fabricating self-healing sensors

Method used

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  • Self-repairing sensing chip and preparation method thereof
  • Self-repairing sensing chip and preparation method thereof
  • Self-repairing sensing chip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Embodiment 1, the preparation of self-repairing sensor chip

[0051] 1. Preparation of supramolecular polymer materials based on hydrogen bonds:

[0052] Mix polybasic mixed acid and divinyltriamine at a mass ratio of 5:2, and react under nitrogen atmosphere at 160°C for 24 hours to obtain intermediate product I. Dissolve intermediate product I in chloroform, and then the volume ratio of water to methanol is The 2:1 mixed solution was extracted three times, and finally the solvent was removed in vacuo to obtain the intermediate product II; 15% urea of ​​the same mass was added to the intermediate product II, and the reaction was carried out at 135°C for 24 hours under a nitrogen atmosphere to obtain the hydrogen bond-based Supramolecular polymer materials;

[0053] Wherein the multi-component mixed acid can be composed of diacid containing 85% mass fraction, 10% triacid and the balance of octadecanoic acid, the structural formula of the diacid is shown in formula I, an...

Embodiment 2

[0063] Embodiment 2, the preparation of self-repairing sensor chip

[0064] 1. Preparation of 1-octyl-3-methylimidazolium hexafluorophosphate doped with iron ferric oxide nanoparticles coated with silicon dioxide at a concentration of 1% by mass

[0065] 3.24gFeCl 3 , 2.74gFeCl 2 ·H 2 O was dissolved in about 75ml of water, and 30ml of polyethylene glycol (PEG, molecular weight: 4000) aqueous solution with a mass fraction of 10% was added, and then concentrated ammonia water was added dropwise under stirring, and stirred for 1 hour at 80°C in a water bath, while stirring Nitrogen gas flowed while heating, then centrifuged, washed with water and ethanol three times respectively, and then dried in a vacuum oven at 60°C to obtain ferric oxide nanoparticles; take 1g of ferric oxide nanoparticles obtained, add 30ml of water and 150ml of ethanol Ultrasound in a beaker for 15 minutes, pour the liquid into a three-necked flask and heat it to 60°C, then add 2ml of concentrated ammon...

Embodiment 3

[0068] Embodiment 3, the preparation of self-repairing sensor chip

[0069] The preparation method is the same as in Example 1, except that the micro-channel 4 is filled with pure ionic liquid (1-octyl-3-methylimidazolium hexafluorophosphate), that is, a self-repairing sensor chip (also known as a self-repairing sensor chip) is obtained. Repair the temperature sensor chip).

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Abstract

The invention discloses a self-repairing sensing chip and a preparation method thereof. The self-repairing sensing chip comprises a chip body with a micro channel therein; two ends of the micro channel are communicated with the outside through openings formed in the chip body, so that electrode interfaces can be formed; an electrode matched with the electrode interfaces is connected between the electrode interfaces; and the micro channel is filled with ionic liquid or nanoparticle doped ionic liquid. The self-repairing sensing chip of the invention is applied to the sensor field. After the self-repairing sensing chip of the invention is damaged by external factors, the sensing performance of the self-repairing sensing chip can be recovered, and the sensing performance can be like that of the undamaged self-repairing sensing chip. The self-repairing sensing chip can be filled with ionic liquid, so that a temperature sensor can be formed; the self-repairing sensing chip can be filled with acidified carbon nanotubes, so that a near infrared sensor can be formed; the self-repairing sensing chip can be filled with doped silicon dioxide coated ferroferric oxide nanoparticles, so that an alternating electromagnetic field sensor can be formed; and therefore, the self-repairing sensing chip has excellent expansibility. Technologies used in a preparation process are mature. Polymer self-repairing cost is low. Thermoplastic materials are adopted, so that the self-repairing sensing chip can be formed through direct printing and molding. The method is simple and can be applicable to large scale production.

Description

technical field [0001] The invention relates to a self-repairing sensor chip and a preparation method thereof, in particular to a self-repairing temperature sensor chip filled with an ionic liquid or an ionic liquid doped with nanoparticles and a preparation method thereof, belonging to the field of sensors. Background technique [0002] Sensors are the main ways and means to obtain information in the fields of nature and production in the information age. They have important applications in a wide range of fields such as industrial production, space development, ocean exploration, environmental protection, resource investigation, medical diagnosis, bioengineering, and even cultural relics protection. , is an important part of instrument design and manufacture. At present, sensors are mainly made of materials with certain rigidity such as metals or semiconductors. Once damaged by external forces, their sensing performance is generally difficult to recover, showing vulnerabil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D5/12G01K7/00
Inventor 王亚培贺泳霖
Owner RENMIN UNIVERSITY OF CHINA
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