A laser shock micro-punching device

Abstract

The invention relates to the field of micro manufacturing, in particular to a micro blanking device based on laser shock. The micro blanking device is characterized in that the upper end face of a lower die is covered with a metal film, an absorbing layer, a restraint layer and a mask in sequence, the mask is exactly opposite to the lower die, and relative positions are guaranteed through a clamp system. The appearance of the mask is similar to that of the lower die. The dimension of the mask is 4-15 microns larger than that of the lower die. One part of high-energy pulse laser light radiates on the surface of the mask and is reflected, and the other part of the high-energy pulse laser light passes through the restraint layer, forms laser spots in specific shapes and radiates on the surface of the absorbing layer. The absorbing layer absorbs laser energy and produces plasma explosion under the restraint of the restraint layer, so shock waves are formed. Under the action of the shock waves having specific outlines and the low die, the part, covered with the mask, of the metal film is reserved, the peripheral part is cut off, and then a flat micro part having a specific shape is obtained.

Description

technical field [0001] The invention relates to the field of micro-manufacturing, in particular to a laser shock micro-punching device. Background technique [0002] With the rapid development of micro-electromechanical systems, the demand for micro-parts is also increasing; currently, the processing technologies for MEMS systems mainly include LIGA, photolithography, etching, micro-extrusion, micro-imprinting, and micro-sheet metal. , micro-drawing, micro-stamping, micro-forging, micro-rolling and micro-die-free forming processes, these processes are limited by problems such as low processing efficiency, high cost, and environmental pollution. [0003] In recent years, with the rapid development of laser technology, laser technology has been widely used in the manufacture of micro-parts. The use of high-power pulsed laser and the mechanical effect of the interaction between materials has attracted more and more attention in the field of material processing. It has been wid...

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Problems solved by technology

[0002] With the rapid development of micro-electromechanical systems, the demand for micro-parts is also increasing; currently, the processing technologies for MEMS systems mainly include LIGA, photolithography, etching, micro-extrusion, micro-imprinting, and micro-sheet metal. , micro-drawing, micro-stamping, micro-forging, micro-rolling and micro-die-free forming processes, these processes are limited by problems such as low processing efficiency, high cost, and environmental pollution

[0003] In recent years, with the rapid development of laser technology, laser technology has been widely used in the manufacture of micro-parts. The use of high-power pulsed laser and the mechanical effect of the interaction between materials has attracted more and more attention in the field of material processing. It has been widely used in the preparation of micro-parts; Chinese patents ZL201010505869.3 and ZL201010505882.9 proposed a method of using laser shock waves to load flyers, so that the flyers can obtain a kinetic energy and hit the workpiece to achieve micro-forming of the workpiece. In this method, the flyer Due to the action of high-energy laser shock waves, the sheet will undergo severe plastic deformation, and the severely plastically deformed flyer hits the surface of the workpiece, making the obtained micro-formed workpiece uneven; because the flyer flies in the air, there will be a large Momentum loss, thereby greatly reducing the forming effect; in addition, the cutting of parts cannot be realized by the method of flying sheet impact; Chinese patent ZL201110239514.9 proposes a micro-blanking and forming method based on the laser shock wave effect. In the post-forming method, when cutting, the lower part of the workpiece is air. Since the laser shock wave cannot be uniform in the action area, the workpiece will produce irregular deformation, which will affect the forming accuracy of the workpiece; because the laser shock wave acts on both the blank and the Therefore, it is impossible to control the blanking gap, which affects the dimensional accuracy and section quality of the workpiece; in addition, when the workpiece is cut and formed under the action of the laser shock wave, the laser shock wave passes through the workpiece and acts on the shearing die. The cutting edge of the mold will produce plastic deformation under the action of the shock wave, which will affect the service life of the mold; in addition, the above three patents cannot process micro-parts with complex shapes

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