Photoresist

A photoresist and photoinitiator technology, applied in the photoresist field, can solve the problems of low photoresist hardness and poor surface drying performance, and achieve the effects of high photosensitivity, high hardness and preventing adhesion

Inactive Publication Date: 2015-08-26
SHANGHAI PHICHEM MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem of low hardness and poor surface drying performance of the photoresist in the prior art after drying, the embodiment of the present invention provides a photoresist

Method used

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Embodiment 1

[0037] An embodiment of the present invention provides a photoresist, which includes the following components by weight: 10-50 parts of alkali-soluble resin, 5-25 parts of photopolymerizable monomer, 0.5-8 parts of photoinitiator, 20 -80 parts of solvent, 0.1-5 parts of pigment, the alkali-soluble resin is made of at least one of ethylenically unsaturated monomers and propylene-based unsaturated monomers, (meth)acrylic acid monomers, and maleic anhydride monomers The copolymerization reaction is obtained, and the glass transition temperature of the alkali-soluble resin is greater than or equal to 120°C.

[0038] The embodiment of the present invention provides a kind of photoresist, by 10-50 parts (hereinafter referred to as parts by weight) alkali-soluble resin whose glass transition temperature is greater than or equal to 120°C, 5-25 parts of photopolymerizable monomer, 0.5-8 The synergistic effect of the photoinitiator, 20-80 parts of solvent and 0.1-5 parts of pigment can ...

Embodiment 2

[0040] An embodiment of the present invention provides a photoresist, which includes the following components by weight: 10-50 parts of alkali-soluble resin, 5-25 parts of photopolymerizable monomer, 0.5-8 parts of photoinitiator, 20 - 80 parts of solvent, 0.1-5 parts of pigment, the glass transition temperature of the alkali-soluble resin is greater than or equal to 120 ° C, the alkali-soluble resin is composed of at least one of ethylenically unsaturated monomers and propylene-based unsaturated monomers and (Meth) acrylic acid monomer and maleic anhydride monomer are obtained through copolymerization reaction.

[0041] Wherein, the ethylene-based unsaturated monomer and propylene-based unsaturated monomer all have the following structural units:

[0042]

[0043] R is hydrogen or methyl;

[0044] R1 is phenyl, hydroxyphenyl, methylphenyl, ethylphenyl, naphthyl or nitrile;

[0045] Both R2 and R3 are alkyl groups with 1-8 carbon atoms, hydroxyalkyl groups with 1-8 carbon...

Embodiment 3

[0065] The embodiment of the present invention provides a photoresist, which includes the following components by weight: 25 parts of alkali-soluble resin, 12 parts of photopolymerizable monomer, 5 parts of photoinitiator, 54.5 parts of solvent, 0.5 part of pigment , and 3 parts of stabilizer.

[0066] Among them, the alkali-soluble resin is composed of 20% by weight of methacrylic acid, 60% of maleic anhydride and 20% of styrene, and the glass transition temperature of the alkali-soluble resin is 137 ° C, and the weight average molecular weight is 74200 (Mw), the molecular weight distribution index is 2.27, and the acid value is 135mgKOH / g.

[0067] The photopolymerizable monomer is composed of 7 parts by weight of trimethylolpropane triacrylate, 2 parts of dipentaerythritol hexaacrylate, and 3 parts of 1,6-butanediol diacrylate; the photoinitiator consists of 3 parts by weight of 2-methyl-1-(4-methylthiophenyl)-2-morpholine-1-propanone, 1 part of 2-isopropylthioxanthone, 1 ...

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Abstract

The present invention discloses a photoresist, and belongs to the photoetching field. The photoresist comprises, by weight, 10-50 parts of an alkali-soluble resin, 5-25 parts of a photo polymerization monomer, 0.5-8 parts of a photoinitiator, 20-80 parts of a solvent, and 0.1-5 parts of a pigment, wherein at least one selected from an ethylene-based unsaturated monomer and a propylene-based unsaturated monomer, a (methyl) acrylic acid monomer, and a maleic anhydride monomer are subjected to a copolymerization reaction to obtain the alkali-soluble resin, and the glass transition temperature is more than or equal to 120 DEG C. According to the present invention, with the alkali-soluble resin having the glass transition temperature of more than or equal to 120 DEG C, the glass transition temperature of the photoresist can be significantly increased, and the conversion of the photoresist into the high elasticity state having a certain viscosity during the drying is avoided, such that the photoresist film coated on the PCB substrate and dried has characteristics of high hardness and good surface dry performance. The photoresist provided by the embodiments of the present invention has excellent scratch resistance and excellent plate stacking performance during the substrate stacking process.

Description

technical field [0001] The invention relates to the field of photolithography, in particular to a photoresist. Background technique [0002] Photoresist, also known as photoresist, can undergo crosslinking, curing or degradation reactions under the irradiation of light beams, and is often used to prepare PCB boards (Printed Circuit Board, printed circuit boards). Coat the photoresist on the substrate of the PCB board and dry it, then use a film sheet to cover the part to be etched on the substrate of the PCB board, and then expose, develop and etch the substrate of the processed PCB board , photoresist stripping and other steps to prepare a PCB board. In order to improve the production efficiency of PCB boards, the substrates of PCB boards coated with photoresist are usually dried and stacked until the substrates accumulate to a certain amount before subsequent operations such as exposure and development. [0003] Prior art photoresists generally include the following comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027
Inventor 钟亮刘翘楚黄康
Owner SHANGHAI PHICHEM MATERIAL CO LTD
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