Semiconductor lead frame surface treatment method
A lead frame and surface treatment technology, which is applied in the field of surface treatment of semiconductor lead frames, can solve the problems of loose welding of diaphragm layers and poor welding quality, and achieve excellent solderability, good solderability, and avoid oxidation.
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[0035] Example 1
[0036] This embodiment includes the following process steps:
[0037] A. Ultrasonic degreasing: Lead the power semiconductor lead frame into the ultrasonic degreasing agent for ultrasonic degreasing, and use sound wave vibration to loosen the oil on the surface to remove the grease remaining on the surface of the substrate during stamping. The temperature of the ultrasonic degreasing agent is 50°C (degrees Celsius), the solubility of the ultrasonic degreasing agent is 50g / L (grams per liter), and the ultrasonic degreasing time is 10S (seconds).
[0038] B. Perform electrolytic oil: Lead the power semiconductor lead frame into the electrolytic oil agent for electrolytic oil. Hydrogen gas is deposited on the surface during electrolysis to remove the grease on the surface to remove the grease remaining on the surface of the substrate during stamping. The temperature is 55°C, the concentration of electrolytic oil is 55g / L, and the time is 10S.
[0039] C. Perform sulfu...
Example Embodiment
[0045] Example 2
[0046] A. Ultrasonic degreasing: Lead the power semiconductor lead frame into the ultrasonic degreasing agent for ultrasonic degreasing, and use sound wave vibration to loosen the oil on the surface to remove the grease remaining on the surface of the substrate during stamping. The temperature of the ultrasonic degreasing agent is 55°C (degrees Celsius), the solubility of the ultrasonic degreasing agent is 55g / L (grams per liter), and the ultrasonic degreasing time is 15S (seconds).
[0047] B. Perform electrolytic oil: Lead the power semiconductor lead frame into the electrolytic oil agent for electrolytic oil. Hydrogen gas is deposited on the surface during electrolysis to remove the grease on the surface to remove the grease remaining on the surface of the substrate during stamping. The temperature is 50℃, the concentration of the electrolytic oil is 55g / L, and the time is 16S.
[0048] C. Sulfuric acid neutralization activation: Lead the power semi...
Example Embodiment
[0054] Example 3
[0055] A. Ultrasonic degreasing: Lead the power semiconductor lead frame into the ultrasonic degreasing agent for ultrasonic degreasing, and use sound wave vibration to loosen the oil on the surface to remove the grease remaining on the surface of the substrate during stamping. The temperature of the ultrasonic degreasing agent is 60°C (degrees Celsius), the solubility of the ultrasonic degreasing agent is 60g / L (grams per liter), and the ultrasonic degreasing time is 20S (seconds).
[0056] B. Perform electrolytic oil: Lead the power semiconductor lead frame into the electrolytic oil agent for electrolytic oil. Hydrogen gas is deposited on the surface during electrolysis to remove the grease on the surface to remove the grease remaining on the surface of the substrate during stamping. The temperature is 55°C, the concentration of electrolytic oil is 58g / L, and the time is 16S.
[0057] C. Perform sulfuric acid neutralization activation: Lead the power...
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