A solvent-resistant polyimide film with low thermal expansion coefficient and preparation method thereof
A technology of polyimide film and low thermal expansion coefficient, which is applied in the field of solvent-resistant and low thermal expansion coefficient polyimide film and its preparation, and can solve problems such as application troubles, high thermal expansion coefficient, and poor solvent resistance of the film , to achieve the effect of good application prospects
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Embodiment 1
[0036] In this embodiment, the polyimide resin material has the following structural formula:
[0037]
[0038] The specific preparation method is:
[0039] (1) Under nitrogen protection, mix 4.0 mmol) of 4,4-oxodiphthalic anhydride, 3.0 mmol of 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl , 0.98 mmol of 2,6-diaminobenzonitrile, 0.04 mmol of 4-aminobenzonitrile and 15 ml of m-cresol were added to a 50 mL reaction flask, then 0.1 ml of isoquinoline was added, and the reaction was heated and stirred at 190 °C After 8 hours, a viscous polyimide solution was obtained. When the reaction temperature dropped to 70°C, it was diluted with 20 milliliters of m-cresol and precipitated in 400 milliliters of ethanol. After suction filtration, the ethanol was refluxed and washed twice. Put into oven and dry, make polyimide resin;
[0040] (2), the prepared polyimide resin is configured into a solution with a concentration of 10% by weight with N,N-dimethylacetamide, and the solution i...
Embodiment 2
[0045] In the present embodiment, the ratio of diamine-containing nitrile group is increased, and the polyimide resin material has the following structural formula:
[0046]
[0047] The specific preparation method is:
[0048] (1) Under the protection of nitrogen, 4.0 mmol of 4,4-oxydiphthalic anhydride, 2.0 mmol of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, Add 1.98 mmol of 2,6-diaminobenzonitrile, 0.04 mmol of 4-aminobenzonitrile and 15 ml of m-cresol into a 50 mL reaction flask, then add 0.1 ml of isoquinoline, heat and stir at 190 °C for 8 hours , to obtain a viscous polyimide solution. When the reaction temperature drops to 80°C, dilute it with 20 ml of m-cresol and precipitate it in 400 ml of ethanol. Oven drying, obtained polyimide resin;
[0049] (2), the prepared polyimide resin is configured into a solution with a concentration of 10% by weight with N,N-dimethylacetamide, and the solution is evenly coated on a clean glass plate by casting method, The thic...
Embodiment 3
[0052] In this embodiment, the polyimide resin material has the following structural formula:
[0053]
[0054] The specific preparation method is:
[0055] (1) Under the protection of nitrogen, 4.0 mmol of 4,4-oxydiphthalic anhydride, 2.0 mmol of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, Add 1.99 mmol of 2,6-bis(3-aminobenzyl)benzonitrile, 0.02 mmol of 2-trifluoromethyl-4-aminobenzonitrile and 15 ml of m-cresol into a 50 mL reaction flask, and then Add 0.1 ml of isoquinoline, heat and stir at 200°C for 9 hours to obtain a viscous polyimide solution. When the reaction temperature drops to 60°C, dilute with 20 ml of m-cresol and precipitate in 400 ml of ethanol , after suction filtration, ethanol reflux, boil and wash twice, put into an oven to dry, and obtain polyimide resin;
[0056] (2), the prepared polyimide resin is configured into a solution with a concentration of 10% by weight with N,N-dimethylacetamide, and the solution is evenly coated on a clean glass pla...
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