Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility

A technology of bending workability and copper alloy plate, applied in the direction of metal rolling, etc., can solve the problem of unresearched punchability, etc., and achieve the effect of excellent adhesion

Active Publication Date: 2015-09-23
KOBE STEEL LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

Although the Fe-P-based copper alloy sheet of Patent Document 3 is excellent in strength and heat resistance, no study has been made on the stampability

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  • Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility
  • Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility
  • Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility

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Embodiment Construction

[0024] Hereinafter, the Fe—P-based copper alloy sheet of the present invention will be described more specifically.

[0025] (Chemical Composition of Fe-P Copper Alloy)

[0026] Fe contributes to the improvement of the strength and heat resistance of the Fe—P-based copper alloy sheet, and also has the effect of suppressing grain growth during hot rolling or recrystallization heat treatment. When the content of Fe is less than 1.6% by mass, the above effects are insufficient. On the other hand, if the Fe content is higher than 2.6% by mass, coarse Fe particles (a few μm or more in diameter) will be generated due to phase separation and crystallization during melting and casting, and the plating and etching properties will be reduced. Therefore, the content of Fe is 1.6 to 2.6% by mass, the lower limit is preferably 1.7% by mass, more preferably 1.8% by mass, and the upper limit is preferably 2.5% by mass, more preferably 2.4% by mass.

[0027] In addition to being helpful as ...

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Abstract

The invention provides a Fe-P based copper alloy sheet excellent in strength, heat resistance and bending processibility. The Fe-P based copper alloy sheet is composed of, by mass, 1.6 to 2.6% Fe, 0.01 to 0.15% P, 0.01 to 1.0% Zn, 0.1 to 0.5% Sn and / or Mg, 0.003% C, 0.05% Co, Si and Cr, and the balance being Cu and inevitable impurities. When observing crystal structures on a section in parallel with a rolling direction and perpendicular to the board plane with EBSD, the weighted average obtained by weighting equivalent circular diameter of grains with area is less than 10 micrometers. The conductivity is more than 50%IACS. The Vickers hardness is higher than 180Hv. When the equivalent circular diameter is 10 to 40 nm, the existence density of precipitated particles of Fe or Fe-P compound is more than 20 per square micrometers.

Description

technical field [0001] The present invention relates to an Fe-P-based copper alloy sheet that is excellent in strength, heat resistance, and bendability, and is suitable as a material for electrical and electronic components such as semiconductor lead frames, terminals, connectors, and bus bars. Background technique [0002] Copper and copper-based alloys can be used as materials for electrical and electronic components including lead frames because of their very high electrical and thermal conductivity. In recent years, thinner walls, thinner leads, and narrower pitches of lead frames have been increasingly advanced, and some even have a thickness of less than 100 μm, which requires very high strength. [0003] In addition, in the production of a lead frame, a strip material rolled with copper or a copper-based alloy to a predetermined thickness is subjected to a pressing process and an etching process to form a predetermined shape. In the press working, high-temperature h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00
CPCB21B2003/005C22C9/00C22F1/08
Inventor 尾崎良一
Owner KOBE STEEL LTD
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