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Preparation method and application method of solvent-free moisture-curable resin for synthetic leather

A technology of moisture curing resin and application method, which is applied in the field of synthetic leather, can solve the problems of serious pollution and inability to recycle, and achieve the effects of good coating flatness, solvent pollution problems, and process stability

Active Publication Date: 2015-10-28
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main solvents used in moisture curing resins are ethyl acetate, butyl acetate, etc. Due to the particularity of the moisture curing process, they generally cannot be recycled and cause serious pollution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0022] A preparation method of a solvent-free moisture-curable resin for synthetic leather: add polytetrahydrofuran glycol (PTMEG), isophorone diisocyanate (IPDI) and bismuth isooctanoate after vacuum dehydration in a three-necked flask, and slowly heat up to 75 The polymerization is carried out at ℃ to 80 ℃ for 1 to 1.5 hours to obtain a solvent-free moisture-curable resin for synthetic leather.

[0023] Among them, polytetrahydrofuran diol (PTMEG) and isophorone diisocyanate (IPDI) are fed according to the R value (the ratio of the isocyanate group in isophorone diisocyanate to the hydroxyl group in polytetrahydrofuran diol) of 1.8 to 2.0. The bismuth octoate is fed according to 0.1%-0.5% of the weight sum of isophorone diisocyanate and polytetrahydrofuran diol.

[0024] The application method of the solvent-free moisture-curable resin for synthetic leather obtained by the above-mentioned preparation method: during use, the solvent-free moisture-curable resin for synthetic l...

Embodiment 1

[0028] A method for preparing a solvent-free moisture-curable resin for synthetic leather. Polytetrahydrofuran diol, isophorone diisocyanate and bismuth isooctanoate are added to a reactor, and then the temperature is slowly raised to 75°C for 1.5 hours of polymerization. Obtain solvent-free moisture curing resin for synthetic leather;

[0029] Wherein, polytetrahydrofuran diol is vacuum dehydrated until the moisture is less than 0.08%, polytetrahydrofuran diol and isophorone diisocyanate are added according to the ratio of the isocyanate group in isophorone diisocyanate to the hydroxyl group in polytetrahydrofuran diol is 1.9 The addition of bismuth isooctoate is 0.2% of the weight sum of isophorone diisocyanate and polytetrahydrofuran diol.

[0030] The application method of the solvent-free moisture-curable resin for synthetic leather prepared by the above-mentioned preparation method, the solvent-free moisture-curable resin for synthetic leather and bis-N, N'-(methyl-butyl...

Embodiment 2

[0032] A method for preparing a solvent-free moisture-curable resin for synthetic leather. The polytetrahydrofuran diol, isophorone diisocyanate and bismuth isooctanoate after vacuum dehydration are added to a reactor, and then the temperature is slowly raised to 77° C. Polymerize for 1.2 hours to obtain a solvent-free moisture-curable resin for synthetic leather;

[0033] Wherein, after polytetrahydrofuran diol is vacuum dehydrated until the moisture is less than 0.08%, polytetrahydrofuran diol and isophorone diisocyanate are added according to the ratio of the isocyanate group in isophorone diisocyanate to the hydroxyl group in polytetrahydrofuran diol as 1.8 The amount of bismuth isooctanoate added is 0.1% of the sum of the weights of isophorone diisocyanate and polytetrahydrofuran diol.

[0034] The application method of the solvent-free moisture-curable resin for synthetic leather prepared by the above-mentioned preparation method, the solvent-free moisture-curable resin ...

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Abstract

The invention provides a preparation method and an application method of a solvent-free moisture-curable resin for synthetic leather. The preparation method is as below: adding polytetrahydrofuran glycol, isophorone diisocyanate and bismuth octoate to the reactor, heating to 75-80 DEG C, polymerizing for 1-1.5 h to obtain the solvent-free moisture-curable resin for synthetic leather. The application method is as below: mixing and stirring the solvent-free moisture-curable resin for synthetic leather and bis-N,N'-(methyl-butyl methylene)-diethylenetriamine, coating the mixed material on the synthetic leather surface by a roller coating method, curing at the temperature of 85-95 DEG C, then drying at 120-135 DEG C, and finally cooling and rolling. The solvent-free moisture-curable resin for synthetic leather obtained by the invention is used for surface moisture solidification process for synthetic leather, so as to obtain brightening surface with high brightness, water resistance and wear resistance. The application process does not produce contamination, and can solve the solvent pollution problem in synthetic leather moisture curing process.

Description

technical field [0001] The invention relates to the technical field of synthetic leather, in particular to a preparation method and application method of a solvent-free moisture curing resin for synthetic leather. Background technique [0002] Synthetic leather is a composite material that simulates the structure and performance of natural leather and can be used as a substitute for natural leather. Usually, the non-woven fabric impregnated with high molecular polymer is used as the simulated mesh layer, and the microporous polyurethane layer is used to simulate the grain layer. The front and back of the obtained synthetic leather are very similar to leather, and have certain air permeability Artificial leather is closer to natural leather. Widely used in making shoes, boots, bags and ball games. [0003] At present, the moisture curing process of synthetic leather is to roll-coat the moisture curing resin on the surface of the synthetic leather, and then cure it in an env...

Claims

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Application Information

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IPC IPC(8): D06M15/568C08G18/75C08G18/48C08G18/22
Inventor 马兴元高静黄玲丁博
Owner SHAANXI UNIV OF SCI & TECH
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