Sliver-plating electroplate liquid and preparation method thereof

An electroplating solution and silver-plating technology, which is applied in the field of silver-plating electroplating solution and its preparation, can solve problems such as unevenness, non-dense silver plating layer, and low hardness

Active Publication Date: 2015-11-11
JIANGSU AOGUANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The silver plating solution is an indispensable factor in the silver plating process. The performance of the silver plating solution directly affects the quality of the silver plating layer. At present, the most commonly used silver plating solution in the silver plating process is cyanide-containing Because cyanide is a highly toxic substance, this silver-plating solution containing cyanide will greatly endanger the health of silver-plating workers; and the cyanide-free silver-plating solution commonly used in the market The composition is relatively simple, and the silver plating layer electroplated with this silver plating solution is not dense, uneven, weak in adhesion, low in hardness, and will appear darkening and browning

Method used

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Examples

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preparation example Construction

[0015] The invention provides a kind of preparation method of silver plating electroplating solution, and this preparation method comprises:

[0016] (1) Mix soluble silver salt, potassium borohydride, 3-nitrophthalic acid, succinimide, methanesulfonic acid and water to obtain a mixture M1;

[0017] (2) adding alkali to the mixture M1 to adjust the pH to 10-12 to obtain a mixture M2;

[0018] (3) heat-treating the mixed solution M2, auxiliary complexing agent, alanine and glycerol to prepare a mixture M3;

[0019] (4) post-processing the mixture M3 to obtain a silver-plating electroplating solution;

[0020] Wherein, the auxiliary complexing agent is selected from one or more of citric acid, thiourea compounds and dithioethylene glycol.

[0021] In the present invention, the specific type of thiourea compound can be selected in a wide range, and from the consideration of complexing ability, preferably, the thiourea compound is selected from dimethylthiourea, diphenylthiourea...

Embodiment 1

[0032] (1) Mix 1kg silver methanesulfonate, 80g potassium borohydride, 150g 3-nitrophthalic acid, 220g succinimide, 100g methanesulfonic acid and 2.8kg water to obtain mixture M1;

[0033] (2) adding sodium hydroxide to the mixture M1 to adjust the pH to 11 to obtain a mixture M2;

[0034] (3) 1 kg of mixed solution M2, 200 g of citric acid, 150 g of alanine and 40 g of glycerol were heat-treated at 70° C. for 25 min to prepare mixture M3;

[0035] (4) Concentrate the mixture M3 to a water content of 20% under 1 Pa to prepare the silver plating solution A1.

Embodiment 2

[0037] (1) 1 kg of silver phenol-3-sulfonate, 50 g of potassium borohydride, 120 g of 3-nitrophthalic acid, 200 g of succinimide, 80 g of methanesulfonic acid and 2.5 kg of water were mixed to obtain a mixture M1;

[0038] (2) adding potassium hydroxide to the mixture M1 to adjust the pH to 10 to obtain a mixture M2;

[0039] (3) 1 kg of mixed solution M2, 150 g of dimethylthiourea, 100 g of alanine and 20 g of glycerol were heat-treated at 50° C. for 30 min to prepare mixture M3;

[0040] (4) Concentrate the mixture M3 to a water content of 15% under 0.5 Pa to prepare the silver plating solution A2.

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PUM

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Abstract

The invention discloses sliver-plating electroplate liquid and a preparation method thereof. The preparation method comprises the steps that (1) soluble silver salt, potassium borohydrate, 3-nitrophthalic acid, succinimide, methanesulfonic acid and water are mixed to obtain a mixture M1; (2) alkali is added to the mixture M1, and the pH value is adjusted to 10-12, and a mixture M2 is obtained; (3) the mixture M2, an auxiliary complexing agent, alanine and glycerinum are subjected to heat processing to obtain a mixture M3; and (4) the mixture M3 is post-processed to obtain the sliver-plating electroplate liquid. The auxiliary complexing agent is selected from one or several of citric acid, thiourea compounds and dithio-glycol. The sliver-plating electroplate liquid prepared through the method is stable in performance, and a silver coating obtained by the sliver-plating electroplate liquid in an electroplating mode is compact, even, high in adhesive force, high in hardness and not prone to darkening and browning.

Description

technical field [0001] The invention relates to the field of silver electroplating, in particular to a silver plating electroplating solution and a preparation method thereof. Background technique [0002] Electroplated silver plating is used to prevent metal corrosion, increase electrical conductivity, and reflect light. It is widely used in manufacturing industries such as electrical appliances, instruments, meters and lighting appliances. In the past two decades, my country's silver plating process has been greatly developed. [0003] The silver plating solution is an indispensable factor in the silver plating process. The performance of the silver plating solution directly affects the quality of the silver plating layer. At present, the most commonly used silver plating solution in the silver plating process is cyanide-containing Because cyanide is a highly toxic substance, this silver-plating solution containing cyanide will greatly endanger the health of silver-plati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46
Inventor 沈福建姚志国林海赵鑫
Owner JIANGSU AOGUANG ELECTRONICS
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