Manufacturing method for CEM-1 type copper clad laminate

A CEM-1, manufacturing method technology, applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problem of poor leakage resistance, tracking resistance, peel resistance, crack resistance and resistance of copper-clad laminate base paper. Poor impact performance, lack of UV light blocking and other problems, to achieve the effect of improving peel strength, improving glue toughness, and reducing curing time

Active Publication Date: 2015-11-18
忠信(太仓)绝缘材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (1) When not toughened, the cured product is generally brittle, with poor peeling, cracking and impact resistance
[0008] (2) Low adhesion to materials with low polarity (such as polyethylene, polypropylene, fluoroplastics, etc.)
[0009] (3) Some raw materials such as reactive diluents, curing agents, etc. have varying degrees of toxicity and irritation
[0012] However, the high-performance resin-modified epoxy resin used, but due to the presence of a large number of benzene rings, the base paper of the copper-clad laminate has poor tracking resistance.
Moreover, the use of such a modified epoxy resin requires a higher curing temperature when processing the board; in addition, the triazine-modified nitrogen-containing phenolic resin curing agent will react slowly at room temperature, so that the storage period of the adhesive sheet made In addition, the system does not have the function of blocking ultraviolet light

Method used

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  • Manufacturing method for CEM-1 type copper clad laminate
  • Manufacturing method for CEM-1 type copper clad laminate
  • Manufacturing method for CEM-1 type copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 25 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, finish the dropwise addition within 30 minutes, and raise the temperature to 70°C after the dropwise addition ℃, reacted for 2h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A type epoxy resin;

Embodiment 2

[0074] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 30 minutes, heat up to 50°C, add 20% NaOH aqueous solution dropwise, finish the dropwise addition within 60 minutes, and raise the temperature to 80°C after the dropwise addition ℃, reacted for 1.5h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A epoxy resin;

Embodiment 3

[0076] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 28 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, and finish the dropwise addition within 50 minutes, then raise the temperature to 75°C ℃, reacted for 2h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A type epoxy resin;

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PUM

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Abstract

The invention provides a manufacturing method for a CEM-1 type copper clad laminate. The method comprises the steps of: 1) preparing a fabric impregnation glue solution; 2) preparing a core material impregnation glue solution; 3) making the fabric; 4) making the core material; 5) stacking the obtained fabric and core material, then covering the stacked several substrates' upper surface with a copper foil, putting a layer of release film under the undersurface, then putting the materials between two stainless steel plates; 6) putting the product into a laminating machine to conduct heating and pressurization treatment, with the temperature being 170-175DEG C and the pressure being 1-2MPa, maintaining the pressure for 10-15min, then taking the product out, and carrying out cutting and inspection, thus obtaining the CEM-1 type copper clad laminate finished product. The method employs specially-made brominated bisphenol A epoxy resin and a plurality of preparations to cooperate to form the flue solution, and through optimized combination of the manufacturing process and manufacturing conditions, twice glue impregnation, and impregnation of two glue solution, the strength of the core material is ensured, and the high temperature resistant and high flame retardant copper clad laminate can be obtained.

Description

technical field [0001] The invention relates to a method for manufacturing a base paper of a CEM-1 type copper-clad laminate. Background technique [0002] Copper Clad Laminate (CCL), also known as copper clad laminate base paper, is made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. A plate-shaped material, referred to as copper clad laminate. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality and manufacturing of printed circuit boards The processability, manufacturing level, manufactu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/10B32B29/02D06M15/55
CPCB32B29/02B32B37/06B32B37/10B32B2260/021B32B2260/028B32B2260/046B32B2307/306B32B2307/3065B32B2457/08D06M15/55D06M2200/30
Inventor 张国强
Owner 忠信(太仓)绝缘材料有限公司
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