Preparation method of high thermal conductivity nano-carbon copper foil

Abstract

The invention relates to a preparation method of high thermal conductivity nano-carbon copper foil, comprising the following process steps: a) configuring a binder; b) configuring a heat dissipation slurry; c) coating and heating and drying treatment: the heat dissipation prepared in step b The slurry is evenly coated on the surface of the copper foil, and then heated and dried to obtain the desired high thermal conductivity nano-carbon copper foil.

Description

technical field [0001] The invention relates to a preparation method of a high thermal conductivity composite material, in particular to a preparation method of a high thermal conductivity nano-carbon copper foil. Background technique [0002] With the rapid development of microelectronics integration technology, the size and volume of electronic components are shrinking sharply. The resulting heat dissipation difficulties have seriously affected the accuracy and life of electronic devices, and have become the technical bottleneck of device miniaturization. This restricts the further development of integrated technology. Some data show that the stability of electronic devices decreases by about 10% for every 2°C increase in temperature; if it reaches 50°C, its lifespan is only about 17% of that at 25°C. Therefore, timely and efficient cooling of electronic devices is the key to their reliable use. Traditional heat-conducting materials such as metals, inorganic ceramics, an...

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Problems solved by technology

However, the easy agglomeration of nanoparticles will seriously hinder the effective transfer of heat, so the dispersion of nanoparticles has become a difficult point in the research of the preparation method of thermal conductive composites.