Adjusting liquid used for circuit board manufacturing and preparation method thereof

A circuit board and adjustment liquid technology, applied in the field of printed circuit manufacturing, can solve the problems of high price of adjustment liquid and high price, and achieve the effects of good adjustment effect, stable yield and cheap raw materials

Active Publication Date: 2015-12-09
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Common cationic surfactants in commercially available adjustment fluids are carbon chain-linked polyimidazolium salts and their analogues. Because the price of imidazole derivative monomers for the synthesis of polyimidazolium salts is relatively expensive, the price of adjustment fluids is relatively expensive.

Method used

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  • Adjusting liquid used for circuit board manufacturing and preparation method thereof
  • Adjusting liquid used for circuit board manufacturing and preparation method thereof
  • Adjusting liquid used for circuit board manufacturing and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Put 10.0g (69.3mmol) of 2-phenylimidazole, 20mL of water, 10mL of ethanol, and 0.5g of 50% sulfuric acid in a 100ml three-necked flask, put the flask in a 60°C oil bath, and pass it through a constant pressure dropping funnel under stirring Slowly add 11.0g (63.0mmol) of ethylene glycol diglycidyl ether, continue to stir for half an hour, increase the temperature of the oil bath to 90°C, and reflux for 20 hours to obtain a brown-red transparent liquid, which is the cationic surfactant solution.

Embodiment 2

[0036] Put 10.0g (69.3mmol) of 2-phenylimidazole, 24mL of water, 12mL of acetone, and 0.5g of 50% sulfuric acid into a 100ml three-necked flask, put the flask in a 60°C oil bath, and pass it through a constant pressure dropping funnel under stirring Slowly add 12.7g (63.0mmol) 1,4-butanediol diglycidyl ether, continue stirring for half an hour, increase the temperature of the oil bath to 85°C, and reflux for 24 hours to obtain a brownish-red transparent liquid, which is the cationic surfactant solution .

Embodiment 3

[0038] Put 10.0g (69.3mmol) of 2-phenylimidazole, 24mL of water, 12mL of N-methylpyrrolidone, and 0.5g of 50% sulfuric acid into a 100ml three-necked flask. Slowly add 12.7g (63.0mmol) 1,4-butanediol diglycidyl ether into the dropping funnel, continue stirring for half an hour, increase the temperature of the oil bath to 95°C, and reflux for 18 hours to obtain a brown-red transparent liquid, which is the cationic surface active agent solution.

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Abstract

The invention relates to an adjusting liquid used for circuit board manufacturing and a preparation method thereof. The preparation method comprises the following steps: adopting 2-substituent group imidazole which is relatively cheap and a diepoxy compound to carry out polymerization reaction to obtain a ester-chain-linked cationic surfactant solution; and directly diluting the ester-chain-linked cationic surfactant solution with water to obtain a mixture, and adding alkali to regulate the pH of the mixture to 9-11, thereby obtaining the adjusting liquid. The cationic surfactant solution is used as the adjusting liquid for a selective organic conductive coating process, so that good application effects are generated.

Description

technical field [0001] The invention relates to the technical field of printed circuit manufacturing, in particular to an adjustment liquid for circuit board manufacturing and a preparation method thereof. Background technique [0002] Circuit board hole conduction is the most important process of circuit boards. At present, the mainstream hole conduction process is chemical precipitation copper (PTH). Larger; 2. The copper sinking waste liquid contains complexing agents, which is difficult to handle and causes great damage to the environment; 3. The bath itself is a redox system, and it is difficult to control its activity; 4. The copper sinking process consumes a lot of hydropower resources. The waste water treatment cost is high, and the production cost is also high. In 1963 Rodovsky proposed the concept of direct conduction. After decades of development, three new types of hole conduction processes have been formed: 1. carbon / graphite system, 2. Pd / Sn colloidal system,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54
Inventor 肖亮高健刘彬云肖定军李卫明
Owner GUANGDONG TONESET SCI & TECH
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