Wafer level packaging method for coupling PLC planar waveguide chip and photoelectric device
A technology of optoelectronic devices and waveguide chips, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid devices, etc., and can solve the problems of difficulty in manufacturing waveguide end slope reflectors, low production efficiency, and difficulty in production quality control
Active Publication Date: 2015-12-09
湖南晶图科技有限公司
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Problems solved by technology
The existing technology relies on manual work, which takes too long and has low production efficiency; moreover, it is difficult to manufacture the beveled reflector on the end face of the waveguide, and it is also difficult to control the production quality
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[0046] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0047] Such as image 3 As shown, a mirror bridge wafer 14 for packaging includes a wafer and a photolithography process positioning mark 9, an optoelectronic device alignment mark 10, and a waveguide chip alignment mark 11 arranged on the wafer;
[0048] The photoelectric device alignment mark and the waveguide chip alignment mark are respectively arranged on the mirror bridge chip formed by cutting the wafer.
[0049] It also includes bonding components arranged on the wafer, and the bonding components 15 are copper pillar bonds or solder balls.
[0050] [The bonding part is used to fix the photoelectric device and waveguide chip on the mirror bridge chip or the mirror bridge assembly cut from the mirror bridge chip according to the alignment mark. 】
[0051] When the bonding component is a solder ball, a vertical positioning step is also arranged on...
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The invention discloses a wafer level packaging method for coupling a PLC planar waveguide chip and a photoelectric device. A mirror bridge wafer is designed ingeniously, and the mirror bridge wafer is used for realizing packaging. According to the processing precision that the present semiconductor chip assembly technology can achieve, the mirror bridge wafer is prepared by utilizing the lithography technology in precise wafer processing and existing semiconductor packaging equipment in the market; and the mirror bridge wafer serves as a bridge to realizing coupling centering and position fixation between the waveguide chip and a chip of the photoelectric device, so that the waveguide chip and the chip of the photoelectric device can be coupled and integrated on the wafer platform, and micron level centering precision can be achieved. The mirror bridge wafer is processed by the semiconductor photo-etching technology in a batch manner, relatively high aligning precision is maintained, so that the wafer material can be selected in a wide range, such as common glass, quartz glass, ceramics and silicon; and automatic large-scale production can be realized, the production cost is greatly reduced, and the production efficiency can be improved.
Description
technical field [0001] The invention belongs to the technical field of semiconductor packaging, and relates to a wafer-level packaging method for coupling a PLC planar waveguide chip and an optoelectronic device. Background technique [0002] The optical fiber used as the signal transmission medium in broadband communication, that is, the optical fiber, is manufactured according to the principle of total reflection of light at the interface of two media with different refractive indices. Usually SiO 2 (commonly known as glass) The refractive index of the core core is slightly higher than that of SiO 2 The refractive index of the outer cladding made of the material. The PLC planar waveguide is to use the semiconductor chip processing technology to make the waveguide structure similar to the optical fiber on the surface of the wafer. Using physical principles such as coherence, refraction, and diffraction of light, devices for optical fiber network communication with variou...
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IPC IPC(8): H01L23/544H01L21/02H01L21/50H01L21/60
Inventor 杨志援
Owner 湖南晶图科技有限公司