Epoxy grout and preparation method thereof

An epoxy cement, epoxy resin technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of short operating time, low bonding strength, low curing strength, etc., and achieve a wide ratio , high compressive strength and bonding strength, the effect of increasing adhesion

Active Publication Date: 2015-12-23
HUNAN QUANCHEN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The epoxy cement on the market has low curing strength, low bonding strength, short working time, and all contain solvents and migratable tougheners or plasticizers
Moreover, the epoxy cement currently on the market either contains toxic solvents or has a narrow proportion range, which is extremely inconvenient to use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Step 1: First, weigh 10 kilograms of bisphenol F epoxy resin, 5 kilograms of epoxy resin octyl glycidyl ether, 30 kilograms of bisphenol A type 128 epoxy resin, 5 kilograms of reactive diluent AGE, and 2 kilograms by weight. Kilogram of organosilicon coupling agent, it is stirred 20 minutes with 800 rpm on the high-speed disperser, it is fully stirred evenly, then add 10 kilograms of fumed silica, 15 kilograms of cement C35 type, 7 kilograms of silicon micropowder 1250 orders, 2 kilograms of titanium dioxide, 12 kilograms of talcum powder 1250 mesh, 1 kilogram of epoxy black paste, and then stir it evenly, grind it on a three-roller machine, and when the fineness is less than 50, it can be packed into barrels according to the weight to obtain the resin component a.

[0021] Step 2: Take 50 kg of polyamide curing agent, 15 kg of cashew nut shell oil modified curing agent, about 10 kg of DMP-30, mix well, then add 5 kg of organic bentonite, 5 kg of silicon micropowder 125...

Embodiment 2

[0025] Step 1 and Step 2 are the same as in Example 1.

[0026] Step 3: Mix resin component A and curing agent component B in a ratio of 3:1 to obtain epoxy cement.

[0027] The product can be cured in about four hours at room temperature. After seven days, the strength is 68.8 MPa, and the bonding strength is greater than 4 MPa, which is higher than the compressive strength of 45 MPa and 2.5 MPa of the cement on the market. There are many, and the water resistance is higher than that on the market. This product has a wide proportion, no solvent, no migratable plasticizer and solvent, and excellent comprehensive performance.

Embodiment 3

[0029] Step 1 and Step 2 are the same as in Example 1.

[0030] Step 3: Mix resin component A and curing agent component B in a ratio of 6:1 to obtain epoxy cement.

[0031] The product can be cured in about four hours at room temperature. After seven days, the strength is about 80 MPa, and the bonding strength is greater than 4 MPa, which is higher than the compressive strength of 45 MPa and 2.5 MPa of the cement on the market. There are many, and the water resistance is higher than that on the market. This product has a wide proportion, no solvent, no migratable plasticizer and solvent, and excellent comprehensive performance.

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Abstract

The invention discloses epoxy grout, comprising a component A and a component B by weight; the resin component A comprises bisphenol F epoxy resin, epoxy resin octyl group glycidyl ether, bisphenol A type 128 epoxy resin, a reactive diluent AGE, an organic silica coupling reagent, fumed silica, cement C35 type, silica powder, titanium dioxide, talcum powder and epoxy black slurry; the curing agent component B comprises the following components in ratio by weight: a polyamide curing agent, a cashew nut shell oil-modified curing agent, DMP-30 (Tris(dimethylaminomethyl)phenol), organobentonite, silica micropowder and superfine mica powder; a ratio of the resin component A to the curing agent component B is 3-6:1. The invention also discloses a preparation method of the epoxy grout. The compressive resistance and bonding strength of the expoxy grout after long-term curing are higher, and the water resistance is higher than that of expoxy grout on the market, and the expoxy grout is wide in ratio, has no solvent and non-transferability plasticizer and solvent and is excellent in comprehensive performance.

Description

technical field [0001] The invention relates to the field of water and soil construction, in particular to an epoxy cement used for reinforcing and waterproofing in subway tunnels, reservoirs and industrial and civil construction and a preparation method thereof. Background technique [0002] The epoxy mastics on the market have low curing strength, low bonding strength, short working time, and all contain solvents and migratable tougheners or plasticizers. Moreover, the epoxy cement currently on the market either contains toxic solvents, or has a narrow proportion range, which is extremely inconvenient to use. Contents of the invention [0003] In order to solve the above-mentioned problems existing in the existing epoxy mastic, the purpose of the present invention is to provide an epoxy mastic that is toxic and solvent-free, has a wide proportion, can be directly constructed on a wet surface, is easy to produce, and has excellent performance of the final cured product an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J177/00C09J11/04
Inventor 李浩宇雷威
Owner HUNAN QUANCHEN TECH
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