Height-adjustable well lid structure
A manhole cover and height technology, applied in the field of height-adjustable manhole cover structures, can solve problems such as subsidence, induction, and safety hazards, achieve excellent high temperature resistance, avoid well fall accidents, and improve heat resistance and weather resistance.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0046] A heat-resistant ink, consisting of the following components in parts by weight:
[0047] 35 parts of hyperbranched resin; 6 parts of bis((3,4-epoxycyclohexyl) methyl) adipate; 6 parts of polypropylene glycol diglycidyl ether; 6 parts of bisglycidyl hexahydrophthalate; 12 parts of calcium carbonate; 10 parts of aluminum hydroxide; 10 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of antioxidant; 1 part of dispersant; 13 parts of acetone; 2 parts of triethylene tetramine.
[0048] When in use, dry and solidify within 90-100°C for 2 minutes. The dry film thickness is controlled at 25-30μm. Then it was aged in a forced air oven at 100° C. for 60 minutes.
[0049] The performance test methods and results are as follows:
[0050] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.
[0051] Post bake (180°C): 60 minutes. After post-baking, the ink does not yellow.
[0052] Adhesion (GB / T9286-1998): Level 1.
[0053] Hardne...
Embodiment 2
[0058] A heat-resistant ink, consisting of the following components in parts by weight:
[0059] 43 parts of hyperbranched resin; 8 parts of bis((3,4-epoxycyclohexyl) methyl) adipate; 5 parts of polypropylene glycol diglycidyl ether; 5 parts of bisglycidyl hexahydrophthalate; 20 parts of talcum powder; 13 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of antioxidant; 1 part of dispersant; 15 parts of propylene glycol methyl ether acetate; 3 parts of triethylenetetramine.
[0060] After testing, it can be seen that the curing temperature of this embodiment is 90°C.
[0061] When in use, dry and solidify within 90-100°C for 2 minutes. The dry film thickness is controlled at 25-30μm. Then it was aged in a forced air oven at 100° C. for 60 minutes.
[0062] The performance test methods and results are as follows:
[0063] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.
[0064] Post bake (180°C): 60 minutes. After post-bakin...
Embodiment 3
[0071] A heat-resistant ink, consisting of the following components in parts by weight:
[0072] 28 parts of hyperbranched resin; 5 parts of bis((3,4-epoxycyclohexyl) methyl) adipate; 8 parts of polypropylene glycol diglycidyl ether; 6 parts of bisglycidyl hexahydrophthalate; 8 parts of barium sulfate; 15 parts of talcum powder; 13 parts of carbon black; 1 part of defoamer; 1 part of leveling agent; 1 part of antioxidant; 1 part of dispersant; 1.5 parts of ethylene glycol ether; .
[0073] After testing, it can be seen that the curing temperature of this embodiment is 90°C.
[0074] When in use, dry and solidify within 90-100°C for 2 minutes. The dry film thickness is controlled at 25-30μm. Then it was aged in a forced air oven at 100° C. for 60 minutes.
[0075] The performance test methods and results are as follows:
[0076] Pre-bake (75°C): 25 minutes. After prebaking, the ink is not sticky.
[0077] Post bake (180°C): 60 minutes. After post-baking, the ink does no...
PUM
Property | Measurement | Unit |
---|---|---|
Heat resistance temperature | aaaaa | aaaaa |
Heat resistance temperature | aaaaa | aaaaa |
Heat resistance temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com