Preparation method for non-glue flexible copper clad laminate with high dimensional stability

A dimensionally stable, flexible copper clad laminate technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problem of many heat treatment times, large differences in the performance of flexible copper clad laminates, and complex processing technology. and other problems, to achieve the effect of low thermal expansion coefficient, high peel strength and high dimensional stability

Inactive Publication Date: 2016-01-13
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flexible copper-clad laminate prepared by this method has complex processing technology and many heat treatments, and it is ea...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Under nitrogen protection at 25°C, dissolve 0.245g (0.0021mol) of 1,6 hexamethylenediamine and 1.752g (0.00875mol) of 4,4'-diaminodiphenyl ether in 30ml of N-methylpyrrolidone, completely After dissolving, lower the reaction system to 5°C, add 3.394g (0.011mol) of 4,4'-oxydiphthalic dianhydride, and react for 4 hours to form a polyamic acid solution;

[0028] (2) Control the scraper to evenly coat the polyamic acid on the glass surface, put it in an oven at 80°C / 1h, 120°C / 1h, 140°C / 1h, 180°C / 1h for solvent removal, and then put it in the muffle furnace for 210 ℃ / 30min, 240℃ / 30min, 270℃ / 30min, 300℃ / 30min, 330℃ / 30min thermal imidization, boiling and stripping to obtain polyimide film.

[0029] (3) Place the two copper foils with rough surfaces facing each other, place the above-mentioned polyimide film in it, press it with a clean mold, preheat it to 290°C in the laminator, and laminate at 290°C and 25MPa for 1h , and naturally cooled after removing the pressure, a f...

Embodiment 2

[0033] (1) Under nitrogen protection at 25°C, dissolve 0.2627g (0.0023mol) of 1,6 hexamethylenediamine and 1.811g (0.009mol) of 4,4'-diaminodiphenyl ether in 30ml of N-methylpyrrolidone, completely After dissolving, lower the reaction system to 5°C, add 3.33g (0.011mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride, and react for 4 hours to form a polyamic acid solution;

[0034] (2) Control the scraper to evenly coat the polyamic acid on the glass surface, put it in an oven at 80°C / 1h, 120°C / 1h, 140°C / 1h, 180°C / 1h for solvent removal, and then put it in the muffle furnace for 210 ℃ / 30min, 240℃ / 30min, 270℃ / 30min, 300℃ / 30min, 330℃ / 30min thermal imidization, boiling and peeling to obtain polyimide film.

[0035] (3) Place the two copper foils with rough surfaces facing each other, place the above-mentioned polyimide film in it, press it with a clean mold, preheat it to 290°C in the laminator, and laminate at 290°C and 25MPa for 1h , cooled naturally after depressurization, a...

Embodiment 3

[0039] (1) Under nitrogen protection at 25°C, dissolve 0.235g (0.002mol) of 1,6-hexanediamine and 1.752g (0.0088mol) of 4,4'-diaminodiphenyl ether in 30ml of N-methylpyrrolidone, completely After dissolving, lower the reaction system to 5°C, add 4.514g (0.011mol) of 3,3',4,4'---benzophenone tetraacid dianhydride, and react for 4 hours to form a polyamic acid solution;

[0040] (2) Control the scraper to evenly coat the polyamic acid on the glass surface, put it in an oven at 80°C / 1h, 120°C / 1h, 140°C / 1h, 180°C / 1h for solvent removal, and then put it in the muffle furnace for 210 ℃ / 30min, 240℃ / 30min, 270℃ / 30min, 300℃ / 30min, 330℃ / 30min thermal imidization, boiling and peeling to obtain polyimide film.

[0041] (3) Place the two copper foils with rough surfaces facing each other, place the above-mentioned polyimide film in it, press it with a clean mold, preheat it to 290°C in the laminator, and laminate at 290°C and 25MPa for 1h , cooled naturally after depressurization, and a f...

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Abstract

The invention discloses a preparation method for a non-glue flexible copper clad laminate with high dimensional stability. A thermoplastic polyimide thin film is synthesized by diamine containing a aliphatic chain segment and aromatic dianhydride is adopted. The thin film has a relatively low glass-transition temperature and can be laminated well with a copper foil at a relatively low temperature ranged from 200 DEG C to 250 DEG C to obtain the flexible copper clad laminate. Thermal treatment is carried out on the flexible copper clad laminate for 30-60 minutes at 350-400 DEG C under protection of inert gas to obtain the flexible copper clad laminate with high dimensional stability. According to the flexible copper clad laminate prepared by the preparation method disclosed by the invention, the peel strength which is relatively high can reach 1.4 N/mm, the internal polyimide expansion coefficient of the flexible copper clad laminate is close to coefficient of thermal expansion of the copper foil, and the thermal dimensional stability is good. The flexible copper clad laminate is not bubbled and layered in a solder bath test at 360 DEG C, so that the flexible copper clad laminate can be widely used in the field of flexible circuit boards, aerospace, portable electronic products and the like.

Description

technical field [0001] The invention relates to the field of preparation of flexible copper-clad laminates, in particular to a method for manufacturing a two-layer double-sided flexible copper-clad laminate with high dimensional stability. Background technique [0002] Flexible copper-clad laminates are widely used in flexible electronics, aerospace, portable electronics and other fields because of their excellent bending resistance, high heat-resistant application range, light weight and good portability. The growing market demand also puts forward requirements for flexible copper clad laminates to be lighter, thinner and have higher dimensional stability. Among them, the traditional three-layer flexible copper clad laminate is gradually being favored by light, thin, convenient processing and good dimensional stability due to its shortcomings such as low heat resistance strength of the bonding layer, poor adhesion to copper foil, and poor dimensional stability. , mechanica...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20B32B27/28B32B37/06B32B37/10B32B37/08B32B38/00
CPCB32B15/08B32B15/20B32B27/281B32B37/06B32B37/08B32B37/10B32B38/0036
Inventor 徐勇曾皓凌志鹏李林霜李宣张晶晶
Owner NANJING UNIV OF SCI & TECH
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