Dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as preparation method and application thereof

A conductive silver glue, reliable technology, used in epoxy resin glue, conductive adhesive, adhesive and other directions, can solve the problems of complex synthesis process, chip and bracket peeling, and easy damage of electronic components.

Active Publication Date: 2016-01-13
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above methods have solved the moisture and heat resistance of epoxy resin materials well, there are various degrees of defects in practical applications, such as poor storage stability, high curing temperature, complex synthesis process, and the curing of the glue. The temperature needs to reach 190°C. Under this temperature condition, electronic components are easily damaged, so it is only suitable for applications in special fields such as high temperature and high pressure.
[0005] At present, the existing conductive silver glue has some shortcomings in the actual application process, such as poor storage stability, high curing temperature, complex synthesis process, etc. During the pre-aging process, the used conductive silver glue will have a 6-10% red zone, that is, the chip and the bracket will peel off and crack at the edge, which is due to the poor heat and humidity resistance of the bonding material used. Caused

Method used

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  • Dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] This embodiment provides a method for preparing an epoxy conductive silver glue with high resistance to heat and humidity, wherein the preparation method includes the following steps:

[0075] Sequentially weigh bisphenol F epoxy resin: 12 parts by weight, hyperbranched polyester modified toughening agent: 2 parts by weight, triallyl isocyanurate: 4.0 parts by weight, epoxy-modified acrylate Compound: 1 part by weight, trimethylolpropane glycidyl ether: 3.0 parts by weight, and mix them uniformly in a high-speed mixer to obtain a mixture A;

[0076] Then add 2-methyl-4-ethylimidazole to the mixture A obtained: 0.7 parts by weight, dicyandiamide: 1.0 parts by weight, benzoyl peroxide: 0.5 parts by weight, polyamide wax: 0.3 parts by weight , KH-560 silane coupling agent: 0.3 parts by weight, TEGO-245: 0.2 parts by weight, continue to mix it uniformly in a high-speed mixer to obtain conductive silver colloid matrix B;

[0077] Finally, 75 parts by weight of silver powder...

Embodiment 2

[0079] This embodiment provides a method for preparing an epoxy conductive silver glue with high resistance to heat and humidity, wherein the preparation method includes the following steps:

[0080] Sequentially weigh bisphenol F-type epoxy resin: 12 parts by weight, epoxy-terminated polybutadiene rubber: 2 parts by weight, triglycidyl isocyanurate: 5.0 parts by weight, epoxy-modified acrylate compound: 2.0 parts by weight, and in a high-speed mixer, it is mixed uniformly to obtain mixture A;

[0081] Then add dicyandiamide to the obtained mixture A: 1.0 parts by weight, 2-methyl-4-ethylimidazole: 0.7 parts by weight, benzoyl peroxide: 0.5 parts by weight, hydrogenated castor oil: 0.3 parts by weight , KH-560 silane coupling agent: 0.3 parts by weight, NP-10: 0.2 parts by weight, continue to mix it uniformly in a high-speed mixer to obtain conductive silver colloid matrix B;

[0082] Finally, 76 parts by weight of silver powder are added in batches to the conductive silver c...

Embodiment 3

[0084] This embodiment provides a method for preparing an epoxy conductive silver glue with high resistance to heat and humidity, wherein the preparation method includes the following steps:

[0085] Weigh successively bisphenol A epoxy resin: 12 parts by weight, epoxy-terminated polybutadiene rubber: 2 parts by weight, triallyl isocyanurate: 4.0 parts by weight, epoxy-modified acrylate Compound: 1.0 parts by weight, and uniformly mix it in a high-speed mixer to obtain mixture A;

[0086] Then add dicyandiamide to the obtained mixture A: 1.0 parts by weight, 1-cyanoethyl-2-ethyl-4-methylimidazole: 0.7 parts by weight, benzoyl peroxide: 0.5 parts by weight, gas phase Silicon dioxide: 0.3 parts by weight, KH-550 silane coupling agent: 0.3 parts by weight, Span80: 0.2 parts by weight, continue to mix it uniformly in a high-speed mixer to obtain conductive silver colloid matrix B;

[0087] Finally, 78 parts by weight of silver powder are added in batches to the conductive silver ...

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Abstract

The invention provides a dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as a preparation method and an application thereof. The dampness-heat-resistant high-reliability epoxy conductive silver adhesive is prepared by adopting the following raw materials: 65 to 85 percent of metal silver powder, 5.0 to 30 percent of epoxy resin, 1 to 15 percent of active heterocyclic compound having a triazine structure, 0.5 to 10 percent of acrylic resin, 1.0 to 3.5 percent of curing agent, 0.05 to 1.5 percent of accelerant and 0.01 to 3 percent of functional additives. The invention also provides a preparation method and an application of the conductive silver adhesive. The prepared conductive silver adhesive has good conduction performance, mechanical performance, adhesion performance and dampness and heat resistance, can effectively improve the problem that the existing conductive silver adhesive is poor in dampness and heat resistance and has a red zone during the aging process and also can remarkably improve the reliability of a packing device and product.

Description

technical field [0001] The invention relates to a high-reliability epoxy conductive silver glue resistant to heat and humidity and a preparation method and application thereof, belonging to the technical field of microelectronic packaging. Background technique [0002] With the rapid development of the miniaturization and miniaturization of electronic components and the high density and high integration of printed circuit boards, conductive adhesive, as a material that can replace lead-tin solder, has become the core basic material of the microelectronics industry. increasingly important. Because the conductive adhesive combines the conductive particles together through the bonding effect of the matrix resin to form a conductive path and realize the conductive connection of the adhered materials. This type of material has low bonding temperature, wide bonding temperature range, simple process, flexible and changeable formula, can be made into slurry, realizes the interconne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J133/00C09J11/06C09J9/02
CPCC09J9/02C09J11/06C09J133/00C09J163/00
Inventor 孙蓉张保坦韩延康朱朋莉
Owner SHENZHEN INST OF ADVANCED TECH
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