Dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as preparation method and application thereof

Abstract

The invention provides a dampness-heat-resistant high-reliability epoxy conductive silver adhesive as well as a preparation method and an application thereof. The dampness-heat-resistant high-reliability epoxy conductive silver adhesive is prepared by adopting the following raw materials: 65 to 85 percent of metal silver powder, 5.0 to 30 percent of epoxy resin, 1 to 15 percent of active heterocyclic compound having a triazine structure, 0.5 to 10 percent of acrylic resin, 1.0 to 3.5 percent of curing agent, 0.05 to 1.5 percent of accelerant and 0.01 to 3 percent of functional additives. The invention also provides a preparation method and an application of the conductive silver adhesive. The prepared conductive silver adhesive has good conduction performance, mechanical performance, adhesion performance and dampness and heat resistance, can effectively improve the problem that the existing conductive silver adhesive is poor in dampness and heat resistance and has a red zone during the aging process and also can remarkably improve the reliability of a packing device and product.

Description

technical field [0001] The invention relates to a high-reliability epoxy conductive silver glue resistant to heat and humidity and a preparation method and application thereof, belonging to the technical field of microelectronic packaging. Background technique [0002] With the rapid development of the miniaturization and miniaturization of electronic components and the high density and high integration of printed circuit boards, conductive adhesive, as a material that can replace lead-tin solder, has become the core basic material of the microelectronics industry. increasingly important. Because the conductive adhesive combines the conductive particles together through the bonding effect of the matrix resin to form a conductive path and realize the conductive connection of the adhered materials. This type of material has low bonding temperature, wide bonding temperature range, simple process, flexible and changeable formula, can be made into slurry, realizes the interconne...

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Problems solved by technology

Although the above methods have solved the moisture and heat resistance of epoxy resin materials well, there are various degrees of defects in practical applications, such as poor storage stability, high curing temperature, complex synthesis process, and the curing of the glue. The temperature needs to reach 190°C. Under this temperature condition, electronic components are easily damaged, so it is only suitable for applications in special fields such as high temperature and high pressure.

[0005] At present, the existing conductive silver glue has some shortcomings in the actual application process, such as poor storage stability, high curing temperature, complex synthesis process, etc. During the pre-aging process, the used conductive silver glue will have a 6-10% red zone, that is, the chip and the bracket will peel off and crack at the edge, which is due to the poor heat and humidity resistance of the bonding material used. Caused

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