Preparation method of high-strength high-conductivity copper-silver alloy wire

A copper-silver alloy, high-conductivity technology, used in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of affecting material strength, hardening is difficult to fully alleviate, limiting material processing, etc., to achieve simultaneous improvement of strength and conductivity. , to ensure the overall electrical conductivity, to ensure the effect of complete precipitation

Inactive Publication Date: 2016-01-20
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the specific implementation process, the introduction of multiple heat treatments may simultaneously cause the coarsening and growth of the internal eutectic grains, destroying the fiber state of the material, and affecting the improvement of the overall strength of the material.
Secondly, with the difference in processing methods, it is difficult to accurately judge the timing of material heat treatment, which affects the effectiveness of heat treatment.
Finally, due to the low heat treatment, the hardening caused by continuous processing of copper-silver alloy wire cannot be fully relieved, limiting the further processing of the material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The preparation method of the high-strength and high-conductivity copper-silver alloy wire rod of this embodiment comprises the following steps:

[0019] Step 1. Under the protection of argon atmosphere, the cylindrical copper-silver alloy ingot with a specification of Φ30mm×300mm is heated to 850°C at a heating rate of 5°C / min, and then kept for 7 hours, and then water-cooled to room temperature of 25°C; the copper The silver alloy ingot is a Cu-10Ag alloy ingot, the mass percentage of silver in this ingot is 10%, and the balance is copper and unavoidable impurities;

[0020] Step 2, the copper-silver alloy ingot after water-cooling in step 1 is carried out 4 passes drawing processing, after drawing to the cross-sectional diameter of ingot is 19.2mm (the processing deformation rate of drawing processing is 59%), to copper The silver alloy ingot is subjected to intermediate heat treatment. The specific process is: put the copper-silver alloy ingot in a vacuum heating fu...

Embodiment 2

[0023] The preparation method of the high-strength and high-conductivity copper-silver alloy wire rod of this embodiment comprises the following steps:

[0024] Step 1. Under the protection of argon atmosphere, the cylindrical copper-silver alloy ingot with a specification of Φ32mm×300mm is heated to 800°C at a heating rate of 2°C / min, and then kept for 7 hours, and then water-cooled to room temperature of 25°C; the copper The silver alloy ingot is a Cu-8Ag alloy ingot, the mass percentage of silver in this ingot is 8%, and the balance is copper and unavoidable impurities;

[0025] Step 2, the copper-silver alloy ingot after the water cooling in the step 1 is carried out 5 times of drawing processing, after being drawn to the section diameter of ingot is 18.3mm (the processing deformation rate of drawing processing is 67.3%), to copper Silver alloy ingots are subjected to intermediate heat treatment. The specific process is: place copper-silver alloy ingots in a vacuum heating...

Embodiment 3

[0028] The preparation method of the high-strength and high-conductivity copper-silver alloy wire rod of this embodiment comprises the following steps:

[0029] Step 1. Under the protection of argon atmosphere, the cylindrical copper-silver alloy ingot with a specification of Φ32mm×350mm is heated to 800°C at a heating rate of 8°C / min, and then kept for 5 hours, and then water-cooled to 25°C room temperature; the copper The silver alloy ingot is a Cu-12Ag alloy ingot, the mass percentage of silver in the ingot is 12%, and the balance is copper and unavoidable impurities;

[0030] Step 2, the copper-silver alloy ingot after the water cooling in the step 1 is carried out 6 times drawing processing, after drawing to the section diameter of ingot is 16.4mm (the processing deformation rate of drawing processing is 73.7%), to copper The silver alloy ingot is subjected to intermediate heat treatment. The specific process is: put the copper-silver alloy ingot in a vacuum heating furna...

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Abstract

The invention provides a preparation method of a high-strength high-conductivity copper-silver alloy wire. The method comprises the following steps: 1, under the protection of an argon atmosphere, elevating the temperature of a copper-silver alloy ingot to 800-850 DEG C, maintaining the temperature for 4-7h, and performing cooling; and 2, drawing the copper-silver alloy ingot, and performing intermediate thermal treatment of the copper-silver alloy ingot during drawing to obtain the high-strength high-conductivity copper-silver alloy wire with the tensile strength no less than 800MPa and the conductivity no less than 70%IACS. According to the preparation method, time and process of thermal treatment before and during drawing are optimized, thereby fully developing an enforcement effect of a copper-silver alloy material and ensuring whole conductivity of the material. The preparation method has a preferable application prospect.

Description

technical field [0001] The invention belongs to the technical field of superconducting wire preparation, and in particular relates to a preparation method of high-strength and high-conductivity copper-silver alloy wire. Background technique [0002] High-strength and high-conductivity copper-based alloys are widely used in electric locomotive transmission lines, transport wires, lead frames, and high-field pulse magnets. As a typical dual-phase alloy, copper-silver alloy has good alloy melting properties, excellent processing strengthening characteristics and low electron scattering characteristics, and has attracted great attention from researchers. Adding excess silver elemental substance to the copper matrix will obtain a dual-phase structure after solid solution treatment, and silver exists in the copper matrix as primary equiaxed crystal or eutectic structure. Subsequent hot swaging and cold drawing processes promote the full fibrillation of the internal eutectic struc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00B21C1/00
Inventor 梁明王鹏飞徐晓燕李成山张平祥
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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