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Waterproof and damp-proof raw paper dedicated for electronic paper tape, and preparation method thereof

A technology of paper tape and base paper, applied in pulp beating method, pulp beating/refining method, papermaking, etc., to achieve the effect of low cost, high bonding strength and easy handling

Inactive Publication Date: 2016-02-24
JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to users, the quality of this product is also better than that of South Korea, but there is still a gap between it and Japanese products

Method used

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  • Waterproof and damp-proof raw paper dedicated for electronic paper tape, and preparation method thereof
  • Waterproof and damp-proof raw paper dedicated for electronic paper tape, and preparation method thereof
  • Waterproof and damp-proof raw paper dedicated for electronic paper tape, and preparation method thereof

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Embodiment 1

[0041] 1. Process flow

[0042] (1) Pulp ratio and additives: In consideration of the stiffness and interlayer bonding of the base paper for electronic special paper tapes, we choose a high proportion of coniferous wood fiber and a low proportion of hardwood fiber, and use a combination of water and moisture resistance material, to ensure the bonding force between the base paper layers.

[0043] For example, to produce 0.60mm base paper, 65% of softwood pulp and 35% of hardwood pulp; to produce 0.40mm base paper, 75% of softwood pulp and 25% of hardwood pulp; to produce 0.75mm base paper, 60% of softwood pulp and 35% of broadleaf pulp Leaf pulp 20%, recycled waste paper 20%, etc.

[0044] (2) Beating control process: beating determines the product performance of base paper. In this process, we will strictly control the beating process, and formulate corresponding beating treatment processes for different production specifications to ensure the bonding ability and other proper...

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Abstract

The present invention discloses a waterproof and damp-proof raw paper dedicated for electronic paper tapes, and a preparation method thereof. The method is characterized in that untwining and fibrillation are carried out on pulp fibers, fibrillation and cutting are further carried out so as to enable a pulp beating degree to reach 45 degree SR to 48 degree SR and a fiber wet weight to be reduced to 5.5 g to 8.0 g; and a water-resistant damp-proof composition is added in each layer, 1.0%-2.5% of the water-resistant damp-proof composition is added in relative to 100 parts of the pulp fibers, the water-resistant damp-proof composition including 0.15+-0.015 % of a wet strength agent PAE, 0.50+-0.05 % of gum rosin or an alkyl ketene dimer (AKD), 0.10+-0.01 % of silicon and fluorine type polymers, and 0.15+-0.015 % of ammonium zirconium carbonate. According to the above method, defibrination treatment is utilized, and a water-resistant damp-proof functional chemical is added in the pulp and coated on the surface of paper, surface water absorption and an edge permeation index of the raw paper are lowered than like products on the market, and water-resistance and damp-proofness of the raw paper are the best.

Description

technical field [0001] The invention belongs to the technical field of electronic information materials, and in particular relates to a special base paper for waterproof and moisture-proof electronic paper tape used in the packaging of chip electronic components in the technical field of microelectronics and a preparation method thereof. Background technique [0002] With the miniaturization of electrical appliances, the miniaturization requirements for electronic components are getting higher and higher. When the size is large, it is acceptable to use plastic carrier tape, but when the size is smaller, the production of plastic carrier tape is very difficult. Dimensional accuracy is difficult to guarantee, especially it is difficult to eliminate the chamfer around when drilling, which is especially obvious when the size is small, especially important is that the static electricity of plastic products is difficult to eliminate, which brings difficulties to the process of taki...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21F11/04D21F5/04D21F5/06D21D1/20D21D1/02D21H15/10D21H11/14D21H11/12D21H21/16D21H17/62D21H19/10
CPCD21F11/04D21D1/02D21D1/20D21F5/04D21F5/06D21H11/12D21H11/14D21H15/10D21H17/62D21H19/10D21H21/16
Inventor 姜兆宏
Owner JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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