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A kind of polycrystalline silicon ingot and its preparation method and polycrystalline silicon chip

A technology for polycrystalline silicon ingots and silicon wafers, which is applied in the growth of polycrystalline materials, chemical instruments and methods, and crystal growth. It can solve the problems of silicon crystal performance degradation, seed crystal pollution, and difficult control of seed crystal nucleation, and achieve less dislocations. , reduce crystal defects, and reduce the effect of dislocation proliferation

Active Publication Date: 2017-11-28
JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has the following disadvantages: (1) The silicon melt formed during the melting process of the silicon material will flow down from the top of the crucible along the through gap between the silicon materials into the gap of the seed crystal and solidify to form crystals, resulting in the shape of the seed crystal. The nuclei are not easy to control, which affects the seeding effect of the seed crystal; (2) there are many through gaps between the silicon materials, and the gas in the gaps contains some particulate impurities. In addition, the crucible body and the silicon materials also contain some impurities. During the material melting process, on the one hand, the gas in the crucible will entrain particulate impurities and move to the bottom seed crystal to contaminate the seed crystal; on the other hand, the silicon melt will also carry impurities diffused from the crucible and silicon material itself into the seed crystal. The gap between the crystals and solidification occurs, and the impurities will contaminate the seed crystal, which will eventually cause dislocation diffusion, resulting in a decrease in the performance of the silicon crystal

Method used

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  • A kind of polycrystalline silicon ingot and its preparation method and polycrystalline silicon chip
  • A kind of polycrystalline silicon ingot and its preparation method and polycrystalline silicon chip
  • A kind of polycrystalline silicon ingot and its preparation method and polycrystalline silicon chip

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Effect test

Embodiment 1

[0106] A method for preparing a polycrystalline silicon ingot, comprising the following steps:

[0107] (1) seed crystals are laid on the bottom of the crucible to form a seed crystal layer, and the thickness of the seed crystal layer is 30mm;

[0108] (2) Set a barrier layer above the seed layer. The specific setting method of the barrier layer is: stack 10-20 recycled silicon wafers into a stack, and the length*width of the recycled silicon wafers is 156mm*156mm. Form the first layer of silicon wafers covering the seed crystal layer, try to make the gap between each stack of silicon wafers smaller, and then use it on the gap between the silicon wafers in the first silicon wafer layer Cover with 5 to 10 silicon wafers as a stack of silicon wafers to obtain the second layer of silicon wafers, so that there is no through gap at all in the direction perpendicular to the bottom of the crucible to obtain a 5mm thick barrier layer, and then place the inside of the crucible The gap...

Embodiment 2

[0120] A method for preparing a polycrystalline silicon ingot, comprising the following steps:

[0121] (1) Lay the seed crystal on the bottom of the crucible to form a seed crystal layer, the thickness of the seed crystal layer is 30mm

[0122] (2) A barrier layer is set above the seed layer. The specific setting method of the barrier layer is: evenly cover the irregular pure silicon material above the seed layer to form a barrier layer. The thickness of the barrier layer is 15mm; The aspect ratio of pure silicon material is 1.5-2, and the maximum side length is 10-15mm;

[0123] (3) Fill the silicon material above the barrier layer and heat the silicon material to melt to form a silicon melt. During the melting process of the silicon material, the barrier layer is used to prevent the silicon melt from contacting the seed layer until the silicon material and the barrier layer are completely melted When the formed solid-liquid interface is just in the seed layer, adjust the t...

Embodiment 3

[0127] A method for preparing a polycrystalline silicon ingot, comprising the following steps:

[0128] (1) seed crystals are laid on the bottom of the crucible to form a seed crystal layer, and the thickness of the seed crystal layer is 30mm;

[0129] (2) Set a barrier layer above the seed layer. The specific setting method of the barrier layer is: stack 10-20 recycled silicon wafers into a stack, and the length*width of the recycled silicon wafers is 156mm*156mm. Form the first silicon wafer layer over the seed layer, try to make the gap between each stack of silicon wafers smaller, and then cover the first silicon wafer layer with irregular pure silicon material to obtain an irregular silicon layer. The aspect ratio of the irregular pure silicon material is 1.5-2, and the maximum side length is 5-10mm; then a layer of silicon wafer is covered on the irregular silicon layer to obtain the second silicon wafer layer, and finally it is perpendicular to There is no through gap ...

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Abstract

The invention provides a preparation method of a polycrystalline silicon ingot. The preparation method includes the following steps that 1, seed crystals are laid at the bottom of a crucible, and a seed crystal layer is formed; 2, a blocking layer is arranged above the seed crystal layer, and the melting point of the blocking layer is smaller than or equal to that of silicon; 3, the upper portion of the blocking layer is filled with a silicon material, heating is conducted to melt the silicon material, molten silicon bodies are formed, in the melting process of the silicon material, the blocking layer is used for blocking the molten silicon bodies from making contact with the seed crystal layer, when a solid-liquid interface formed after the silicon material and the blocking layer are totally melted is just located or stretches deeply into the seed crystal layer, a thermal field is adjusted, an supercooling state is formed, and crystals begin to grow on the molten silicon bodies on the basis of the seed crystal layer; 4, after all the molten silicon bodies are crystallized, annealing and cooling are conducted, and the polycrystalline silicon ingot is obtained. According to the preparation method, the blocking layer is arranged above the seed crystal layer, nucleation interface dislocation of seed crystals is reduced, and dislocation multiplication in the subsequent crystal growth process can be reduced, so that the quality of the whole polycrystalline silicon ingot is improved, and efficiency of manufacturing polycrystalline silicon cells through casting silicon pieces is improved.

Description

technical field [0001] The invention relates to the field of polycrystalline silicon ingots, in particular to a polycrystalline silicon ingot, a preparation method thereof and a polycrystalline silicon wafer. Background technique [0002] In recent years, solar energy, as an emerging renewable green energy, has become a hotspot of development and research. With the rapid development of the solar cell industry, polysilicon, which is low in cost and suitable for large-scale production, has become one of the most important photovoltaic materials in the industry, and has gradually replaced the traditional Czochralski monocrystalline silicon in the solar cell material market. [0003] At present, the preparation method of polycrystalline silicon ingot mainly adopts the directional solidification system method (DSS for short) furnace crystal growth technology provided by GT Solar, and this method usually includes steps such as heating, melting, solidification growth, annealing and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B28/06C30B29/06
CPCC30B28/06C30B29/06
Inventor 王利伟胡动力刘海
Owner JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD