A kind of polycrystalline silicon ingot and its preparation method and polycrystalline silicon chip
A technology for polycrystalline silicon ingots and silicon wafers, which is applied in the growth of polycrystalline materials, chemical instruments and methods, and crystal growth. It can solve the problems of silicon crystal performance degradation, seed crystal pollution, and difficult control of seed crystal nucleation, and achieve less dislocations. , reduce crystal defects, and reduce the effect of dislocation proliferation
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Embodiment 1
[0106] A method for preparing a polycrystalline silicon ingot, comprising the following steps:
[0107] (1) seed crystals are laid on the bottom of the crucible to form a seed crystal layer, and the thickness of the seed crystal layer is 30mm;
[0108] (2) Set a barrier layer above the seed layer. The specific setting method of the barrier layer is: stack 10-20 recycled silicon wafers into a stack, and the length*width of the recycled silicon wafers is 156mm*156mm. Form the first layer of silicon wafers covering the seed crystal layer, try to make the gap between each stack of silicon wafers smaller, and then use it on the gap between the silicon wafers in the first silicon wafer layer Cover with 5 to 10 silicon wafers as a stack of silicon wafers to obtain the second layer of silicon wafers, so that there is no through gap at all in the direction perpendicular to the bottom of the crucible to obtain a 5mm thick barrier layer, and then place the inside of the crucible The gap...
Embodiment 2
[0120] A method for preparing a polycrystalline silicon ingot, comprising the following steps:
[0121] (1) Lay the seed crystal on the bottom of the crucible to form a seed crystal layer, the thickness of the seed crystal layer is 30mm
[0122] (2) A barrier layer is set above the seed layer. The specific setting method of the barrier layer is: evenly cover the irregular pure silicon material above the seed layer to form a barrier layer. The thickness of the barrier layer is 15mm; The aspect ratio of pure silicon material is 1.5-2, and the maximum side length is 10-15mm;
[0123] (3) Fill the silicon material above the barrier layer and heat the silicon material to melt to form a silicon melt. During the melting process of the silicon material, the barrier layer is used to prevent the silicon melt from contacting the seed layer until the silicon material and the barrier layer are completely melted When the formed solid-liquid interface is just in the seed layer, adjust the t...
Embodiment 3
[0127] A method for preparing a polycrystalline silicon ingot, comprising the following steps:
[0128] (1) seed crystals are laid on the bottom of the crucible to form a seed crystal layer, and the thickness of the seed crystal layer is 30mm;
[0129] (2) Set a barrier layer above the seed layer. The specific setting method of the barrier layer is: stack 10-20 recycled silicon wafers into a stack, and the length*width of the recycled silicon wafers is 156mm*156mm. Form the first silicon wafer layer over the seed layer, try to make the gap between each stack of silicon wafers smaller, and then cover the first silicon wafer layer with irregular pure silicon material to obtain an irregular silicon layer. The aspect ratio of the irregular pure silicon material is 1.5-2, and the maximum side length is 5-10mm; then a layer of silicon wafer is covered on the irregular silicon layer to obtain the second silicon wafer layer, and finally it is perpendicular to There is no through gap ...
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