Resin composition and copper-clad plate and PCB made of same

Abstract

The invention relates to the technical field of printed circuit boards and particularly relates to a resin composition. The resin composition is prepared from, by weight, 20-25 parts of phosphoric epoxy resin, 10-15 parts of brominated epoxy resin, 10-20 parts of cycloaliphatic epoxy resin, 25-30 parts of anhydride, 10-15 parts of phosphorus-containing phenolic aldehyde and 5-15 parts of phenolic aldehyde, wherein the epoxide equivalent range of the cycloaliphatic epoxy resin is 100-200 g / eq. According to the resin composition, the cycloaliphatic epoxy resin is introduced to an ordinary epoxy resin system and solidified with anhydride, and excellent electric leakage and tracking resistance and heat-resisting performance can be obtained; meanwhile, the system reaches the inflaming retarding requirement through a bromine and phosphorus cooperative mode, a small amount of boehmite filler which is better in heat resistance is introduced, aluminium hydroxide filler is not needed, and the defect of adding a great amount of filler is avoided; the invention further relates to a copper-clad plate and a PCB made of the resin composition, the CTI is larger than or equal to 600 V, heat resistance is good, alkali resistance is excellent, and the inflaming retarding requirement is reached.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a resin composition and high CTI copper-clad boards and PCB boards made using the resin composition. Background technique [0002] As the insulating substrate of printed circuit boards, copper clad laminates are widely used in various electronic and electrical products. The higher the requirements, the tracking resistance is an important reliability index of the copper clad laminate, and the poor tracking resistance of the copper clad laminate is a potential hidden danger caused by the fire of electronic and electrical products. The ability index of tracking resistance on the surface of insulating materials is called comparative tracking index CTI (Comparative Tracking Idex), which refers to the ability of the material surface to withstand 50 drops of electrolyte (0.1% ammonium chloride aqueous solution) without forming leakage traces. The highest voltage value me...

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Problems solved by technology

[0003] The copper clad laminate must improve its tracking resistance, that is, have a high CTI value to ensure its safety and reliability. At present, the CTI value of ordinary copper clad laminates is generally 175-250V, and for traditional high CTI copper clad laminates, its CTI Although it can reach more than 400V, the traditional high CTI copper-clad laminate production method is realized by adding aluminum hydroxide filler; this method needs to add a large amount of aluminum hydroxide filler to produce a copper-clad laminate with a CTI value greater than 600V, and A high content of fillers tends to reduce the processability, heat resistance and alkali resistance of the board

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