Nano particle modified binder, preparation method and using method

A technology of nano-particles and binders, which is applied in the direction of adhesive heating bonding methods, bonding methods, surface pretreatment bonding methods, etc., which can solve the problems of reducing toughness, improve rigidity, and have a wide range of applications , good heat resistance

Active Publication Date: 2016-03-23
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, filling inorganic polymers increases the rigidity of the material while reducing its toughness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A nano-particle modified binder prepared by the present invention, wherein the main body of the binder includes 55wt.% of organic silicon resin, 30wt.% of glass powder and 15wt.% of boron carbide powder, wherein the nano-filler includes: 10wt.% of nano-aluminum powder. %, nano silicon powder 10wt.% and aluminum oxide whisker 1wt.%.

[0036] The preparation method of this binding agent comprises the following steps:

[0037] 1) Preparation of the main body of the binder: Weigh 55wt.% of the silicone resin into a wide-mouthed flask, add xylene equivalent to the amount of the silicone resin as a solvent, and heat and stir in a water bath at 60°C. Constantly drop xylene in the mouth bottle to ensure that the liquid in the wide-mouth flask can flow as the criterion; then take 30wt.% glass powder and 15wt.% boron carbide powder and add it to the wide-mouth flask and stir for 2 hours to make it Completely mix evenly, continuously drip xylene during this period to ensure the f...

Embodiment 2

[0049] A nano-particle modified binder prepared by the present invention, wherein the main body of the binder includes 50wt.% of organic silicon resin, 35wt.% of glass powder and 15wt.% of boron carbide powder, wherein the nano-filler includes: 5wt.% of nano-aluminum powder. %, nano silicon powder 5wt.% and aluminum oxide whisker 2wt.%.

[0050] The preparation method of this binding agent comprises the following steps:

[0051] 1) Preparation of the main body of the binder: Weigh 50wt.% of the silicone resin into a wide-mouthed flask, add xylene equivalent to the amount of the silicone resin as a solvent, and heat and stir in a water bath at 60°C. Constantly drop xylene in the mouth bottle to ensure that the liquid in the wide-mouth flask can flow as the criterion; then take 35wt.% glass powder and 15wt.% boron carbide powder and add it to the wide-mouth flask and stir for 2 hours. Make it completely mixed evenly, during which xylene is continuously dripped to ensure the flu...

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PUM

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Abstract

The invention relates to a nano particle modified binder which comprises a binder main body and nanofiller, wherein the binder main body comprises 45-55 wt% of organic silicon resin, 25-35 wt% of glass powder and 15-20 wt% of boron carbide powder; and the nanofiller comprises 5-10 wt% of nanometer aluminum powder, 5-10 wt% of nanometer silica powder and 1-2 wt% of alumina whisker. A method for preparing the nano particle modified binder comprises the steps of respectively preparing the binder main body and the nanofiller and then evenly dispersing and adding the nanofiller in the binder main body. A method for using the binder comprises the steps of evenly bonding the to-be-glued surface of an object with the binder, bonding the object, and achieving object bonding after heat treatment and chemical vapor deposition. The binder accord to the preparation method and the using method not only is extensive in use range, but also has good heat resistance and keeps physical and chemical properties basically unchanged in high temperature environment for a long time.

Description

technical field [0001] The invention relates to the technical field of high-temperature bonding, in particular to a nanoparticle-modified binder, a preparation method and a use method. Background technique [0002] Silicone resin has been widely valued in the bonding field of high-temperature structural composite materials due to its excellent performance. The main chain of silicone is Si-O-Si bond, which has high bond energy and ion tendency, and the side chain is organic group, so it has the characteristics of both organic and inorganic materials. It not only has excellent heat resistance, but also has excellent heat resistance at 60 It can keep its physical and chemical properties basically unchanged in the range of ~1200°C. However, silicone resin is brittle, has low bonding strength, and high curing temperature, so it needs to be modified during use. Filling the silicone resin with inorganic polymer can modify the silicone resin. The inorganic polymer can effectively ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J11/04C09J5/06C09J5/02C09J5/00
Inventor 罗瑞盈蒋丽娟
Owner BEIHANG UNIV
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