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Electronic packaging material

A technology of electronic packaging materials and substrates, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of manufacturing process and welding performance, and achieve the effect of changing the difficulty of machining, high thermal conductivity, and improving comprehensive performance

Inactive Publication Date: 2016-04-20
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

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Embodiment Construction

[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In terms of mass fraction, graphene oxide is 0.5%-3%, SiC particles are 35%-65%, and the balance is aluminum alloy powder, which contains 50% Al-Si and 50% Al alloy powder. The preparation steps are as follows:

[0030] (1) prepare the ethanol solution of graphene oxide: the graphene oxide of 1 volume and the ethanol of 10 volumes are mixed and dispersed with ultrasonic;

[0031] (2) Add the prepared graphene oxide ethanol solution, SiC particles, and Al-Si aluminum alloy powder into a V-type mixing device for ...

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Abstract

The invention provides an electronic packaging material which consists of a matrix and an enhanced body, wherein the matrix comprises an aluminium alloy, the enhanced body comprises, by mass percent, 0.5-3% of oxidized graphene, 35-65% SiC particles and the balance aluminium alloy powder consisting of 50% Al-Si alloy powder and 50% of Al alloy powder. With the adoption of the scheme, the light electronic packaging material with the density being under 3.1g / cm<3> and the heat conductivity being greater than 180W / (m.K) can be prepared, so that the comprehensive performances of military electronic equipment are improved greatly, and the electronic packaging material is applicable to portable components, military power hybrid circuits in the field of aerospace and in other fields sensitive to weight, carriers of microwave tubes, heat sinks of multi-chip modules, and super-high power modules.

Description

technical field [0001] The invention relates to an encapsulation material, in particular to an electronic encapsulation material with an aluminum alloy matrix, graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, thermodynamics, machinery and process equipme...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C32/00C22C29/06C22C30/00C22C1/05C22C1/10H01L23/373
CPCC22C1/0416C22C1/05C22C1/051C22C1/10C22C21/00C22C29/065C22C30/00C22C32/0005C22C32/0063C22C32/0084H01L23/3736
Inventor 李炯利王旭东王胜强罗传彪武岳
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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