Electronic packaging material

Abstract

The invention provides an electronic packaging material which consists of a matrix and an enhanced body, wherein the matrix comprises an aluminium alloy, the enhanced body comprises, by mass percent, 0.5-3% of oxidized graphene, 35-65% SiC particles and the balance aluminium alloy powder consisting of 50% Al-Si alloy powder and 50% of Al alloy powder. With the adoption of the scheme, the light electronic packaging material with the density being under 3.1g / cm<3> and the heat conductivity being greater than 180W / (m.K) can be prepared, so that the comprehensive performances of military electronic equipment are improved greatly, and the electronic packaging material is applicable to portable components, military power hybrid circuits in the field of aerospace and in other fields sensitive to weight, carriers of microwave tubes, heat sinks of multi-chip modules, and super-high power modules.

Description

technical field

[0001] The invention relates to an encapsulation material, in particular to an electronic encapsulation material with an aluminum alloy matrix, graphene oxide and SiC particles as reinforcements. Background technique

[0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, thermodynamics, machinery and process equipme...

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