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Drying method when preparing flexible adhesive-free polyimide copper-clad laminates by two-layer method

A technology of gluing polyimide and drying method, which is applied in the direction of coating, liquid coating device on the surface, pretreatment surface, etc., can solve the problems of poor dimensional stability, high cost, high energy consumption, etc., and prevent curl deformation Low requirements for stripping and coating equipment, and improved drying efficiency

Active Publication Date: 2018-11-09
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, almost all foreign countries use the two-layer method to produce adhesive-free polyimide copper-clad laminates. In the two-layer method, it is divided into four manufacturing methods according to different processes, namely: casting method, spray plating method, chemical plating / electroplating method and lamination method, but the above methods all need expensive special imported equipment, existing coating and drying together, the speed is 2-3m / min, the cost is high, the process is complicated, the efficiency is low, the energy consumption is high, and there is no glue The dimensional stability of the polyimide copper clad laminate is a huge test
Polyimide needs to be combined with copper. Since the coefficients of thermal expansion (CET) of the two are different, when subjected to heat and cold, warping, cracking or even delamination will occur due to the mismatch of the coefficients of thermal expansion between the two, resulting in The existing adhesiveless polyimide copper clad laminates have poor dimensional stability and low peel strength, and the drying process has a great impact on dimensional stability and peel strength

Method used

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  • Drying method when preparing flexible adhesive-free polyimide copper-clad laminates by two-layer method
  • Drying method when preparing flexible adhesive-free polyimide copper-clad laminates by two-layer method
  • Drying method when preparing flexible adhesive-free polyimide copper-clad laminates by two-layer method

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Embodiment 1

[0031] Such as figure 1 As shown, the production line for preparing flexible adhesive-free polyimide copper-clad laminates by the two-layer method of the present invention sequentially includes a reaction system 100 for preparing a polyamic acid solution, and a coating system 200 for coating the polyamic acid solution on copper foil. , A high-tension drying cylinder 300 for secondary drying the coated copper-clad laminate under high tension, and a special nitrogen high-temperature oven 400 for imidizing roll-shaped products.

[0032] The reaction system 100 and the coating system 200 for preparing the polyamic acid solution can adopt equipment in the prior art, wherein the coating system 200 can adopt equipment in the existing coating field; and the parameters of the high tension dryer 300 and the special The nitrogen high-temperature oven 400 is a special design for the present invention.

[0033] The high-tension drying cylinder 300 is connected to the end of the coating sy...

Embodiment 2

[0042] The content of Embodiment 2 is substantially the same as that of Embodiment 1. The difference is:

[0043] The aromatic amine solution in step 1) is the 3 substances in Example 1, the ratio is 4:4:1, cooled to a temperature of about -8 degrees Celsius, and equimolar biphenyltetracarboxylic acid dicarboxylate is added in 8 batches within 8 hours. Anhydride, maintained at about -8 degrees Celsius, the reaction time is 45 hours, the obtained polyamic acid has a solid content of 12 g / 100 ml, a molecular weight of 53000-69000, and a molecular weight distribution index of less than 1.4.

[0044] The thickness of the copper foil in step 2) is 12 mm, the coating speed is 9 m / min, the drying temperature is 130 degrees during coating, and 81% of the solvent is removed, and the diameter of the drying cylinder in step 4) is 2 meters. The surface drying temperature is 190 degrees Celsius, the speed is 3m / min, and the winding is 1500m / roll; during imidization, follow the temperature...

Embodiment 3

[0046] The content of embodiment 3 is substantially the same as that of embodiment 1. The difference is:

[0047] The aromatic amine solution in step 1) is the 3 substances in Example 1, the proportioning ratio is 6:6:1, the cooling temperature is -5 degrees Celsius, and equimolar 4-4 biphenyl ether dianhydride is added in 10 batches within 10 hours , maintained at -5 degrees Celsius and the reaction time is 50 hours, the solid content of the obtained polyamic acid is 13 g / 100 ml, the molecular weight is 51000-64000, and the molecular weight distribution index is less than 1.4.

[0048] The thickness of the copper foil in step 2) is 12 mm, the drying temperature is 160 degrees during coating, the speed is 12 m / min, and 80% of the solvent is removed; the diameter of the drying cylinder in step 4) is 2.5 meters, and it is dried on the surface of a high tension drying cylinder The temperature is 200 degrees, the speed is 2m / min, and the winding is 2000m / roll; during imidization,...

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Abstract

The invention discloses a drying method used during preparation of a flexible glue-free polyimide copper-clad plate through a two-layer method. The drying method used during preparation of the flexible glue-free polyimide copper-clad plate through the two-layer method comprises the steps that copper foil is coated with a polyamide acid solution at the speed of 6-12 m / min, and then the copper foil is dried at the temperature of 100-160 DEG C, so that most solvents are removed; the coated copper-clad plate is tightly attached to the surface of a high-tension drying cylinder to be dried at the speed of 1-5 m / min at the temperature of 180-200 DEG C, so that residual solvents are completely removed; and the copper foil is rolled into a roll-shaped product for subsequent imidization. According to the drying method, most parts are dried while coating is conducted, and complete drying is not needed so that the advancing speed of the product on a coating line can be increased, the coating efficiency is greatly improved, energy consumption is reduced, the requirements for coating equipment are relatively low, and the cost is greatly reduced; due to the fact that most solvents are removed, serious volume shrinkage in the subsequent process can be avoided, and deformation of the copper foil is avoided. The copper foil is dried again on the high-tension drying cylinder, and the copper-clad plate is tightly attached to the surface of the drying cylinder in a wrapping mode, so that the drying efficiency is improved, crimpy deformation and stripping of the copper foil are well prevented, and the copper-clad plate which is high in dimension stability can be obtained easily after subsequent imidization.

Description

technical field [0001] The invention relates to the field of flexible printed circuit boards, in particular to a drying method for preparing flexible non-adhesive copper-clad boards by a two-layer method. Background technique [0002] With its unique interconnection characteristics, polyimide copper clad laminates are widely used in telecommunications, computers, automobiles and other fields. The global annual growth rate continues to grow at 10% to 15%. In 2013, the global consumption exceeded 1.5 billion US dollars. Currently, glued polyimide copper-clad laminates are limited in application because of their poor flexibility, heat resistance, and poor dimensional stability. Compared with the traditional glued polyimide copper clad laminate, the heat resistance of the glueless polyimide copper clad laminate is greatly improved, the life of the flexing area is greatly improved, and the flexible and rigid board realizes high-density interconnection, which greatly improves the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D3/02C08G73/10
CPCB05D3/0209B05D3/0254B05D2202/45B05D2505/50C08G73/1085
Inventor 吴艳王绍亮张志立郭磊罗海燕
Owner SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD