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Bisphenol-A glycidyl-ester type epoxy resin and preparing method thereof

A glycidyl ester, epoxy resin technology, applied in the chemical industry, can solve the problems of poor toughness and heat resistance, and achieve the effects of improving heat resistance, easy use, improving toughness and adhesion

Inactive Publication Date: 2016-05-04
ANHUI MEIDONG BIOLOGICAL MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of bisphenol glycidyl ester type epoxy resin and preparation method thereof, described this bisphenol glycidyl ester type epoxy resin and preparation method thereof will solve the problem of glycidyl ester in the prior art The technical problem of poor toughness and heat resistance of type epoxy resin

Method used

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  • Bisphenol-A glycidyl-ester type epoxy resin and preparing method thereof
  • Bisphenol-A glycidyl-ester type epoxy resin and preparing method thereof
  • Bisphenol-A glycidyl-ester type epoxy resin and preparing method thereof

Examples

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Embodiment 1

[0017] Add 228 grams of bisphenol A and 120 grams of sodium hydroxide solid in the autoclave, 2000 mL of n-butanol as a solvent, stir and heat up to 60 ° C, then slowly add 95 grams of chloroacetic acid dropwise within 30 minutes, after the addition is completed, React at 60°C for 4 hours, add hydrochloric acid to acidify to pH = 7, then wash with 1000 g of water and 5000 mL of dichloroethane, let stand to separate layers, and divide to obtain the organic phase. Vacuumize at 80°C for 4 hours to obtain bisphenol-based monobasic acid, then stir and mix the cardanol monobasic acid with 500 grams of epichlorohydrin and cool to 60°C, slowly add 160 grams of 50% aqueous sodium hydroxide solution dropwise, 100 React at ℃ for 3 hours, wash and extract with water, remove water and excess reagents, and obtain bisphenol glycidyl ester type epoxy resin. Epoxy value 0.37, viscosity 20000CPS and MD650 board, mold thickness 50 microns, toughness 1mm, adhesion level 1, hardness HB, heat resis...

Embodiment 2

[0019] Add 228 grams of bisphenol A and 120 grams of solid sodium hydroxide into the autoclave, 2000 mL of ethanol as the solvent, stir and heat up to 60°C, then slowly add 114 grams of chloroacetic acid dropwise within 30 minutes, and the dropwise temperature is 80°C React for 4 hours, add hydrochloric acid to acidify to pH = 7, then add 1000 g of water, wash with 5000 mL of dichloroethane, let stand to separate layers, and split to get the organic phase. Vacuumize at 80°C for 4 hours to obtain bisphenol-based monobasic acid, then stir and mix the bisphenol-based monobasic acid with 600 grams of epichlorohydrin and cool to 60°C, slowly add 180 grams of 50% aqueous sodium hydroxide solution dropwise, 100 React at ℃ for 3 hours, wash and extract with water, remove water and excess reagents, and obtain bisphenol glycidyl ester type epoxy resin. Epoxy value 0.35 Viscosity: 26000CPS, and MD650 plate, mold thickness 50 microns, toughness 1mm, adhesion level 1, hardness HB, heat res...

Embodiment 3

[0021] Add 228 grams of bisphenol A and 80 grams of sodium hydroxide solid in the autoclave, 2000 mL of propanol as a solvent, stir and heat up to 60 ° C, then slowly add 95 grams of chloroacetic acid dropwise within 30 minutes, and drop it at 60 React at ℃ for 4 hours, add hydrochloric acid to acidify to pH = 7, then add 1000 g of water, wash with 5000 mL of dichloroethane, let stand to separate the layers, and split to get the organic phase. Vacuumize at 100°C for 4 hours to obtain bisphenol-based monobasic acid, then stir and mix the bisphenol-based monobasic acid with 1000 grams of epichlorohydrin and cool down to 60°C, slowly add 250 grams of 50% aqueous sodium hydroxide solution dropwise, 100 React at ℃ for 3 hours, wash and extract with water, remove water and excess reagents, and obtain bisphenol glycidyl ester type epoxy resin. Epoxy value 0.40, viscosity: 15500CPS and MD650 board, mold thickness 50 microns, toughness 1mm, adhesion level 1, hardness HB, heat resistanc...

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Abstract

The invention provides a bisphenol-A glycidyl-ester type epoxy resin. The structural formula is shown in the specification. The invention further provides a preparing method of the bisphenol-A glycidyl-ester type epoxy resin. The preparing method includes the steps that bisphenol A and sodium hydroxide solid are added into a reaction kettle, fatty alcohol serves as a solvent, stirring and temperature rising are carried out, then haloacetic acid is added, the mixture is reacted, acidized, washed and layered in a standing mode, and an organic phase is taken in a liquid-separating mode; bisphenol monobasic acid is obtained in a vacuumizing mode; the bisphenol monobasic acid and epoxy chloropropane are stirred and mixed, a sodium hydroxide aqueous solution is added to be reacted, and washing, extracting and vacuumizing are carried out, and the bisphenol glycidyl-ester type epoxy resin is obtained. By means of the bisphenol-A glycidyl-ester type epoxy resin and the preparing method, toughness is improved, adhesive force is increased, and meanwhile quite good heat resistance is achieved.

Description

technical field [0001] The invention belongs to the field of chemical industry and relates to an epoxy resin, in particular to a bisphenol A glycidyl ester type epoxy resin and a preparation method thereof. Background technique [0002] Glycidyl ester epoxy resins in the prior art are synthesized from acid anhydride and epichlorohydrin or synthesized from phthalic anhydride, water, and epichlorohydrin under the action of sodium hydroxide. In the prior art, glycidyl ester type epoxy resin and curing agent (MD650 produced by Shanghai Meidong Biomaterials Co., Ltd.) are used to make boards. The mold thickness is 50 microns, the toughness is 4mm, the adhesion is grade 3, the hardness is HB, and the heat resistance is 80°C. . Contents of the invention [0003] The object of the present invention is to provide a kind of bisphenol glycidyl ester type epoxy resin and preparation method thereof, described this bisphenol glycidyl ester type epoxy resin and preparation method thereo...

Claims

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Application Information

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IPC IPC(8): C08G59/24C07D303/16C07D301/00
CPCC07D301/00C07D303/16C08G59/245
Inventor 宋学良毕丽杰
Owner ANHUI MEIDONG BIOLOGICAL MATERIAL
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