Preparation method for crystallizer copper plate coated with nickel-cobalt alloy layer

A crystallizer copper plate, nickel-cobalt alloy technology, applied in the field of electroplating, can solve the problems of long production cycle, internal stress accumulation of coating, coating peeling off, etc., and achieve the effect of high thermal conductivity

Active Publication Date: 2016-05-11
慈溪市万金电子元件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of continuous casting technology, copper plate electroplating technology develops rapidly: the coating material develops from simple metal to alloy material, from chromium to nickel to nickel-iron, nickel-cobalt alloy, and the coating form develops from composite layer to single layer. This functional electroplating Different from ordinary electroplating, the coating is relatively thick, usually with a thickness of 0.2mm-2mm, which inevitably leads to a large accumulation of i

Method used

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Examples

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Comparison scheme
Effect test

Embodiment 1

[0012] A method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer, the composition of the crystallizer copper plate is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn : 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer , the composition of the plating bath that described electroplating adopts is: nickel sulfate 220g / l, nickel chloride 19g / l, cobalt sulfate 5.5g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, Sodium lauryl sulfate 0.2g / l, additive 22ml / L, wherein adding is to adopt 10g sodium gluconate, 37g ascorbic acid and 22g dextrin add the solution prepared in 11 water, described process condition is: pH value 2.3-3.5, Current density 4-5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.3mm.

Embodiment 2

[0014] A method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer, the composition of the crystallizer copper plate is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn : 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer, The composition of the plating solution that described electroplating adopts is: nickel sulfate 240g / l, nickel chloride 17g / l, cobalt sulfate 6.5g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, ten Dialkyl sodium sulphate 0.4g / l, additive 20ml / L, wherein adding is to adopt 12g sodium gluconate, 33g ascorbic acid and 26g dextrin add the solution prepared in 11 water, described technological condition is: pH value 2.3-3.5, electric current Density 4-5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.5mm.

Embodiment 3

[0016] A method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer, the composition of the crystallizer copper plate is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn : 1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer, The composition of the plating solution that described electroplating adopts is: nickel sulfate 230g / l, nickel chloride 18g / l, cobalt sulfate 6.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, ten Dialkyl sodium sulfate 0.3g / l, additive 21ml / L, wherein adding is to adopt 11g sodium gluconate, 34g ascorbic acid and 24g dextrin add the solution prepared in 11 water, described technological condition is: pH value 2.3-3.5, electric current Density 4-5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.4mm....

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Abstract

The invention discloses a preparation method for a crystallizer copper plate coated with a nickel-cobalt alloy layer. The crystallizer copper plate is composed of, by mass, 1%-2% of Ni, 0.05%-0.2% of Be, 0.5%-0.7% of Al, 3.0%-5.0% of Zr, 1.2%-1.4% of Mn, 1%-3% of Mg, 0.8%-1.2% of Cr, 14.0%-16.0% of Zn and the balance Cu. The preparation method comprises the steps that a crystallizer is prepared from copper alloy comprising the components, and a coated layer is electroplated on the surface of the crystallizer. A plating solution adopted by electroplating is composed of 220-240 g/l of nickel sulfate, 17-19 g/l of nickel chloride, 5.5-6.5 g/l of cobalt sulfate, 23-27 g/l of boric acid, 5-7 g/l of potassium sulfate, 30-40 g/l of sodium chloride, 0.2-0.4 g/l of lauryl sodium sulfate and 20-22 ml/L of an additive, and the additive is a solution prepared by adding 10-12 g of sodium gluconate, 33-37 g of ascorbic acid and 22-26 g of dextrin into one liter of water. The conditions for an electroplating process are as follows, the PH value is 2.3-3.5, the electric current density is 4-5 A/dm<2>, the temperature is 44 DEG C-46 DEG C, and electroplating is conducted till the plating layer thickness reaches 1.3-1.5 mm.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer. Background technique [0002] The mold copper plate is an important part of the continuous casting machine. The molten steel flows through the mold of the continuous casting machine and is cooled to form a billet. In the continuous casting and drawing production process, the surface of the billet and the copper plate are in contact with each other to cause friction, and the surface of the copper plate is worn. Usually, a layer of material with good thermal conductivity and wear resistance is plated on the surface by functional electroplating technology to achieve lightening of the surface of the copper plate. The purpose of reducing wear, increasing the number of copper plate repairs, and prolonging the service life of the copper plate. With the development of continuous casting te...

Claims

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Application Information

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IPC IPC(8): B22D11/057C25D3/56C22C9/04
CPCB22D11/057C22C9/04C25D3/562
Inventor 张颖
Owner 慈溪市万金电子元件有限公司
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