Preparation method for crystallizer copper plate coated with nickel-cobalt alloy layer
A crystallizer copper plate, nickel-cobalt alloy technology, applied in the field of electroplating, can solve the problems of long production cycle, internal stress accumulation of coating, coating peeling off, etc., and achieve the effect of high thermal conductivity
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Embodiment 1
[0012] A method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer, the composition of the crystallizer copper plate is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn : 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer , the composition of the plating bath that described electroplating adopts is: nickel sulfate 220g / l, nickel chloride 19g / l, cobalt sulfate 5.5g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, Sodium lauryl sulfate 0.2g / l, additive 22ml / L, wherein adding is to adopt 10g sodium gluconate, 37g ascorbic acid and 22g dextrin add the solution prepared in 11 water, described process condition is: pH value 2.3-3.5, Current density 4-5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.3mm.
Embodiment 2
[0014] A method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer, the composition of the crystallizer copper plate is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn : 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer, The composition of the plating solution that described electroplating adopts is: nickel sulfate 240g / l, nickel chloride 17g / l, cobalt sulfate 6.5g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, ten Dialkyl sodium sulphate 0.4g / l, additive 20ml / L, wherein adding is to adopt 12g sodium gluconate, 33g ascorbic acid and 26g dextrin add the solution prepared in 11 water, described technological condition is: pH value 2.3-3.5, electric current Density 4-5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.5mm.
Embodiment 3
[0016] A method for preparing a crystallizer copper plate coated with a nickel-cobalt alloy layer, the composition of the crystallizer copper plate is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn : 1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer using a copper alloy with the above composition, and electroplating a coating layer on the surface of the crystallizer, The composition of the plating solution that described electroplating adopts is: nickel sulfate 230g / l, nickel chloride 18g / l, cobalt sulfate 6.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, ten Dialkyl sodium sulfate 0.3g / l, additive 21ml / L, wherein adding is to adopt 11g sodium gluconate, 34g ascorbic acid and 24g dextrin add the solution prepared in 11 water, described technological condition is: pH value 2.3-3.5, electric current Density 4-5A / dm 2 , temperature 44-46 ℃, electroplating until the thickness of the coating is 1.4mm....
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