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Anisotropic conductive adhesive and preparation method thereof

An anisotropic, conductive adhesive technology, applied in the field of conductive adhesives, can solve the problems of fragile joints, poor fluidity of conductive adhesives, and unstable electrical conductivity, and achieve the effect of increasing electrical conductivity and good electrical conductivity.

Active Publication Date: 2016-05-11
JIANG SU YOUNG KING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of poor fluidity, large conduction resistance, weak and damaged contacts, poor electromagnetic wave shielding effect, and unsteady conductivity in existing conductive adhesives, the present invention provides an anisotropic conductive adhesive and a preparation method thereof. The conductive adhesive includes an insulating substrate, conductive particles and silver-plated fibers, and the insulating substrate is composed of n-butyl methacrylate, styrene monomer, hydroxypropyl methacrylate and ethylene glycol dimethacrylate

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  • Anisotropic conductive adhesive and preparation method thereof

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Embodiment 1

[0032] An anisotropic conductive adhesive, the mass fraction of each component is: n-butyl methacrylate 15%, styrene monomer 9%, hydroxypropyl methacrylate 11%, ethylene glycol dimethacrylate 9% %, conductive particles 35%, silver-plated fibers 21%; conductive particles are copper-plated silver spherical conductive particles, the particle size distribution is within the range of 30-50nm, and the density distribution is 1.5-2.5g / cm 3 within range. In this embodiment, the diameter of the silver-plated fiber is 5-8 μm, the length is 10-20 μm, and the density is 1-2 g / cm 3 .

[0033] The preparation method of conductive glue in the present embodiment is:

[0034] (1) Stirring n-butyl methacrylate and styrene monomer at 60°C (using a DC high-speed mixer at a speed of 1000 rpm) for 1 hour in proportion to obtain a mixture X1;

[0035] (2) Stir hydroxypropyl methacrylate and ethylene glycol dimethacrylate in proportion at 60°C (using a DC high-speed mixer at a speed of 500rpm) for...

Embodiment 2

[0042] An anisotropic conductive adhesive, the mass fraction of each component is: n-butyl methacrylate 10%, styrene monomer 8%, hydroxypropyl methacrylate 10%, ethylene glycol dimethacrylate 15% %, conductive particles 30%, silver-plated fibers 27%; conductive particles are copper-plated silver ball conductive particles, the particle size distribution is in the range of 40-70nm, and the density distribution is 2-3g / cm 3 within range. In this embodiment, the diameter of the silver-plated fiber is 7-10 μm, the length is 15-30 μm, and the density is 1-2g / cm 3 .

[0043] The preparation method of conductive glue in the present embodiment is:

[0044] (1) Stirring n-butyl methacrylate and styrene monomer at 55°C (using a DC high-speed mixer at a speed of 800 rpm) for 1.5 hours in proportion to obtain a mixture X1;

[0045] (2) Stir hydroxypropyl methacrylate and ethylene glycol dimethacrylate in proportion at 55°C (using a DC high-speed mixer at a speed of 600rpm) for 0.5h to o...

Embodiment 3

[0052] An anisotropic conductive adhesive, the mass fraction of each component is: 12% of n-butyl methacrylate, 15% of styrene monomer, 20% of hydroxypropyl methacrylate, 8% of ethylene glycol dimethacrylate %, conductive particles 25%, silver-plated fibers 20%; conductive particles are copper-plated silver ball conductive particles, the particle size distribution is in the range of 30-70nm, and the density distribution is 1.5-3g / cm 3 within range. In this embodiment, the diameter of the silver-plated fiber is 5-10 μm, the length is 10-30 μm, and the density is 1-2g / cm 3 .

[0053] The preparation method of conductive glue in the present embodiment is:

[0054] (1) Stirring n-butyl methacrylate and styrene monomer at 70°C (using a DC high-speed mixer at a speed of 900rpm) for 0.8h in proportion to obtain a mixture X1;

[0055] (2) Stir hydroxypropyl methacrylate and ethylene glycol dimethacrylate in proportion at 70°C (using a DC high-speed mixer at a speed of 400rpm) for 0...

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Abstract

The invention discloses an anisotropic conductive adhesive and a preparation method thereof, and belongs to the technical field of conductive adhesives. The conductive adhesive comprises an insulation base material, a conductive particle and silver-plated fiber. The insulation base material is composed of n-butyl methacrylate, styrene monomer, hydroxypropyl methacrylate and ethylene glycol dimethacrylate. The conductive adhesive is prepared from, by mass, 10-15% of n-butyl methacrylate, 8-15% of styrene monomer, 10-20% of hydroxypropyl methacrylate, 8-15% of ethylene glycol dimethacrylate and 25-35% of the conductive particle. The conductive particle is the copper-plated silver ball conductive particle. The conductive adhesive has the advantages of being good in flexibility, stable in conductive performance, good in electromagnetic wave shielding effect and the like, and is applicable to connection of a light, thin, short and small driving IC and a substrate.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesives, and more specifically relates to an anisotropic conductive adhesive and a preparation method thereof. Background technique [0002] Soldering is the most commonly used physical connection between different electronic components, mainly using a lead-tin alloy with a lower melting point as solder, which melts the solder instantly under appropriate heating to contact the pins of the two electronic components. When the heat is removed , the solder can solidify and firmly connect the two electronic components. Another way is to use a high-temperature tin furnace to place the electronic components of Surface-mount technology (SMT) on the electrical circuit with solder in advance, and then after the high-temperature furnace is heated and cooled instantaneously, the solder can connect all electronic components. components. However, the traditional tin-lead reflow process cannot be applied ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J9/02C09J4/02C09J4/00C09J11/04
CPCC09J4/00C09J7/20C09J9/02C09J11/04C09J2433/006
Inventor 杨宜丰张志伟余逸群
Owner JIANG SU YOUNG KING ELECTRONICS
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