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Electrochemical method for preparing super-hydrophobic surface of copper dendritic crystal

A super-hydrophobic surface and electrochemical technology, which is applied in the electrochemical field of preparing copper dendrite super-hydrophobic surface, can solve the problems of less research on super-hydrophobic surfaces, and achieve the effects of short preparation time, stable super-hydrophobic performance, and simple methods

Inactive Publication Date: 2016-05-11
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, although the relevant literature on the preparation of metal dendrite structures by electrodeposition methods has gradually increased, there are very few successful cases in which researchers have applied dendrite structures to the field of superphobicity in the prior art, and most of them are in the research stage. There have also been a small number of reports of metal dendritic structures on super-thin surfaces. For example, Wang et al. deposited metal gold on silicon wafers by exchange reaction technology, and obtained dendritic micro / nano double-layer rough structures. The surface was treated with dodecane After thiol modification, it becomes superhydrophobic
However, there are still few reports on super-phobic surfaces with copper dendrite structures that are widely used in industry, and there are even fewer related studies on the preparation of super-phobic surfaces with copper dendrites by electrodeposition.

Method used

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  • Electrochemical method for preparing super-hydrophobic surface of copper dendritic crystal
  • Electrochemical method for preparing super-hydrophobic surface of copper dendritic crystal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Step 1. Slowly add 2.78ml of concentrated sulfuric acid to distilled water, then dissolve 3.75g of copper sulfate crystals in the solution, set the volume to 100mL, and stir well to obtain a copper sulfate concentration of 0.15mol / L and a sulfuric acid concentration of 0.5 mol / L solution A;

[0026] Step 2. Dissolve 2.28 g of myristic acid in absolute ethanol, set the volume to 100 mL, and stir evenly to obtain a solution B with a concentration of myristic acid of 0.1 mol / L;

[0027] Step 3: Polish two copper substrates with a size of 50mm×25mm×1.5mm with water sandpaper to remove the oxide layer on the surface of the copper substrate, then rinse the polished two copper substrates with distilled water and absolute ethanol in turn, blow dry for use;

[0028] Step 4. Put the solution A described in step 1 in the electrolytic cell as the electrolyte, insert the two copper substrates dried in step 3 into the electrolyte, and use them as the positive and negative poles of t...

Embodiment 2

[0032] Step 1. Slowly add 2.78ml of concentrated sulfuric acid to distilled water, then dissolve 3.75g of copper sulfate crystals in the solution, set the volume to 100mL, and stir well to obtain a copper sulfate concentration of 0.15mol / L and a sulfuric acid concentration of 0.5 mol / L solution A;

[0033] Step 2. Dissolve 2.28 g of myristic acid in absolute ethanol, set the volume to 100 mL, and stir evenly to obtain a solution B with a concentration of myristic acid of 0.1 mol / L;

[0034] Step 3: Polish two copper substrates with a size of 50mm×25mm×1.5mm with water sandpaper to remove the oxide layer on the surface of the copper substrate, then rinse the polished two copper substrates with distilled water and absolute ethanol in turn, blow dry for use;

[0035] Step 4. Put the solution A described in step 1 in the electrolytic cell as the electrolyte, insert the two copper substrates dried in step 3 into the electrolyte, and use them as the positive and negative poles of t...

Embodiment 3

[0039] Step 1. Slowly add 16.68ml of concentrated sulfuric acid to distilled water, then dissolve 0.25g of copper sulfate crystals in the solution, set the volume to 100mL, and stir well to obtain a copper sulfate concentration of 0.01mol / L and a sulfuric acid concentration of 3mol / L solution A;

[0040] Step 2. Dissolve 1.14 g of myristic acid in absolute ethanol, set the volume to 100 mL, and stir evenly to obtain a solution B with a concentration of myristic acid of 0.05 mol / L;

[0041] Step 3: Polish two copper substrates with a size of 50mm×25mm×1.5mm with water sandpaper to remove the oxide layer on the surface of the copper substrate, then rinse the polished two copper substrates with distilled water and absolute ethanol in turn, blow dry for use;

[0042]Step 4. Put the solution A described in step 1 in the electrolytic cell as the electrolyte, insert the two copper substrates dried in step 3 into the electrolyte, and use them as the positive and negative poles of th...

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Abstract

The invention discloses an electrochemical method for preparing a super-hydrophobic surface of a copper dendritic crystal. The method comprises the following steps: (1) concentrated sulfuric acid is slowly added in distilled water; and then, a copper sulfate crystal is dissolved in the solution for uniformly stirring to prepare solution A; (2) myristic acid is dissolved in anhydrous ethanol to obtain solution B; (3) oxide layers on the surfaces of two copper substrates are removed, are cleaned by distilled water and anhydrous ethanol in sequence, and are dried for future use; (4) the solution A is put in an electrolytic cell as electrolyte; and the dried two copper substrates are respectively used as an anode and a cathode for electrolysis; and (5) the electrolyzed cathode copper substrate is cleaned by the distilled water and the anhydrous ethanol in sequence; then, the surface of the cleaned cathode copper substrateis uniformly coated by the solution Bfor airing; and then, the surface is lightly wiped by sponge to obtain the super-hydrophobic surface. The super-hydrophobic surface, prepared on the copper substrate by the method, has a contact angle being 152 degrees or above, and keeps stable super-hydrophobic performance after one-year placement under conventional conditions.

Description

technical field [0001] The invention belongs to the technical field of preparation of hydrophobic surface materials, and in particular relates to an electrochemical method for preparing a superhydrophobic surface of copper dendrites. Background technique [0002] Superhydrophobic is a special phenomenon of solid surfaces, which mainly depends on the chemical composition and microstructure. Generally, superhydrophobic surfaces are constructed by modifying low surface energy substances on rough surfaces or constructing rough structures on the surface of hydrophobic materials. Recent studies have shown that metal surfaces with superhydrophobic properties have potential applications in self-cleaning, anti-oxidation, anti-corrosion, flow drag reduction, and non-destructive transport of microfluidics. [0003] With the in-depth study of superhydrophobic surfaces, many preparation methods are emerging, such as electrodeposition, chemical vapor deposition, plasma etching, anodic oxi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 郝丽梅闫小乐解忧张涛左瑜杰
Owner XIAN UNIV OF SCI & TECH
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