Breaking process for electroplating wastewater complex

Abstract

The invention discloses a breaking process for an electroplating wastewater complex. The breaking process comprises the following steps: step 1, electroplating wastewater is collected; step 2, a strong acid solution is added to the electroplating wastewater, and the pH value of the electroplating wastewater is regulated to be lower than 2.5; step 3, a strong oxidizing agent is added to the electroplating wastewater for coagulating sedimentation; step 4, the coagulating sedimentation is subjected to continuous aeration for 4 hours; step 5, an alkaline solution and a coagulant aid PAM (polyacrylamide) are added to the electroplating wastewater, the pH value of the electroplating wastewater is regulated to 11, a hydroxide precipitate is formed in the electroplating wastewater and is removed, and the electroplating wastewater can meet the emission standard. The breaking process has the advantages that the metal complex can be broken effectively, metal is released from the complex, the breaking efficiency is increased, the treatment cost is reduced, and the electroplating wastewater can meet the emission standard more easily.

Description

technical field [0001] The invention belongs to the technical field of environmental protection, relates to waste water treatment and resource recycling technologies, and in particular to a process for removing complexes from electroplating waste water. Background technique [0002] Electroplating is the process of plating various metals on the surface of metal or other materials by chemical and electrochemical methods. Electroplating technology is widely used in machine manufacturing, light industry, electronics and other industries. The water quality and quantity of electroplating wastewater are related to the process conditions of electroplating production, production load, operation management and water use methods and other factors. The water quality of electroplating wastewater is complex and its composition is difficult to control. It contains heavy metal ions such as chromium, cadmium, nickel, copper, zinc, gold, silver, and cyanide, and some of them are highly toxi...

AI Technical Summary

Problems solved by technology

In the existing electroplating process, a large amount of organic additives are added, which form organometallic complexes with metal ions. In the process of wastewater treatment, the metals in the complexes cannot be combined with OH - Combined with the formation of hydroxide precipitation and removal, the metal ions remain in the wastewater. Therefore, it is difficult to discharge the metal ions of the electroplating wastewater up to the standard by the ordinary coagulation sedimentation method.

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