A metal-based superhard composite material and its preparation method

Abstract

The invention discloses a metal based superhard composite and belongs to the field of superhard composites. The metal based superhard composite is prepared from the following raw materials in percentage by weight: 20-68.8 percent of nano metal powder, 30-75 percent of coated diamond or / and coated cubic boron nitride powder and 0.2-5 percent of a wetting agent. The invention also discloses a preparation method of the metal based superhard composite. The preparation method comprises the following steps: mixing the nano metal powder, the superhard material powder and the wetting agent, and cold pressing to form a green body; and placing the green body in a vacuum or reducing atmosphere, and sintering, wherein the sintering temperature is higher than the melting point of the nano metal powder and lower than the inactive temperature of the superhard material. According to the metal based superhard composite prepared by the preparation method, the size proportion of the superhard material and metal can be accurately controlled, and thus thermophysical characteristic of the prepared metal based superhard composite can be accurately controlled, the production process is rapid, and equipment is simple; and meanwhile, the diamond or cBN breaking rate is lowered by adopting the coated superhard material.

Description

technical field [0001] The invention belongs to the field of superhard composite materials, and in particular relates to a preparation method of metal-based superhard composite materials. Background technique [0002] With the continuous development of my country's electronic technology, the requirements for electronic packaging materials continue to increase. As a new generation of electronic packaging materials, superhard material powder-reinforced metal matrix composites have been favored due to their excellent thermophysical properties and good mechanical properties. Widespread concern. [0003] The application of electronic packaging materials needs to consider two basic performance requirements. The first is high thermal conductivity to achieve rapid heat transfer and ensure that the chip can work stably under ideal temperature conditions; at the same time, the packaging material needs to have an adjustable coefficient of thermal expansion. , so as to maintain matching...

AI Technical Summary

Problems solved by technology

In the existing composite technology, the infiltration method is usually used to compound diamond in metal to prepare metal matrix composite materials. This method has the following disadvantages: firstly, the wettability of diamond and metal is extremely poor, and it is difficult to directly prepare dense composite materials. The graphitization of diamond and the impurity in artificial diamond cause diamond cracking at high temperature; secondly, the infiltration method is affected by factors such as particle size, infiltration temperature and time, and the production process is slow and the equipment is complicated; in addition, gas pressure melting is used Infiltration also has problems such as low pressure applied, and impurities in artificial diamonds causing diamond cracking at high temperatures, resulting in a decrease in high thermal conductivity.