Organosilicon bonding promoter for LED packaging high-refractive-index addition-type silica gel and preparation method and application of organosilicon bonding promoter

An adhesion promoter, LED packaging technology, applied in the direction of adhesives, polymer adhesive additives, adhesive additives, etc., can solve the problem of easy damage to the curing performance of silica gel, light transmittance and mechanical properties, high refractive index addition type packaging Solve the problems of poor compatibility of silica gel and large amount of addition, so as to achieve the effect of easy control of the reaction process, easy control, low mechanical properties and viscosity

Inactive Publication Date: 2016-06-29
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesion promoter has a large amount of addition, low refractive index, poor compatibility with high refractive ind...

Method used

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  • Organosilicon bonding promoter for LED packaging high-refractive-index addition-type silica gel and preparation method and application of organosilicon bonding promoter
  • Organosilicon bonding promoter for LED packaging high-refractive-index addition-type silica gel and preparation method and application of organosilicon bonding promoter
  • Organosilicon bonding promoter for LED packaging high-refractive-index addition-type silica gel and preparation method and application of organosilicon bonding promoter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The 55.93g molecular formula is HO(MePhSiO) 5 H's phenyl hydroxy silicone oil, 11.82g 3-(2,3-epoxypropoxy)propyltrimethoxysilane, 12.42g 3-methacryloxypropyltrimethoxysilane and 60g toluene were added with a thermometer, Mechanically stir and condense a 250mL three-neck flask with a reflux tube, stir evenly at room temperature, add 1.6g tetraisopropyl titanate, react at a temperature of 30°C for 8h, and then continue at a vacuum of 0.08MPa and a temperature of 80°C After reacting for 5 hours, adhesion promoter 1 was obtained with a refractive index of 1.529.

[0028] 100 parts by mass of vinyl phenyl silicone resin with a vinyl content of 4 wt%, 15 parts by mass of vinyl phenyl silicone oil with a viscosity of 500mPa·s, 30 parts by mass of phenyl hydrogen-containing silicone oil with an active hydrogen content of 0.45 wt%, 3 parts by mass of adhesion promoter 1 and 0.02 parts by mass of 1-ethynyl-1-cyclohexanol were mixed uniformly under the action of a high-speed mixe...

Embodiment 2

[0030] The molecular formula of 61.29g is HO(Ph 2 SiO) 3 H's phenyl hydroxy silicone oil, 11.14g 3-(2,3-glycidoxy)propyltriethoxysilane, 17.42g 3-methacryloxypropyltriethoxysilane and 150g xylene were added to the belt In a 500mL three-neck flask equipped with a thermometer, mechanical stirring and condensing reflux tube, stir evenly at room temperature, add 0.45g tetra-n-butyl titanate, react at a temperature of 50°C for 6h, and then vacuum at a degree of 0.06MPa and a temperature of 110 The reaction was continued for 3 hours at °C to obtain adhesion promoter 2 with a refractive index of 1.532.

[0031] 100 parts by mass of vinyl phenyl silicone resin with a vinyl content of 2 wt%, 6 parts by mass of vinyl phenyl silicone oil with a viscosity of 800mPa·s, 14 parts by mass of phenyl hydrogen-containing silicone oil with an active hydrogen content of 0.3 wt%, 2 parts by mass of adhesion promoter 2 and 0.01 parts by mass of 1-ethynyl-1-cyclohexanol were mixed uniformly under t...

Embodiment 3

[0033] The molecular formula of 143.92g is HO(MePhSiO) 4 (Ph 2 SiO) 2 H's phenyl hydroxy silicone oil, 19.71g2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 4.97g3-methacryloxypropyltrimethoxysilane and 350g toluene were added with A 1000mL three-necked flask with a thermometer, mechanical stirring and a condensing reflux tube was stirred evenly at room temperature. The reaction was continued for 2 hours to obtain adhesion promoter 3 with a refractive index of 1.538.

[0034]100 parts by mass of vinyl phenyl silicone resin with a vinyl content of 5 wt%, 30 parts by mass of vinyl phenyl silicone oil with a viscosity of 2000mPa·s, 25 parts by mass of phenyl hydrogen-containing silicone oil with an active hydrogen content of 0.6 wt%, 6 parts by mass of adhesion promoter 3 and 0.008 parts by mass of 1-ethynyl-1-cyclohexanol were mixed uniformly under the action of a high-speed disperser, and then 0.16 parts by mass of platinum-methylphenyl polysiloxane was added Mix the complex ...

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Abstract

The invention discloses an organosilicon bonding promoter for LED packaging high-refractive-index addition-type silica gel and a preparation method and application of the organosilicon bonding promoter.According to the preparation method, an organosilicon compound containing hydroxyl and phenyl, epoxy silane, ester silane and a solvent are stirred to be uniform at room temperature, a titanate catalyst is added, a reaction is performed at the temperature of 25-60 DEG C for 6-15 h and continued at the vacuum degree of 0.05-0.098 MPa and the temperature of 60-140 DEG C for 2-6 h, and then the high-refractive-index organosilicon bonding promoter containing epoxy and ester is prepared.The prepared bonding promoter is high in refractive index, compatibility with the LED packaging high-refractive-index addition-type silica gel is good, the bonding performance, particularly with polyphthalamide, poly-1,4-cyclohexylene dimethylene terephthalate and polycarbonate, of the silica gel can be remarkably improved, and the promoter can be widely applied to the field of LED device packaging.

Description

technical field [0001] The invention relates to the technical field of silicone packaging materials, in particular to a silicone adhesion promoter for LED packaging high refractive index addition type silica gel and a preparation method thereof. The silicone adhesion promoter is used for LED packaging high refractive index addition type. Molded in silicone. Background technique [0002] In order to improve the stability and reliability of LED devices, it is necessary to package and protect the devices from moisture, salt spray, dust, vibration and shock. When the addition-type encapsulation silica gel is cured, the amount of catalyst is less, no by-products are produced, it can be cured in deep layers, the linear shrinkage rate is low, and the electrical insulation performance is excellent. Especially the addition-type encapsulation silica gel with high refractive index can effectively improve the light extraction efficiency, which is high One of the performance packaging m...

Claims

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Application Information

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IPC IPC(8): C08G77/16C08G77/08C09J11/08C09J183/07
CPCC09J11/08C09J183/04C08G77/08C08G77/16C08L2205/035C08L2205/025C08L2203/206C08L83/04C08L83/06
Inventor 曾幸荣潘科学赖学军陈中华李红强
Owner SOUTH CHINA UNIV OF TECH
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